Patents by Inventor Ming-Chieh Chen

Ming-Chieh Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260160879
    Abstract: A detection method, a processing device, and an electronic device. When a radar scanner is in a first mode, the processor determines, based on radar echo information data generated by the radar scanner, whether an object to be tracked appeared within a preset range. If negative, the radar scanner remains in the first mode; if affirmative, the radar scanner switches to second mode, and the processor determines whether the movement trajectory of the object to be tracked matches one of multiple preset trajectories using radar echo information data. If the movement trajectory does not match, the processor further determines whether the object to be tracked corresponds to one of several preset monitoring states. If the object to be tracked corresponds to one of the present monitoring states, the radar scanner remains in the second mode; if not, the radar scanner switches back to the first mode.
    Type: Application
    Filed: November 18, 2025
    Publication date: June 11, 2026
    Inventors: GUAN-SIAN WU, CHIEN-YU CHEN, YU-AN Chen, Ming-Chieh Chen
  • Patent number: 11762495
    Abstract: This application provides an electronic device, including: a processor, configured to select one of an absolute coordinate mode and a relative coordinate mode according to a switching instruction. When the processor uses the absolute coordinate mode, absolute coordinate information received by the processor is run in the absolute coordinate mode; and when the processor uses the relative coordinate mode, the absolute coordinate information received by the processor is converted into relative coordinate information and is run in the relative coordinate mode. Therefore, this application performs adaptive conversion between the absolute coordinate mode and the relative coordinate mode, to provide users with more flexible operations.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: September 19, 2023
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Ming-Chieh Chen, Chun-Tsai Yeh, Yu-Ning Kuo
  • Publication number: 20220317800
    Abstract: This application provides an electronic device, including: a processor, configured to select one of an absolute coordinate mode and a relative coordinate mode according to a switching instruction. When the processor uses the absolute coordinate mode, absolute coordinate information received by the processor is run in the absolute coordinate mode; and when the processor uses the relative coordinate mode, the absolute coordinate information received by the processor is converted into relative coordinate information and is run in the relative coordinate mode. Therefore, this application performs adaptive conversion between the absolute coordinate mode and the relative coordinate mode, to provide users with more flexible operations.
    Type: Application
    Filed: March 21, 2022
    Publication date: October 6, 2022
    Inventors: Ming-Chieh Chen, Chun-Tsai Yeh, Yu-Ning Kuo
  • Patent number: 11455046
    Abstract: An electronic device suitable for a stylus is provided. The electronic device includes a display panel, a touch module, and a processor. The display panel includes a display area. The touch module includes a touchable area. The processor is electrically connected to the display panel and the touch module. The processor defines an effective input area in the touchable area in response to the operation of the stylus, defines a mapping display area in the display area corresponding to the effective input area, and adjusts the display ratio of the mapping display area according to the input ratio of the effective input area.
    Type: Grant
    Filed: May 6, 2021
    Date of Patent: September 27, 2022
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Ya-Ting Chen, Hung-Yi Lin, Chien-Chih Tseng, Chun-Tsai Yeh, Wei-Tong Lin, Ming-Chieh Chen, Yi-Ou Wang, Chao-Chieh Cheng
  • Publication number: 20210357039
    Abstract: An electronic device suitable for a stylus is provided. The electronic device includes a display panel, a touch module, and a processor. The display panel includes a display area. The touch module includes a touchable area. The processor is electrically connected to the display panel and the touch module. The processor defines an effective input area in the touchable area in response to the operation of the stylus, defines a mapping display area in the display area corresponding to the effective input area, and adjusts the display ratio of the mapping display area according to the input ratio of the effective input area.
    Type: Application
    Filed: May 6, 2021
    Publication date: November 18, 2021
    Inventors: Ya-Ting CHEN, Hung-Yi LIN, Chien-Chih TSENG, Chun-Tsai YEH, Wei-Tong LIN, Ming-Chieh CHEN, Yi-Ou WANG, Chao-Chieh CHENG
  • Patent number: 7663234
    Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.
    Type: Grant
    Filed: May 25, 2006
    Date of Patent: February 16, 2010
    Assignee: United Microelectronics Corp.
    Inventors: Joseph Sun, Kuang-Chih Cheng, Ming-Chieh Chen, Kevin Lee, Jui-Hsiang Pan
  • Patent number: 7663693
    Abstract: A camera module is provided. The camera module comprises: a lens; a holder having a lower portion, the holder holding the lens; a circuit board; and an image sensing and processing unit including an image sensing device and an optional signal processing device stacked on and electrically connected to the image sensing device, the image sensing and processing unit being packaged on one side of the circuit board; wherein the holder is fixed on the circuit board, the image sensing and processing unit inside the lower portion of the holder. Further, if the circuit board is a flexible circuit board, then a hard plate can be disposed on the other side of the flexible PCB corresponding to the image sensing and processing unit in order to enhance the mechanical strength.
    Type: Grant
    Filed: March 1, 2004
    Date of Patent: February 16, 2010
    Assignee: United Microelectronics Corp.
    Inventors: Cheng-Kuang Sun, Kuang-Chih Cheng, Ming-Chieh Chen, Kuang-Shin Lee
  • Patent number: 7303400
    Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.
    Type: Grant
    Filed: January 27, 2005
    Date of Patent: December 4, 2007
    Assignee: United Microelectronics Corp.
    Inventors: Joseph Sun, Kuang-Chih Cheng, Ming-Chieh Chen, Kevin Lee, Jui-Hsiang Pan
  • Publication number: 20060221922
    Abstract: A communication system includes a wireless network terminal (30), a wired network terminal (10), and a communication device (20). The communication device includes a Local Area Network (LAN) controller module (22), a process unit (24) and a transcoder (26). When the wired network terminal transmits a first kind of signal input to the communication device, the first kind of input signal is processed by the process unit and transformed into a first kind of output signal by the transcoder. Then the first kind of output is transmitted to the wireless network terminal. When the wireless network terminal transmits a second kind of signal input to the communication device. The second kind of input signal is transformed into the second kind of output signal by the transcoder. The second kind of output signal is processed by the process unit, and is then transmitted to the wired network terminal.
    Type: Application
    Filed: December 29, 2005
    Publication date: October 5, 2006
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Ming-Chieh Chen, Chien-Chung Kao, Ming-Chih Tsai, Chun-Chie Lai
  • Publication number: 20060202333
    Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.
    Type: Application
    Filed: May 25, 2006
    Publication date: September 14, 2006
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: JOSEPH SUN, KUANG-CHIH CHENG, MING-CHIEH CHEN, KEVIN LEE, JUI-HSIANG PAN
  • Publication number: 20060113654
    Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.
    Type: Application
    Filed: January 10, 2006
    Publication date: June 1, 2006
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Joseph Sun, Kuang-Chih Cheng, Ming-Chieh Chen
  • Publication number: 20050190290
    Abstract: A camera module is provided. The camera module comprises: a lens; a holder having a lower portion, the holder holding the lens; a circuit board; and an image sensing and processing unit including an image sensing device and an optional signal processing device stacked on and electrically connected to the image sensing device, the image sensing and processing unit being packaged on one side of the circuit board; wherein the holder is fixed on the circuit board, the image sensing and processing unit inside the lower portion of the holder. Further, if the circuit board is a flexible circuit board, then a hard plate can be disposed on the other side of the flexible PCB corresponding to the image sensing and processing unit in order to enhance the mechanical strength.
    Type: Application
    Filed: March 1, 2004
    Publication date: September 1, 2005
    Inventors: Cheng-Kuang Sun, Kuang-Chih Cheng, Ming-Chieh Chen, Kuang-Shin Lee
  • Publication number: 20050161815
    Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.
    Type: Application
    Filed: January 27, 2004
    Publication date: July 28, 2005
    Inventors: Joseph Sun, Kuang-Chih Cheng, Ming-Chieh Chen
  • Publication number: 20050161756
    Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.
    Type: Application
    Filed: January 27, 2005
    Publication date: July 28, 2005
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Joseph Sun, Kuang-Chih Cheng, Ming-Chieh Chen, Kevin Lee, Jui-Hsiang Pan
  • Publication number: 20040081141
    Abstract: A method for a digital subscriber line device to process dial string. The digital subscriber line device is coupled to a PSTN (public switched telephone network) and a VoIP network. First, a transmission is received by the digital subscriber line device. Then, the dial string of the transmission is compared with phone numbers stored in a PSTN digit map and in a VoIP digit map by a PSTN digit string processor and a VoIP digit string processor, respectively. The transmission is routed to the PSTN network when a phone number corresponding to the transmission is found in the PSTN digit map. The transmission is routed to the VoIP network when a phone number corresponding to the transmission is found in the VoIP digit map.
    Type: Application
    Filed: August 27, 2003
    Publication date: April 29, 2004
    Applicant: Ambit Microsystems Corporation
    Inventors: Ming-Chieh Chen, Shu-Ken Lin
  • Publication number: 20040073940
    Abstract: A method for a broadband modem to process incoming calls. The broadband modem is coupled to a PSTN (public switched telephone network) and a VoIP network. First, an call is incoming by the broadband modem. Then, the broadband modem detects whether the incoming call is routed from the PSTN network or the VoIP network. When the incoming call is routed from the PSTN network, the broadband modem establishes a connection between a telephone coupled to the broadband modem and the PSTN network through a switch. When the incoming call is routed from the VoIP network, the broadband modem establishes a connection between the telephone and the VoIP network through the switch.
    Type: Application
    Filed: August 6, 2003
    Publication date: April 15, 2004
    Applicant: Ambit Microsystems Corporation
    Inventors: Ming-Chieh Chen, Shu-Ken Lin, Ching-Mao Yeh
  • Publication number: 20040073902
    Abstract: A firmware upgrade method for a network device through a digital subscriber line. First, the network device transmits a request to a dynamic host configuration protocol server through a digital subscriber line. Then, information comprising a file server address and a query message are transmitted from the dynamic host configuration protocol server through the digital subscriber line to the network device in response to the request. The network device determines whether to upgrade the firmware of the network device according to the answer of the query message. If the network device determines to upgrade the firmware thereof, updated information about the firmware is downloaded from a file server corresponding to the file server address. Finally, the firmware of the digital subscriber line device is upgraded according to the updated information.
    Type: Application
    Filed: August 11, 2003
    Publication date: April 15, 2004
    Applicant: Ambit Microsystems Corporation
    Inventors: Chien-Chung Kao, Ming-Chieh Chen, Shu-Ken Lin
  • Patent number: 5392078
    Abstract: An improved structure for nose pieces of spectacles, comprises two nose pieces made of soft plastic in concaved shapes and having their front faces planted with fine down and provided with a plurality of air permeable holes, a connecting axle integrally protruding from the nose piece with a protruding ball extending into a base and being able of automatic orientation adjustment and being pressed in the base by a pressing detent which in turn being pressed by a torsional spring, the structure each can be clamped onto a seat (on the spectacles) for a nose piece so as not to be subjected to falling off and is convenient for assembling, the nose piece with this structure can best fit to the bridge of a nose.
    Type: Grant
    Filed: June 4, 1993
    Date of Patent: February 21, 1995
    Inventor: Ming-Chieh Chen
  • Patent number: 5357681
    Abstract: A gear socket structure for a designing rule, of which the gear socket is a round cylinder, having a given height; the wall of the gear socket is provided with two leaf springs; the top of each leaf spring has an inward catch hook; the gear socket can accommodate a plurality of gears, which are held in place by means of the catch hooks without falling out unintentionally.
    Type: Grant
    Filed: February 7, 1994
    Date of Patent: October 25, 1994
    Inventor: Ming-Chieh Chen
  • Patent number: D734086
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: July 14, 2015
    Assignee: PEGATRON CORPORATION
    Inventors: Shun-Chuan Tseng, Chang-Xin Ye, Ming-Chieh Chen