Abstract: An electronic device is provided. The electronic device includes a first substrate, an insulating layer, a first conductive layer and a second conductive layer. The insulating layer is overlapped with the first substrate. The second conductive layer contacts with the first conductive layer. The first conductive layer and the second conductive layer are disposed between the first substrate and the insulating layer. The second conductive layer is disposed between the first conductive layer and the insulating layer. Moreover, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the insulating layer.

Abstract: A display device disclosed in the present invention includes a base and a first display unit. The base includes a body and an accommodating portion, the accommodating portion is disposed on the body. The first display unit includes a first casing. The first casing has a first dimension and is detachably disposed on the accommodating portion. The first display unit is electrically connected to the base when the first casing is disposed on the accommodating portion. The present invention utilizes the same base to support the display units with different dimensions; meanwhile, the display unit can be assembled with the base at different assembly directions. Comparing to the prior art, the present invention has preferred convenience.

Abstract: An apparatus and method useful for removing potential wafer-contaminating particles from semiconductor wafer pods. The apparatus includes a rotatable air sprinkler which is mounted in a housing and connected to a source of clean, dry air (CDA) . The air sprinkler rotates as the air is distributed under pressure through the sprinkler and ejected from nozzles in the sprinkler. The ejected air impinges against a semiconductor wafer pod placed on the housing, above the air sprinkler to dislodge or remove particulate contaminants from the pod and prevent or at least significantly reduce the likelihood of particle contamination during transport of the pod and/or processing of the wafers in the pod.

Abstract: An apparatus and method useful for removing potential wafer-contaminating particles from semiconductor wafer pods. The apparatus includes a rotatable air sprinkler which is mounted in a housing and connected to a source of clean, dry air (CDA). The air sprinkler rotates as the air is distributed under pressure through the sprinkler and ejected from nozzles in the sprinkler. The ejected air impinges against a semiconductor wafer pod placed on the housing, above the air sprinkler to dislodge or remove particulate contaminants from the pod and prevent or at least significantly reduce the likelihood of particle contamination during transport of the pod and/or processing of the wafers in the pod.