Abstract: A package structure is provided. The package structure includes a redistribution structure over a substrate, a semiconductor die over the redistribution structure and electrically coupled to the substrate, and an underfill material over the substrate and encapsulating the redistribution structure and the semiconductor die. The underfill material includes an extension portion overlapping a corner of the semiconductor die and extending into the substrate.

Abstract: Disclosed herein are device and method for performing a total internal reflection scattering (TIRS) measurement to a sample slide. The device comprises a first reflective plate having a first opening; a second reflective plate having second and third openings and disposed on top of the first reflective plate thereby forming a slot therebetween for accommodating the sample slide, wherein the first opening of the first reflective plate is disposed directly underneath the second opening of the second reflective plate; a white light source disposed in the space formed by the third opening of the second reflective plate and configured to emit a white light into the slot; and a first blackout layer disposed on top of the third opening thereby covering the white light source and keeping the emitted white light from leaking. When the sample slide is inserted into the slot, the white light source illuminates the sample slide so as to achieve the TIRS measurement to the sample slide.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a carrier substrate, an interposer substrate, a semiconductor device, a lid, and a thermal interface material. The interposer substrate is disposed on the carrier substrate. The semiconductor device is disposed on the interposer substrate. The lid is disposed on the carrier substrate to cover the semiconductor device. The thermal interface material is disposed between the lid and the semiconductor device. A first recess is formed on a lower surface of the lid facing the semiconductor device, and the first recess overlaps the semiconductor device in a top view.

Abstract: Provided herein are compounds according to Formula (I) or a pharmaceutically acceptable salt thereof, wherein R1, R2, R3, R5, and R7 are defined herein. Also provided herein are pharmaceutical compositions comprising a compound of Formula (I) as well as the use of such compounds as M4 receptor agonists.

Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.

Abstract: Disclosed herein are device and method for performing a total internal reflection scattering (TIRS) measurement to a sample slide. The device comprises a first reflective plate having a first opening; a second reflective plate having second and third openings and disposed on top of the first reflective plate thereby forming a slot therebetween for accommodating the sample slide, wherein the first opening of the first reflective plate is disposed directly underneath the second opening of the second reflective plate; a white light source disposed in the space formed by the third opening of the second reflective plate and configured to emit a white light into the slot; and a first blackout layer disposed on top of the third opening thereby covering the white light source and keeping the emitted white light from leaking. When the sample slide is inserted into the slot, the white light source illuminates the sample slide so as to achieve the TIRS measurement to the sample slide.

Abstract: The present invention is to provide a TV image conversion device for turning a computer on or off by means of a multimedia remote control. The TV image conversion device is electrically coupled to a computer enabling a user to operate a computer on-off switch on the multimedia remote control to turn the computer on or off wirelessly rather than walk to a computer to either turn the computer on or off by pressing an on/off switch on the computer. By utilizing this, the above drawback of incapable of turning a computer on or off by means of a remote control as experienced by the prior art can be overcome.