Patents by Inventor Ming-Chia Hsieh

Ming-Chia Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220254491
    Abstract: A health savings management system installed and downloaded to a mobile device. The system includes an identity recording module, for recording gender, age and life deposit value. The identity recording module has a built-in predetermined age. A calculation module for performing a calculation based on the predetermined age and the inputted gender, age and life deposit value to obtain a total health credit limit and display the total health credit limit. A deduction module has a built-in and predetermined comparison standard value, and records physical condition, sickness, dietary habit, and rest, and comparing with the comparison standard value and then generating a deduction value. The calculation module adds up the predetermined age and the total health credit limit to change the numerical value of a total health credit limit according to the deduction value generated by the deduction module.
    Type: Application
    Filed: February 8, 2021
    Publication date: August 11, 2022
    Inventor: Ming-Chia Hsieh
  • Patent number: 10206448
    Abstract: A wearable step-counting shoe includes a shoe body and a pedometer. The shoe body includes a shoe sole having opposite inner and outer sides, and a groove surface defining amounting groove. The pedometer is removably disposed in the mounting groove and includes a pedometer body having opposite first and second faces and configured to detect and record the number of steps taken by a user, and a screen disposed on the second face and configured to display the detected number of steps. An engaging unit is provided to fix the pedometer on the shoe body, and includes a first engaging portion provided on the groove surface, and a second engaging portion provided on the pedometer and releasably engageable with the first engaging portion.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: February 19, 2019
    Assignee: HOMEWAY TECHNOLOGY CO., LTD.
    Inventors: Chin-Hsing Hsieh, Tsung-Hsien Hsieh, Ming-Chia Hsieh, Tung-Chen Hsieh
  • Publication number: 20180008150
    Abstract: A personal wearable headband having far infrared and temperature measurement functions includes a headband body defining a headband receiving space and having a plurality of far infrared particles blended in the headband body, a window communicating with the headband receiving space, and a through hole communicating with the headband receiving space and opposite to the window. A temperature measuring unit is disposed in the headband receiving space and includes a temperature measuring element configured to contact the forehead of a user for detecting a temperature thereof, and a display screen corresponding in position to the window and configured to display the temperature detected by the temperature measuring element.
    Type: Application
    Filed: January 23, 2017
    Publication date: January 11, 2018
    Inventors: Tsung-Hsien HSIEH, Tung-Chen HSIEH, Ming-Chia HSIEH
  • Publication number: 20170325538
    Abstract: A wearable step-counting shoe includes a shoe body and a pedometer. The shoe body includes a shoe sole having opposite inner and outer sides, and a groove surface defining amounting groove. The pedometer is removably disposed in the mounting groove and includes a pedometer body having opposite first and second faces and configured to detect and record the number of steps taken by a user, and a screen disposed on the second face and configured to display the detected number of steps. An engaging unit is provided to fix the pedometer on the shoe body, and includes a first engaging portion provided on the groove surface, and a second engaging portion provided on the pedometer and releasably engageable with the first engaging portion.
    Type: Application
    Filed: January 10, 2017
    Publication date: November 16, 2017
    Inventors: Chin-Hsing HSIEH, Tsung-Hsien HSIEH, Ming-Chia HSIEH, Tung-Chen HSIEH
  • Publication number: 20150065920
    Abstract: A foot orthotic service system includes a foot orthotic device including a pressure sensing substrate that is capable of generating at least one signal by sensing pressure exerted thereon, and a management unit that is mounted in the pressure sensing substrate, and that includes a signal processing module and a wireless communication module. The signal processing module receives the signal from the pressure sensing substrate, and processes the signal to generate pressure data that is associated with the pressure sensed by the pressure sensing substrate. The wireless communication module is electrically connected to the signal processing module and is capable of wirelessly transmitting the pressure data.
    Type: Application
    Filed: September 3, 2014
    Publication date: March 5, 2015
    Applicant: Homeway Technology Co., LTD
    Inventors: Ming-Chia Hsieh, Chin-Hsing Hsieh
  • Patent number: 7662709
    Abstract: An improved surface mounting method applied in a semiconductor package process is provided, wherein the method comprises the following steps: First a substrate having at least one pad set on one surface of the substrate is provided. Then a mask having at least one opening associated with one of the at least one pad is set on the substrate, wherein each opening is separated into a plurality of sub-openings by a segregator to expose the pad. Subsequently, a printing process is conducted to form a conductive layer on each pad. After removing the mask, a passive device is set on the conductive layer over the pad, and a heating treatment is conducted to fix the passive device on the pad.
    Type: Grant
    Filed: December 28, 2006
    Date of Patent: February 16, 2010
    Assignee: Advanced Semiconductor Engineering Inc.
    Inventors: Pai-Chou Liu, Wen-Shin Lin, Sheng-Hong Cheng, Yu-Hsin Lee, Ming-Chia Hsieh, Kuan-Hung Yeh, Chia-Wei Chang, Tsung-Chi Chen
  • Publication number: 20070254469
    Abstract: An improved surface mounting method applied in a semiconductor package process is provided, wherein the method comprises the following steps: First a substrate having at least one pad set on one surface of the substrate is provided. Then a mask having at least one opening associated with one of the at least one pad is set on the substrate, wherein each opening is separated into a plurality of sub-openings by a segregator to expose the pad. Subsequently, a printing process is conducted to form a conductive layer on each pad. After removing the mask, a passive device is set on the conductive layer over the pad, and a heating treatment is conducted to fix the passive device on the pad.
    Type: Application
    Filed: December 28, 2006
    Publication date: November 1, 2007
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING INC.
    Inventors: Pai-Chou Liu, Wen-Shin Lin, Sheng-Hong Cheng, Yu-Hsin Lee, Ming-Chia Hsieh, Kuan-Hung Yeh, Chia-Wei Chang, Tsung-Chi Chen
  • Publication number: 20020195360
    Abstract: A golf bag includes a bag body having a rigid bottom end with horizontal and inclined portions, and a stand unit with two legs pivoted to the bag body, and two push rods pivoted to the legs. A footplate is provided with a pivot connector at a middle portion thereof. The pivot connector defines a pivot hole for receiving rotatably a crossbar that interconnects lower ends of the push rods. The footplate is disposed below the inclined portion of the bottom end of the bag body, and is free of a connection with the bottom end of the bag body. The footplate is coplanar with the horizontal portion when the bag body is at an upright position. When the bag body is tilted, the legs pivot away from the bag body, and the footplate is coplanar with the inclined portion of the bottom end of the bag body.
    Type: Application
    Filed: June 21, 2001
    Publication date: December 26, 2002
    Applicant: Mega Force Co., Ltd.
    Inventor: Ming-Chia Hsieh
  • Patent number: 5812526
    Abstract: A system and process are provided for controlling congestion at a node of an asynchronous transfer mode (ATM) communications network. The process and system utilize fuzzy logic in determining whether or not to "admit," i.e., allocate a virtual channel (VC) for, new communications (or calls) to the node. Fuzzy logic is also use to control the rate cells are transmitted to the node for communications already "admitted," i.e., for which a VC has already been allocated. The fuzzy logic rules for bandwidth estimation in admission control may be developed from an "equivalent capacity" model. The fuzzy logic rules for adjusting cell transmission rates may be developed from a "two-threshold" congestion control model.
    Type: Grant
    Filed: December 21, 1995
    Date of Patent: September 22, 1998
    Assignee: Industrial Technology Research Institute
    Inventors: Chung-Ju Chang, Ray-Guang Cheng, Tzung-Pao Lin, Ming-Chia Hsieh, Yao-Tzung Wang