Abstract: A control circuit controls a power output module and drives a load device. The control circuit includes a conversion unit, a feed-forward unit, a feedback unit and a control unit. The conversion unit generates a driving signal according to an output signal of the power output module for driving the load device. The feed-forward unit generates a duty cycle reference signal according to the output signal. The feedback unit generates a feedback signal according to the driving signal. The control unit outputs a control signal to control the conversion unit according to the duty cycle reference signal and feedback signal, thereby limiting the output power of the power output module within the maximum power region. A tracking method of the maximum power is also disclosed.

Abstract: A control circuit controls a power output module and drives a load device. The control circuit includes a conversion unit, a feed-forward unit, a feedback unit and a control unit. The conversion unit generates a driving signal according to an output signal of the power output module for driving the load device. The feed-forward unit generates a duty cycle reference signal according to the output signal. The feedback unit generates a feedback signal according to the driving signal. The control unit outputs a control signal to control the conversion unit according to the duty cycle reference signal and feedback signal, thereby limiting the output power of the power output module within the maximum power region. A tracking method of the maximum power is also disclosed.

Abstract: A power converter has simple coupled inductor circuit process the power and drive the semiconductor switch perfectly to reduce the power loss and eliminate the needs of high circuit complexity controller, improve the conversion efficiency and reduce the component counts to reach low cost and high reliability at one time.

Abstract: A heat spreader has an improved geometry which reduces the mechanical stress due to the thermal expansion to enhance the heat transfer performance, and increases the surface area to reduce the thermal resistance between device and surrounding without external cooling assemblies. The heat spreader is able to improve the electrical performance of power modules due to the improved thermal performance.

Abstract: A jig for facilitating soldering of elongate pin to a circuit board having laminated first and second layers of metal in predetermined areas is provided and includes a template supported above the circuit board and at least one support frame supported above the template and the circuit board. The template includes legs descending therefrom which define a space therebetween for snugly receiving the circuit board therein. The template has pin receiving holes formed therethrough in respective alignment with the predetermined areas of the circuit board for the elongate pins to extend therethrough to contact the predetermined areas of the circuit board. The support frame includes pin position adjusting sections resiliently extending laterally therefrom and respectively having pin retaining holes formed therein in correspondence to the pin receiving holes of the template.