Abstract: A sweep voltage generator and a display panel are provided. The sweep voltage generator includes an output node, a current generating block and a voltage regulating block. The output node is used to provide a sweep signal. The current generating block is coupled to the output node, includes a detection path for detecting an output load variation on the output node, and adjusts the sweep signal provided by the output node based on the output load variation. The voltage regulating block is coupled to the output node for regulating a voltage of the output node.

Abstract: A device includes an interposer, which includes a substrate having a top surface. An interconnect structure is formed over the top surface of the substrate, wherein the interconnect structure includes at least one dielectric layer, and metal features in the at least one dielectric layer. A plurality of through-substrate vias (TSVs) is in the substrate and electrically coupled to the interconnect structure. A first die is over and bonded onto the interposer. A second die is bonded onto the interposer, wherein the second die is under the interconnect structure.

Abstract: A chip packaging structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a dam and a metal shielding layer. The conductive substrate includes a substrate, vias and electrodes. The substrate has first and second board surfaces opposite to each other. The vias penetrate through the first board surface and the second board surface, and a part of the vias is disposed in a first die-bonding region on which a chip is to be arranged. The electrodes extend from the first board surface to the second board surface through the vias. The dam is formed on the first board surface to surround the first die-bonding region, and the dam has a height higher than that of the chip. The metal shielding layer covers the dam and a part of the first board surface that do not overlap with the electrodes.

Abstract: The present invention provides a dynamic automatic focus tracking system, comprising an image capturing device for capturing an image of a workpiece in a target picture-taking region; a driving device for adjusting a spacing between the image capturing device and the workpiece; and a focal length adjustment module coupled to the image capturing device and the driving device to generate a control signal according to a figure feature and a predefined figure feature in the image of the workpiece and send the control signal to the driving device, thereby adjusting a position of the image capturing device with the driving device.

Abstract: The present invention provides a dynamic automatic focus tracking system, comprising an image capturing device for capturing an image of a workpiece in a target picture-taking region; a driving device for adjusting a spacing between the image capturing device and the workpiece; and a focal length adjustment module coupled to the image capturing device and the driving device to generate a control signal according to a figure feature and a predefined figure feature in the image of the workpiece and send the control signal to the driving device, thereby adjusting a position of the image capturing device with the driving device.