Abstract: A vehicle device setting method including: capturing, by an image sensing unit, a first image frame; recognizing a user ID according to the first image frame; showing ID information of the recognized user ID on a screen or by a speaker; capturing a second image frame; generating a confirm signal when a first user expression is recognized by calculating an expression feature in the second image frame and comparing the recognized expression feature with stored expression data associated with a predetermined user expression to confirm whether the recognized user ID is correct or not according to the second image frame captured after the ID information is shown; controlling an electronic device according to the confirm signal; and entering a data update mode instructed by the user and updating setting information of the electronic device by current electronic device setting according to a saving signal generated by confirming a second user expression in a third image frame captured after the user ID is confirmed

Abstract: A method for forming a patterned conductive structure is provided. The method includes forming a soluble layer on a surface of a substrate, wherein the soluble layer has an opening exposing a rough portion of the surface. A first conductive layer is formed on the soluble layer, wherein the first conductive layer extends onto the rough portion in the opening. The soluble layer and the first conductive layer on the soluble layer are removed, wherein a portion of the first conductive layer corresponding to the rough portion is remained on the substrate. A patterned conductive structure formed by the method is also provided.

Abstract: A method for forming a patterned conductive structure is provided. The method includes forming a soluble layer on a surface of a substrate, wherein the soluble layer has an opening exposing a rough portion of the surface. A first conductive layer is formed on the soluble layer, wherein the first conductive layer extends onto the rough portion in the opening. The soluble layer and the first conductive layer on the soluble layer are removed, wherein a portion of the first conductive layer corresponding to the rough portion is remained on the substrate. A patterned conductive structure formed by the method is also provided.

Abstract: An electroplating jig for processing electroplating at a certain location, an electroplating method incorporating with the electroplating jig, and an electro product free of a plating proof layer produced by the electroplating method are provided. The electroplating jig includes a base and a flexible electric conductive pad. An accommodation slot and an opening are respectively installed on two opposite surfaces of the base in which an electro can be disposed in the accommodation slot and the accommodation slot is larger than the opening and communicated with the opening, the opening exposes a first metal pattern of the electro therefrom. The flexible electric conductive pad is blanketed on a second metal pattern formed on another surface of the electro to electrically connect the first metal pattern and the second metal pattern.

Abstract: A structure of an antenna is disclosed. The antenna comprises a flexible antenna, a first foam material, a second foam material, a cover plate and a housing. The first foam material and the second foam material together enwrap the flexible antenna. The cover plate and the first foam material match correspondingly. The housing matches with the second foam material, and the housing is joined with the cover plate. The strength of the cover plate and the housing are enhanced respectively by the first and the second foam material to prevent bending and distortion.

Abstract: A leadless lower temperature co-crystal phase transition metal heat conductive device comprises two metal substrates made from tin, indium, bismuth and a little other elements; a metal heat conductive sheet installed between the two metal substrates, where the metal substrates having the effect of increasing heat dissipating ability of the metal heat conductive sheet; a heat dissipation device installed above a structure formed by the metal substrates and the metal heat conductive sheet so as to dissipate heat from the metal heat conductive sheet and the two metal substrates; and a fan installed above the heat dissipation device for dissipating heat from the heat dissipation device. When leadless lower temperature co-crystal phase transition metal heat conductive device is placed on a circuit board, the temperature range for co-crystal phase transition is between 50° C. to 70° C.