Abstract: A flat speaker device includes a first housing assembly and a speaker assembly. The method of fabricating the flat speaker device has steps of combining a first upper layer with a first frame; combining a first flat speaker with the first upper layer; combining a first lower layer with the first frame and the first flat speaker; placing a lower cover layer under the first lower layer; placing a upper cover layer over the first upper layer; combining the upper cover layer, the first upper layer, the first frame, the first flat speaker, the first lower layer and the lower cover layer; forming a pocket on the upper cover layer; and mounting a printed circuit board in the pocket.

Abstract: A packaging structure for depression switches includes an electronic substrate containing at least one switch electrode, a push-on switch located on the electronic substrate to connect the switch electrode to generate a command signal and a sealing member. The push-on switch and the electronic substrate form a first air chamber between them. The sealing member has a fastening portion to seal the push-on switch on the electronic substrate and a second air chamber formed with the electronic substrate to communicate with the first air chamber. By depressing the push-on switch to connect the switch electrode, air held in the first air chamber is squeezed and flows to the second air chamber without escaping.

Abstract: The present invention discloses a flat panel display package method. Firstly, a flat panel display and an electronic baseplate are prepared; the electronic baseplate is assembled to the flat panel display to provide a driving signal for the flat panel display and form a display module, and the display module defines a module package plane. Next, a first package film and a second package film are respectively provided for the flat panel display and electronic baseplate; the first package film and the second package film both outside the module package plane are respectively defined to be a first join region and a second join region. Next, a hot-pressing machine is used to apply a hot-pressing temperature and a hot-pressing pressure to the first and second join regions and seal them airtightly. Thereby, the present invention can prevent external humidity entering and damaging the flat panel display and the electronic baseplate.

Abstract: A packaging structure for depression switches includes an electronic substrate containing at least one switch electrode, a push-on switch located on the electronic substrate to connect the switch electrode to generate a command signal and a sealing member. The push-on switch and the electronic substrate form a first air chamber between them. The sealing member has a fastening portion to seal the push-on switch on the electronic substrate and a second air chamber formed with the electronic substrate to communicate with the first air chamber. By depressing the push-on switch to connect the switch electrode, air held in the first air chamber is squeezed and flows to the second air chamber without escaping.

Abstract: The present invention discloses a light-proof chip packaging structure, which comprises an electronic substrate, at least one semiconductor chip installed on the electronic substrate, and a light-proof film. The light-proof film comprises a main portion, which is substantially conformable to cover all the non-concealed faces of the semiconductor chip. The light-proof film also has an extension portion, which extends from the main portion and covers the areas neighboring the semiconductor chip. The light-proof film comprises a metallic layer capable of blocking light and an insulating layer interposing between the metallic layer and the semiconductor chip. The present invention can effectively reduce the gaps between the semiconductor chip and the light-proof film, whereby no bubble is formed in encapsulating the electronic substrate, thus reducing the possibility of damaging the packing structure.