Abstract: A door locking mechanism and semiconductor container using the same include door panel, cover, and locking module. The door panel has a first stop structure. The cover and the door panel define an accommodating space for receiving the locking module. The locking module includes rotating member, holding member, and elastic member. The elastic member is disposed on the holding member and has a second stop structure near the first stop structure. The elastic member is disposed between the holding and the rotating member. The elastic member is compressed when a force is applied to the holding member, and the second stop structure detaches from a limitation state with the first stop structure for allowing a rotating operation of the rotating member. The elastic member elastically restores when the force is removed, and the second stop structure returns to the limitation state for limiting the rotating operation.

Abstract: A method includes: positioning a wafer on an electrostatic chuck of a physical vapor deposition apparatus, the wafer including an opening exposing a conductive feature; setting a temperature of the wafer to a room temperature; forming a tungsten thin film in the opening by the physical vapor deposition apparatus, the tungsten thin film including a bottom portion that is on an upper surface of the conductive feature exposed by the opening, a top portion that is on an upper surface of a dielectric layer through which the opening extends and a sidewall portion that is on a sidewall of the dielectric layer exposed by the opening; removing the top portion and the sidewall portion of the tungsten thin film from over the opening; and forming a tungsten plug in the opening on the bottom portion by selectively depositing tungsten by a chemical vapor deposition operation.

Abstract: A secondary-side controller applied to a flyback power converter prevents a secondary side of the flyback power converter from conducting incorrectly. The secondary-side controller includes a first comparison circuit, a second comparison circuit, and a gate control signal generation circuit. The first comparison circuit generates a first comparison signal according to a drain voltage of a synchronous switch of the secondary side of the flyback power converter and a first parameter. The second comparison circuit generates a ready signal according to the first comparison signal and a resistance of an external resistor. The gate control signal generation circuit generates a gate control signal to the synchronous switch according the ready signal and the drain voltage, and the synchronous switch is turned on according to the gate control signal.

Abstract: The present invention provides a wafer container and a gas diffusion device applied in the wafer container. The wafer container includes a shell, and all components included and applied on the shell are made of thermal resistance materials. The gas diffusion device and the wafer container, when assembled together, utilize a coupling structure and a collar as a protection mechanism for the gas diffusion device. The gas diffusion device has a buffering chamber that provides a buffering tolerance and a communicating space for the gas before the gas enters an interior space of the wafer container.

Abstract: Disclosed is a pixel circuit. A pulse width signal generator provides a pulse width signal to a control terminal of a light-emitting control switch on a drive current path of a drive current generator. A multiple lighting controller adjusts the pulse width signal provided by the pulse width signal generator according to a multiple emission control signal to allow a light-emitting element to perform multi-emission.

Abstract: Disclosed is the source active region.

Abstract: A method of determining driving currents of a backlight module includes: disposing the backlight module onto a base; defining a plurality of areas from a top area to a bottom are of the backlight module; and reducing the driving current of the area that is situated further from the base.

Abstract: A method of determining driving currents of a backlight module includes: disposing the backlight module onto a base; defining a plurality of areas from a top area to a bottom are of the backlight module; and reducing the driving current of the area that is situated further from the base.

Abstract: A back bezel assembly for a backlight module is provided. The back bezel comprises a first board and a second board, which are assembled at the edges thereof to form a continuous board. The thermal conductivity of the second board is less than that of the first board. A light source and an inverter are disposed at the opposite sides with respect to the second board, so the second board isolates the heat, generated from the light source device, from being conducted toward the inverter.

Abstract: A back bezel assembly for a backlight module is provided. The back bezel comprises a first board and a second board, which are assembled at the edges thereof to form a continuous board. The thermal conductivity of the second board is less than that of the first board. A light source and an inverter are disposed at the opposite sides with respect to the second board, so the second board isolates the heat, generated from the light source device, from being conducted toward the inverter.