Abstract: A biocompatible magnetic material containing an iron oxide nanoparticle and one or more biocompatible polymers, each having formula (I) below, covalently bonded to the iron oxide nanoparticle: in which each of variables R, L, x, and y is defined herein, the biocompatible magnetic material contains 4-15% Fe(II) ions relative to the total iron ions. Also disclosed in a method of preparing the biocompatible magnetic material.

Abstract: A probe assembly includes a multilayer structure including probe contact pads, an upper guide plate including an array of upper holes therethrough, a lower guide plate including an array of lower holes therethrough, a vertical stack of a plurality of dielectric spacer plates located between the upper guide plate and the lower guide plate and including a respective opening therethrough, and an array of probes attached to the probe contact pads, vertically extending through the array of upper holes and the array of lower holes, and vertically extending through the openings through the vertical stack of the plurality of dielectric spacer plates.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor. The image sensor includes a deep trench isolation (DTI) structure disposed in a substrate. A pixel region of the substrate is disposed within an inner perimeter of the DTI structure. A photodetector is disposed in the pixel region of the substrate. A gate electrode structure overlies, at least partially, the pixel region of the substrate. A first gate dielectric structure partially overlies the pixel region of the substrate. A second gate dielectric structure partially overlies the pixel region of the substrate. The gate electrode structure overlies both a portion of the first gate dielectric structure and a portion of the second gate dielectric structure. The first gate dielectric structure has a first thickness. The second gate dielectric structure has a second thickness that is greater than the first thickness.

Abstract: A method for searching a path by using a 3D reconstructed map includes: receiving 3D point-cloud map information and 3D material map information; clustering the 3D point-cloud map information with a clustering algorithm to obtain clustering information, and identifying material attributes of objects in the 3D point-cloud map information with a material neural network model to obtain material attribute information; fusing the those map information based on their coordinate information, thereby outputting fused map information; identifying obstacle areas and non-obstacle areas in the fused map information based on an obstacle neural network model, the clustering information, and the material attribute information; and generating 3D path information according to the non-obstacle areas. Since the 3D path information is generated based on those map information, the obstacle areas and flight spaces are effectively determined to generate an accurate flight path.

Abstract: A semiconductor image sensing structure includes a substrate having a first region and a second region, a metal grid in the first region, and a hybrid metal shield in the second region. The hybrid metal shield includes a first metallization layer, a second metallization layer disposed over the first metallization layer, a third metallization layer disposed over the second metallization layer, and a fourth metallization layer disposed over the third metallization layer. An included angle of the second metallization layer is between approximately 40° and approximately 60°.

Abstract: A test apparatus includes a probe assembly, which includes: a multilayer structure including probe contact pads; an upper guide plate including an array of upper holes therethrough; a lower guide plate including an array of lower holes therethrough; a dielectric spacer plate located between the upper guide plate and the lower guide plate and including an opening; and an array of probes attached to the probe contact pads, vertically extending through the upper guide plate, the lower guide plate, and the dielectric spacer plate. The lower guide plate includes a downward-protruding portion having a first laterally-extending segment having a first width, and further includes a base portion overlying the downward-protruding portion and having a wider second width. The downward-protruding portion can be used to protect the array of probes while probing test pads on a wafer that are exposed between neighboring semiconductor dies.

Abstract: A probe assembly includes a multilayer structure including probe contact pads, an upper guide plate including an array of upper holes therethrough, a lower guide plate including an array of lower holes therethrough, a vertical stack of a plurality of dielectric spacer plates located between the upper guide plate and the lower guide plate and including a respective opening therethrough, and an array of probes attached to the probe contact pads, vertically extending through the array of upper holes and the array of lower holes, and vertically extending through the openings through the vertical stack of the plurality of dielectric spacer plates.

Abstract: A method for detecting a contact force of a probe card is provided. The method includes contacting a pressure film sensor with a plurality of needles over a lower surface of the probe card. The method includes detecting the contact force of the probe card via the pressure film sensor. The method also includes adjusting a position of a push base over an upper surface of the probe card based on the detected contact force of the pressure film sensor.

Abstract: An apparatus is provided. The apparatus includes a stage and a plate disposed on the stage. The apparatus further includes a pressure film sensor that is formed on the plate and configured to detect a contact force between a plurality of needles on a probe head of a probe card and the pressure film sensor. The apparatus still includes a distance detector that is configured to detect a distance between the pressure film sensor and the needles. In addition, the apparatus includes an adjustment driver that is configured to adjust the probe card based on the detected contact force of the pressure film sensor.

Abstract: The convertible child high-chair and step stool can include a frame having a front leg stand and a rear leg stand. A height adjustment mechanism can be coupled to the front leg stand or the rear leg stand and can be adjustable along the vertical axis of the front leg stand or the rear leg stand from a raised position to a lowered position. The apparatus can also include a booster seat and removable platform step. In the raised position, the booster seat can be coupled to the height adjustment mechanism to provide a high chair. In the lowered position, the booster seat can be removed and the removable platform step can be coupled to the height adjustment mechanism and the frame to provide a step stool. The apparatus can also include wheel assemblies coupled to the frame that limit the potential for tip hazards in the step stool configuration.

Abstract: The convertible child high-chair and step stool can include a frame having a front leg stand and a rear leg stand. A height adjustment mechanism can be coupled to the front leg stand or the rear leg stand and can be adjustable along the vertical axis of the front leg stand or the rear leg stand from a raised position to a lowered position. The apparatus can also include a booster seat and removable platform step. In the raised position, the booster seat can be coupled to the height adjustment mechanism to provide a high chair. In the lowered position, the booster seat can be removed and the removable platform step can be coupled to the height adjustment mechanism and the frame to provide a step stool. The apparatus can also include wheel assemblies coupled to the frame that limit the potential for tip hazards in the step stool configuration.

Abstract: An apparatus is provided. The apparatus includes a stage and a plate disposed on the stage. The apparatus further includes a pressure film sensor that is formed on the plate and configured to detect a contact force between a plurality of needles on a probe head of a probe card and the pressure film sensor. The apparatus still includes a distance detector that is configured to detect a distance between the pressure film sensor and the needles. In addition, the apparatus includes an adjustment driver that is configured to adjust the probe card based on the detected contact force of the pressure film sensor.

Abstract: A probe assembly includes a multilayer structure including probe contact pads, an upper guide plate including an array of upper holes therethrough, a lower guide plate including an array of lower holes therethrough, a vertical stack of a plurality of dielectric spacer plates located between the upper guide plate and the lower guide plate and including a respective opening therethrough, and an array of probes attached to the probe contact pads, vertically extending through the array of upper holes and the array of lower holes, and vertically extending through the openings through the vertical stack of the plurality of dielectric spacer plates.

Abstract: A method for retrieving a probe pin includes following operations. A probe head is received in a carrier. The probe head includes an upper die, a lower die, and at least a probe pin extending in a direction from the lower die to the upper die. A first bending delta between a probe tip of the probe pin and a pin tip of the probe pin is measured. The probe pin is bended by a bending fixture when the first bending delta is greater than a value to obtain a second bending delta between the pin tip and the pin head. The probe pin is pushed in the direction from the lower die tow the upper die by a plate. The probe pin is picked from the probe head by an arm.

Abstract: The convertible child high-chair and step stool can include a frame having a front leg stand and a rear leg stand. A height adjustment mechanism can be coupled to the front leg stand or the rear leg stand and can be adjustable along the vertical axis of the front leg stand or the rear leg stand from a raised position to a lowered position. The apparatus can also include a booster seat and removable platform step. In the raised position, the booster seat can be coupled to the height adjustment mechanism to provide a high chair. In the lowered position, the booster seat can be removed and the removable platform step can be coupled to the height adjustment mechanism and the frame to provide a step stool. The apparatus can also include wheel assemblies coupled to the frame that limit the potential for tip hazards in the step stool configuration.

Abstract: The convertible child high-chair and step stool can include a frame having a front leg stand and a rear leg stand. A height adjustment mechanism can be coupled to the front leg stand or the rear leg stand and can be adjustable along the vertical axis of the front leg stand or the rear leg stand from a raised position to a lowered position. The apparatus can also include a booster seat and removable platform step. In the raised position, the booster seat can be coupled to the height adjustment mechanism to provide a high chair. In the lowered position, the booster seat can be removed and the removable platform step can be coupled to the height adjustment mechanism and the frame to provide a step stool. The apparatus can also include wheel assemblies coupled to the frame that limit the potential for tip hazards in the step stool configuration.

Abstract: The convertible child high-chair and step stool can include a frame having a front leg stand and a rear leg stand. A height adjustment mechanism can be coupled to the front leg stand or the rear leg stand and can be adjustable along the vertical axis of the front leg stand or the rear leg stand from a raised position to a lowered position. The apparatus can also include a booster seat and removable platform step. In the raised position, the booster seat can be coupled to the height adjustment mechanism to provide a high chair. In the lowered position, the booster seat can be removed and the removable platform step can be coupled to the height adjustment mechanism and the frame to provide a step stool. The apparatus can also include wheel assemblies coupled to the frame that limit the potential for tip hazards in the step stool configuration.

Abstract: A probe head and methods of testing a device using a probe head are provided. The probe head includes a first end connected to a first substrate. The first substrate is configured to be connected to a test head. The probe head also includes second end having a first inner recess surrounded by a first protrusion and a first plurality of probe needles connected to the first protrusion.

Abstract: The convertible child high-chair and step stool can include a frame having a front leg stand and a rear leg stand. A height adjustment mechanism can be coupled to the front leg stand or the rear leg stand and can be adjustable along the vertical axis of the front leg stand or the rear leg stand from a raised position to a lowered position. The apparatus can also include a booster seat and removable platform step. In the raised position, the booster seat can be coupled to the height adjustment mechanism to provide a high chair. In the lowered position, the booster seat can be removed and the removable platform step can be coupled to the height adjustment mechanism and the frame to provide a step stool. The apparatus can also include wheel assemblies coupled to the frame that limit the potential for tip hazards in the step stool configuration.

Abstract: The convertible child high-chair and step stool can include a frame having a front leg stand and a rear leg stand. A height adjustment mechanism can be coupled to the front leg stand or the rear leg stand and can be adjustable along the vertical axis of the front leg stand or the rear leg stand from a raised position to a lowered position. The apparatus can also include a booster seat and removable platform step. In the raised position, the booster seat can be coupled to the height adjustment mechanism to provide a high chair. In the lowered position, the booster seat can be removed and the removable platform step can be coupled to the height adjustment mechanism and the frame to provide a step stool. The apparatus can also include wheel assemblies coupled to the frame that limit the potential for tip hazards in the step stool configuration.