Patents by Inventor Ming-Cheng Yang

Ming-Cheng Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190156984
    Abstract: A transformer structure includes an iron core and coils constituted by first, second, third and fourth windings, where the iron core has a first, second and middle flanges. The first flange is respectively configured with first and second terminal electrodes, the second flange third and fourth terminal electrodes, and the middle flange first and second center taps. The first winding is respectively in connection with the first terminal electrode and first center tap, the second winding the first center tap and third terminal electrode, the third winding the second terminal electrode and second center tap, and the fourth winding the second center tap and fourth terminal electrode. Whereby, the present invention can obviously increase the Hi-Pot safety distance of the transformer, and can thus have better high-pressure resistance.
    Type: Application
    Filed: November 22, 2017
    Publication date: May 23, 2019
    Inventors: MING-YEN HSIEH, HSIANG-CHUNG YANG, CHIN-CHENG LIN
  • Publication number: 20040140155
    Abstract: An apparatus for stabilizing a ladder. In one embodiment, the apparatus comprises a frame releasably attachable to the ladder, and one or more stabilizer arms extending from the frame. The apparatus may include one or more clamps rotatably disposed on the frame for securing the apparatus on the ladder, and the one or more clamps may be disposed in a fixed rotational relationship with the one or more stabilizer arms. The frame may comprise a first and second brace members disposed in mating engagement, and the first and second brace members may be adjustably securable to each other by releasable fasteners.
    Type: Application
    Filed: January 21, 2003
    Publication date: July 22, 2004
    Inventors: Ming Cheng Yang, Chi Chung Chen
  • Patent number: 6749484
    Abstract: A chemical mechanical polishing (CMP) apparatus with temperature control. The apparatus controls circular zone temperature of the wafer. The CMP apparatus comprises a platen; a carrier holding a wafer against the platen; a guide ring disposed at the rim of the carrier to mount the wafer on the carrier; and a heater disposed in the guide ring, in the carrier, or used to heat the slurry. The temperature of the heater is set between 20° C. and 60° C. Thus, the polishing rate at the edge is improved, and the polishing difference between the edge and the center of the wafer is reduced.
    Type: Grant
    Filed: May 16, 2002
    Date of Patent: June 15, 2004
    Assignee: ProMOS Technologies Inc.
    Inventors: Ming-Cheng Yang, Jiun-Fang Wang
  • Patent number: 6632742
    Abstract: A method for avoiding defects produced in The CMP process has the following steps: sequentially depositing a first dielectric layer and a second dielectric layer on a semiconductor substrate, wherein the wet-etching rate of the first dielectric layer is greater than the wet-etching rate of the second dielectric layer; forming a plurality of first holes on a plurality of the predetermined contact window areas respectively; wet etching the first dielectric layer in each of the first holes to form a plurality of second holes on the plurality of the predetermined contact window areas respectively; forming a conductive layer to fill each of the second holes; and performing the CMP process to level off the conductive layer and the second dielectric layer.
    Type: Grant
    Filed: April 18, 2001
    Date of Patent: October 14, 2003
    Assignee: ProMOS Technologies Inc.
    Inventors: Ming-Cheng Yang, Jiun-Fang Wang
  • Publication number: 20030190873
    Abstract: A chemical-mechanical polishing platform that comprises a polishing table, a wafer carrier, a polishing pad, a slurry supplier, a conditioner, and a means for cleaning the polishing pad. With respect to in-situ or ex-situ chemical-mechanical polishing, the wafer carrier, conditioner, and means for cleaning the polishing pad are adequately disposed above the polishing pad. The chemical-mechanical polishing is performed by rotation of the polishing pad; the region of the polishing pad that has polished the wafer then passes sequentially through the conditioner, the means for cleaning that removes diamond particles that may drop on the polishing pad, and through the slurry supplier that provides adequate slurry such that the polishing process can be repeated without scraping damage of the wafer. The means for cleaning of the present invention can have any shapes adapted to remove diamond particles on the polishing pad, such as circular or cylindrical brush sweeper.
    Type: Application
    Filed: April 9, 2001
    Publication date: October 9, 2003
    Inventors: Jiun-Fang Wang, Ming-Cheng Yang, Hao-Ming Lien, Sam Chou
  • Publication number: 20030143849
    Abstract: A method for avoiding defects produced in The CMP process has the following steps: sequentially depositing a first dielectric layer and a second dielectric layer on a semiconductor substrate, wherein the wet-etching rate of the first dielectric layer is greater than the wet-etching rate of the second dielectric layer; forming a plurality of first holes on a plurality of the predetermined contact window areas respectively; wet etching the first dielectric layer in each of the first holes to form a plurality of second holes on the plurality of the predetermined contact window areas respectively; forming a conductive layer to fill each of the second holes; and performing the CMP process to level off the conductive layer and the second dielectric layer.
    Type: Application
    Filed: March 24, 2003
    Publication date: July 31, 2003
    Applicant: ProMos Technologies Inc.
    Inventors: Ming-Cheng Yang, Jiun-Fang Wang
  • Publication number: 20030114077
    Abstract: A chemical mechanical polishing (CMP) apparatus with temperature control. The apparatus controls circular zone temperature of the wafer. The CMP apparatus comprises a platen; a carrier holding a wafer against the platen; a guide ring disposed at the rim of the carrier to mount the wafer on the carrier; and a heater disposed in the guide ring, in the carrier, or used to heat the slurry. The temperature of the heater is set between 20° C. and 60° C. Thus, the polishing rate at the edge is improved, and the polishing difference between the edge and the center of the wafer is reduced.
    Type: Application
    Filed: May 16, 2002
    Publication date: June 19, 2003
    Inventors: Ming-Cheng Yang, Jiun-Fang Wang
  • Patent number: 6514861
    Abstract: A semiconductor process for manufacturing a wafer. First, a previously predicted process rate and a previously measured process rate are provided by a process tool. Next, a presently predicted process rate is obtained by a first linear equation having a first variable weighting factor using the previously predicted process rate and the previously measured process rate as variables. Next, a process time is obtained according to the presently predicted process rate and a predetermined process target to input to the process tool. Finally, the wafer is manufactured according to the process time by the process tool.
    Type: Grant
    Filed: June 20, 2002
    Date of Patent: February 4, 2003
    Assignee: ProMOS Technologies Inc.
    Inventors: Ming-Cheng Yang, Jun-Yi Lee, Yun-Yu Chan, Sheng-Tsaing Tseng
  • Publication number: 20020155716
    Abstract: A method for avoiding defects produced in The CMP process has the following steps: sequentially depositing a first dielectric layer and a second dielectric layer on a semiconductor substrate, wherein the wet-etching rate of the first dielectric layer is greater than the wet-etching rate of the second dielectric layer; forming a plurality of first holes on a plurality of the predetermined contact window areas respectively; wet etching the first dielectric layer in each of the first holes to form a plurality of second holes on the plurality of the predetermined contact window areas respectively; forming a conductive layer to fill each of the second holes; and performing the CMP process to level off the conductive layer and the second dielectric layer.
    Type: Application
    Filed: April 18, 2001
    Publication date: October 24, 2002
    Inventors: Ming-Cheng Yang, Jiun-Fang Wang
  • Patent number: 6432728
    Abstract: A new method is provided for determining the optimum film thickness of a film that is to be deposited over a semiconductor surface. The invention observes the electrical current and the therefrom resulting torque that is supplied to a rotating part of a polishing apparatus, from this the CMP end-point can be determined for a reference film that has been deposited. This technique is known as the “CMP end-point detection” technique. The invention addresses observing CMP end-point curves for films of various thicknesses and compares these CMP end-point curves of one film thickness with each other and calculates a deviation for multiple layers (deposited on different wafers) of that film thickness. The process is repeated for different film thickness. The film thickness that has a deviation of the CMP end-point curve that closest resembles an optimum deviation is the film thickness that is selected as having the optimum thickness for the deposition of that film.
    Type: Grant
    Filed: October 16, 2000
    Date of Patent: August 13, 2002
    Assignee: ProMOS Technologies, Inc.
    Inventors: Shuo-Yen Tai, Ming-Cheng Yang, Jiun-Fang Wang, Champion Yi
  • Patent number: 6306022
    Abstract: A device for chemical-mechanical polishing. The device can be applied to a chemical polishing table spinning in a fixed direction and a polishing pad above of it. A chemical-mechanical polishing device according to the present invention is at least comprised of a main body of conditioner with a plurality of mounting pads, wherein each mounting pad is mounted with the diamond granules and located on the lower surface of conditioner, distributed on the rim of main body of each mounting pad. It can contact with polishing pads when cleaning the polishing pads and a number of cavities are across the upper and lower surfaces of each main body of conditioner and distributed between each mounting pads as well. When using the conditioners to clean out the polishing pads, the de-ionized water will flow through the cavities to wash off the acid or basic slurry to eliminate the destruction made by the solders around the diamond granules to extend the durability of the conditioner.
    Type: Grant
    Filed: June 2, 2000
    Date of Patent: October 23, 2001
    Assignees: Promos Technologies, Inc., Mosel Vitelic Inc., Infineon Technologies Inc.
    Inventors: Joseph Tung, Ming-Cheng Yang, Lung-Hu Lin, Jiun-Fang Wang
  • Patent number: 6153116
    Abstract: A method of monitoring the state of chemical-mechanical polishing that can be applied to the polishing of a metallic layer over a substrate. The method includes performing a series of scanning operations while a wafer is being polished to generate multiple reflectance line spectra in each polishing period. The degree of dispersion of the reflectance spectra is then utilized as a polishing index. In this invention, the standard deviation of the reflectance spectra in each period is used as a monitoring index, and the peak value of the standard deviation is used to determine the polishing end point. Surface uniformity is monitored by using the time interval between two time nodes at half the peak standard deviation values. When the distance of separation between the two time nodes is large, it means that the polished surface is not sufficiently flat.
    Type: Grant
    Filed: October 30, 1998
    Date of Patent: November 28, 2000
    Assignee: United Microelectronics Corp.
    Inventors: Ming-Cheng Yang, Feng-Yeu Shau, Cheng-Sung Huang, Champion Yi
  • Patent number: 5901403
    Abstract: A brush comprises a sleeve, a cap member, a brushing member, and at least one elastic member. The sleeve has a first end and a second end. The brushing member is movably received in the sleeve at the first end, while the cap member is firmly coupled to the sleeve at the second end. The elastic member is disposed between the cap member and the brushing member so that a portion of the brushing member protrudes from the first end of the sleeve.
    Type: Grant
    Filed: March 11, 1997
    Date of Patent: May 11, 1999
    Assignee: Winbound Electronics, Corp.
    Inventor: Ming-Cheng Yang
  • Patent number: 5883619
    Abstract: A view control system for controlling the display of a view within an image over a computer monitor is disclosed. The system comprises a computer for displaying the view over the monitor and for scrolling the view within the image according to scrolling signals so that various portions of the image can be seen through the view, a computer mouse electrically connected to the computer through a flexible cable for controlling movements of a cursor displayed over the monitor, a view control button installed over the mouse for sensing a direction of a finger input and generating scrolling signals according to the sensed direction of the finger input and the length of time of each input to control the scrolling of the view within the image, and a bi-directional button installed over the mouse for generating a zooming signal within the scrolling signal for zooming in or out of the view within the image.
    Type: Grant
    Filed: November 12, 1996
    Date of Patent: March 16, 1999
    Assignee: Primax Electronics Ltd.
    Inventors: Heng-Chin Ho, Ming-Cheng Yang, Chih-Hsiung Wu
  • Patent number: 5739821
    Abstract: A window frame pointing method is used for pointing a window frame out of multiple window frames contained within a window interface by using a mouse. The content of the window interface will automatically be scrolled if the pointed window frame is not displayed over a monitor screen. The mouse comprises a two dimensional control button for generating a two dimensional pointing signal. The window interface is controlled by a window software which comprises a frame control module for controlling the pointing of a window frame according to the pointing signal.
    Type: Grant
    Filed: January 30, 1997
    Date of Patent: April 14, 1998
    Assignee: Primax Electronics Ltd.
    Inventors: Heng Chun Ho, Ming Cheng Yang, Wen Hsiung Liu, Chih Hsiung Wu