Abstract: A lighting device includes a light board and a light dimmer circuit. The light board includes multiple first light emitting elements and second light emitting elements. The first light emitting elements are disposed in a first area of the light board. The second light emitting elements are disposed in a second area of the light board. The light dimmer circuit is configured to drive the second light emitting elements to generate flickering lights from the second area of the light board, and is configured to drive the first light emitting elements to generate non-flickering lights from the first area of the light board.

Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.

Abstract: An image conversion device includes: a lens module configured to allow passing of image light beams of an object, an optical waveguide element configured to transmit the image light beams to a light processing component, and an image sensor configured to convert the image light beams into digital image signals. By changing image capturing and image forming methods, higher image quality may be achieved and expanding flexibility may be maintained.

Abstract: The present disclosure relates to an integrated chip. The integrated chip includes an image sensing element disposed within a substrate. A gate structure is disposed along a front-side of the substrate. A back-side of the substrate includes one or more first angled surfaces defining a central diffuser disposed over the image sensing element. The back-side of the substrate further includes second angled surfaces defining a plurality of peripheral diffusers laterally surrounding the central diffuser. The plurality of peripheral diffusers are a smaller size than the central diffuser.

Abstract: This application provides an electronic device, including: a processor, configured to select one of an absolute coordinate mode and a relative coordinate mode according to a switching instruction. When the processor uses the absolute coordinate mode, absolute coordinate information received by the processor is run in the absolute coordinate mode; and when the processor uses the relative coordinate mode, the absolute coordinate information received by the processor is converted into relative coordinate information and is run in the relative coordinate mode. Therefore, this application performs adaptive conversion between the absolute coordinate mode and the relative coordinate mode, to provide users with more flexible operations.

Abstract: This application provides an electronic device, including: a processor, configured to select one of an absolute coordinate mode and a relative coordinate mode according to a switching instruction. When the processor uses the absolute coordinate mode, absolute coordinate information received by the processor is run in the absolute coordinate mode; and when the processor uses the relative coordinate mode, the absolute coordinate information received by the processor is converted into relative coordinate information and is run in the relative coordinate mode. Therefore, this application performs adaptive conversion between the absolute coordinate mode and the relative coordinate mode, to provide users with more flexible operations.

Abstract: An electronic device suitable for a stylus is provided. The electronic device includes a display panel, a touch module, and a processor. The display panel includes a display area. The touch module includes a touchable area. The processor is electrically connected to the display panel and the touch module. The processor defines an effective input area in the touchable area in response to the operation of the stylus, defines a mapping display area in the display area corresponding to the effective input area, and adjusts the display ratio of the mapping display area according to the input ratio of the effective input area.

Abstract: An electronic device suitable for a stylus is provided. The electronic device includes a display panel, a touch module, and a processor. The display panel includes a display area. The touch module includes a touchable area. The processor is electrically connected to the display panel and the touch module. The processor defines an effective input area in the touchable area in response to the operation of the stylus, defines a mapping display area in the display area corresponding to the effective input area, and adjusts the display ratio of the mapping display area according to the input ratio of the effective input area.

Abstract: A data conversion device is used between a host terminal and an equipment terminal. The equipment terminal is equipped with an RS-232 connection port. The host terminal includes a USB docking port. The data conversion device includes an RS-232 docking port, a micro controller and a USB connection port. The RS-232 connection port is connected with the RS-232 docking port. The RS-232 docking port receives each one-byte data from a RS-232 protocol data packet of the RS-232 connection port in sequence. The micro controller is connected with the RS-232 docking port, after receiving the RS-232 protocol data packet of the RS-232 docking port and setting the RS-232 protocol data packet of the RS-232 docking port into a USB-HID protocol data packet.

Abstract: A camera module is provided. The camera module comprises: a lens; a holder having a lower portion, the holder holding the lens; a circuit board; and an image sensing and processing unit including an image sensing device and an optional signal processing device stacked on and electrically connected to the image sensing device, the image sensing and processing unit being packaged on one side of the circuit board; wherein the holder is fixed on the circuit board, the image sensing and processing unit inside the lower portion of the holder. Further, if the circuit board is a flexible circuit board, then a hard plate can be disposed on the other side of the flexible PCB corresponding to the image sensing and processing unit in order to enhance the mechanical strength.

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract: A communication system includes a wireless network terminal (30), a wired network terminal (10), and a communication device (20). The communication device includes a Local Area Network (LAN) controller module (22), a process unit (24) and a transcoder (26). When the wired network terminal transmits a first kind of signal input to the communication device, the first kind of input signal is processed by the process unit and transformed into a first kind of output signal by the transcoder. Then the first kind of output is transmitted to the wireless network terminal. When the wireless network terminal transmits a second kind of signal input to the communication device. The second kind of input signal is transformed into the second kind of output signal by the transcoder. The second kind of output signal is processed by the process unit, and is then transmitted to the wired network terminal.

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract: A camera module is provided. The camera module comprises: a lens; a holder having a lower portion, the holder holding the lens; a circuit board; and an image sensing and processing unit including an image sensing device and an optional signal processing device stacked on and electrically connected to the image sensing device, the image sensing and processing unit being packaged on one side of the circuit board; wherein the holder is fixed on the circuit board, the image sensing and processing unit inside the lower portion of the holder. Further, if the circuit board is a flexible circuit board, then a hard plate can be disposed on the other side of the flexible PCB corresponding to the image sensing and processing unit in order to enhance the mechanical strength.

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract: A method for a digital subscriber line device to process dial string. The digital subscriber line device is coupled to a PSTN (public switched telephone network) and a VoIP network. First, a transmission is received by the digital subscriber line device. Then, the dial string of the transmission is compared with phone numbers stored in a PSTN digit map and in a VoIP digit map by a PSTN digit string processor and a VoIP digit string processor, respectively. The transmission is routed to the PSTN network when a phone number corresponding to the transmission is found in the PSTN digit map. The transmission is routed to the VoIP network when a phone number corresponding to the transmission is found in the VoIP digit map.