Patents by Inventor Ming-Chih Chan

Ming-Chih Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EMI SHIELD SPRING DEVICE
    Publication number: 20100261359
    Abstract: An electro-magnetic interference device attached to a surface of an object by soldering is disclosed. The device comprises a base comprising a surface defining at least one recessed portion. The at least one recessed portion comprises a side wall. An angle between the side wall and the surface of the base is equal to or greater than 90 degrees.
    Type: Application
    Filed: April 1, 2010
    Publication date: October 14, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: MING-CHIH CHAN, XIAO-QIN JIANG
  • Multi-layered connector
    Patent number: 7497741
    Abstract: A multi-layered connector is disclosed. The multi-layered connector includes a first sub-connector and a second sub-connector. The first sub-connector includes a first elongated body. The second sub-connector includes a second elongated body, and two side arms elongated upwardly from opposite ends of the second elongated body. The side arms define slide grooves faced to each other for receiving the first sub-connector. The multi-layered connector further includes glue points that connect the first elongated body and the second elongated body. The multi-layered connector avoids solder bridges and solder cracks.
    Type: Grant
    Filed: May 25, 2007
    Date of Patent: March 3, 2009
    Assignees: Hong Fu Jin Precision Industry (Shen Zhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Qing Cai, Chih-Chuan Chen, Ming-Chih Chan, Xiao-Qin Jiang
  • MULTI-LAYERED CONNECTOR
    Publication number: 20080045046
    Abstract: A multi-layered connector is disclosed. The multi-layered connector includes a first sub-connector and a second sub-connector. The first sub-connector includes a first elongated body. The second sub-connector includes a second elongated body, and two side arms elongated upwardly from opposite ends of the second elongated body. The side arms define slide grooves faced to each other for receiving the first sub-connector. The multi-layered connector further includes glue points that connect the first elongated body and the second elongated body. The multi-layered connector avoids solder bridges and solder cracks.
    Type: Application
    Filed: May 25, 2007
    Publication date: February 21, 2008
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Qing Cai, Chih-Chuan Chen, Ming-Chih Chan, Xiao-Qin Jiang