Abstract: A flash memory includes multiple gate stacks arranged on a substrate, and a spacer structure. The spacer structure includes multiple thin spacers covering sidewalls of lower portions of the gate stacks and multiple thick spacers covering sidewalls of upper portions of the gate stacks. The thick spacers are located over the respective thin spacers, and the thick spacers are thicker than the thin spacers. The flash memory also includes a dielectric structure disposed on the spacer structure, and an air gap sealed by the dielectric structure and the spacer structure. The air gap includes a body portion between the thin spacers and a head portion between the thick spacers, and the body portion is wider than the head portion.

Abstract: An anti-peeping display device including a display panel and a viewing angle control module, which are stacked, is provided. The viewing angle control module includes a first polarization layer, a first liquid crystal layer, a second polarization layer, a second liquid crystal layer and a third polarization layer that are sequentially stacked. The phase retardations of the first liquid crystal layer and the second liquid crystal layer are within 700 nm to 1200 nm.

Abstract: A power module package structure includes a first substrate and a power component. The first substrate includes at least one conductive layer on a surface thereof. The power component includes a first chip and a first spacer. The first chip has at least one electrode. The first spacer in a heat dissipation space between the first substrate and the first chip includes an insulating heat dissipation layer in the heat dissipation space and multiple vertical conductive connectors, each of the vertical conductive connectors penetrates the insulating heat dissipation layer. The insulating heat dissipation layer surrounds the vertical conductive connectors and electrically isolates the vertical conductive connectors. The vertical conductive connector includes two opposite ends, one end electrically connected to the conductive layer, and the other end electrically connected to the electrode to form a conductive path and a heat dissipation path between the first chip and the first substrate.

Abstract: A two-phase immersion-type heat dissipation device is provided. The two-phase immersion-type heat dissipation device includes a heat dissipation substrate and a plurality of reinforced fins. The heat dissipation substrate has a first surface and a second surface configured to be in contact with a heating element. The first surface is opposite to the second surface and is arranged away from the heating element. The plurality of reinforced fins are integrally formed on the first surface of the heat dissipation substrate, and a thickness of each of the plurality of reinforced fins is less than 1 mm. According to a scanning electron microscopy image of electron backscattered diffraction, a median of local misorientation distribution of the plurality of reinforced fins is greater than 1.6 times a median of local misorientation distribution of the heat dissipation substrate.

Abstract: A two-phase immersion-type composite heat dissipation device is provided, which includes a heat dissipation substrate, a plurality of fins, and a surface porous layer. The heat dissipation substrate has a first surface and a second surface. The first surface is configured to be in contact with a heat source, and the second surface is opposite to the first surface and is distant from the heat source. A projection region of the heat dissipation substrate that corresponds to the heat source is defined as a high-temperature region, and a low-temperature region is defined at an outer periphery of the high-temperature region. The fins are opposite to the heat source, and are disposed within the high-temperature region of the second surface of the heat dissipation substrate. The surface porous layer is disposed within a range of the low-temperature region of the heat dissipation substrate.

Abstract: A dummy gate electrode and a dummy gate dielectric are removed to form a recess between adjacent gate spacers. A gate dielectric is deposited in the recess, and a barrier layer is deposited over the gate dielectric. A first work function layer is deposited over the barrier layer. A first anti-reaction layer is formed over the first work function layer, the first anti-reaction layer reducing oxidation of the first work function layer. A fill material is deposited over the first anti-reaction layer.

Abstract: A light emitting device includes a substrate, a wall, at least one light emitting chip, a protection layer, and a reflection layer. The substrate has a mounting surface. The wall is disposed on the mounting surface and has an inner side surface. An accommodation space is defined by the inner side surface and the mounting surface. The light emitting chip has a top light emitting surface and a side light emitting surface, and is disposed in the accommodation space and on the mounting surface. The protection layer is disposed on the top light emitting surface and the side light emitting surface. A gap is formed between the protection layer and the wall. The reflection layer is disposed in the accommodation space and between the inner side surface and the side light emitting surface. The reflection layer is filled in the gap and contacts the mounting surface.

Abstract: Abstract of Disclosure A coil for an inductive power supply system includes a metal conducting wire and a nonmetal spacing wire. The metal conducting wire and the nonmetal spacing wire are wound together to form the coil. An inductive power supply system includes a first coil for a power supply end and a second coil for a power receiving end. Each of the first coil and the second coil is formed by winding a metal conducting wire and a nonmetal spacing wire together.

Abstract: A light emitting device includes a substrate, a wall, at least one light emitting chip, a protection layer, and a reflection layer. The substrate has a mounting surface. The wall is disposed on the mounting surface and has an inner side surface. An accommodation space is defined by the inner side surface and the mounting surface. The light emitting chip has a top light emitting surface and a side light emitting surface, and is disposed in the accommodation space and on the mounting surface. The protection layer is disposed on the top light emitting surface and the side light emitting surface. A gap is formed between the protection layer and the wall. The reflection layer is disposed in the accommodation space and between the inner side surface and the side light emitting surface. The reflection layer is filled in the gap and contacts the mounting surface.

Abstract: A fatigue data generation method, comprising: obtaining, by the camera device, a target image; obtaining, by a processor, a target feature data from the target image, and inputting the target feature data to a fatigue analysis model which stored in a storage unit, wherein the fatigue analysis model comprises a plurality of reference physiological signals, a plurality of reference feature data, a plurality of reference fatigue data and a plurality of correlation parameters; and generating a target fatigue data according to the target feature data, the plurality of reference feature data and the plurality of correlation parameters.

Abstract: An optoelectronic package and a method for producing the optoelectronic package are provided. The optoelectronic package includes a carrier, a photonic device, a first encapsulant and a second encapsulant. The photonic device is disposed on the carrier. The first encapsulant covers the carrier and is disposed around the photonic device. The second encapsulant covers the first encapsulant and the photonic device. The first encapsulant has a topmost position and a bottommost position, and the topmost position is not higher than a surface of the photonic device.

Abstract: An incineration system is adapted for burning an incineration matter, and for generating a regenerative matter by hydrolyzing a hydrolysis matter. The incineration system includes an incineration device, a boiler device, a power generating device, and a thermal hydrolysis device. The incineration device includes an incinerator that is adapted for receiving the incineration matter and for burning the incineration matter to thereby generate heated air. The boiler device receives the heated air from the incinerator and generates steam via the heated air. The power generating device receives the steam from the boiler device to generate electric power. The thermal hydrolysis device includes a tank that is adapted for receiving the hydrolysis matter and the steam. The thermal hydrolysis device is adapted for hydrolyzing the hydrolysis matter via the steam, for generating the regenerative matter by hydrolyzing the hydrolysis matter, and for outputting the regenerative matter.

Abstract: A method for resuming topology of a single loop network and a network switch system are provided. The network switch system includes one or more first network switches each having a first port and a second port and a second network switch having a third port and a fourth port. When the first port of one of the first network switches is abnormal, a recovery control frame is transmitted through the second port. The second network switch sets the third port in a disabled state to an enabled state. When the abnormal port is resumed, the first network switch transmits a block control frame through the second port. The second network switch sets the third port in the enabled state to the disabled state and transmits a forward control frame through the fourth port. The first network switch sets the first port in the disabled state to the enabled state.

Abstract: A millimeter wave communication apparatus includes: an electronic device, including a first waveguide connection port disposed on a casing of the electronic device, and a millimeter wave communication module connected to the first waveguide connection port to transmit and receive millimeter-wave signals; and an expansion device, installed on a carrier, and including a second waveguide connection port disposed on a casing of the expansion device and corresponding to a position of the first waveguide connection port of the electronic device, and at least one millimeter-wave antenna connected to the second waveguide connection port to transmit and receive the millimeter-wave signals. When the electronic device is fastened on the expansion device, the first waveguide connection port and the second waveguide connection port form a waveguide to transmit and receive the millimeter-wave signals. Therefore, attenuation of the millimeter-wave signals is avoided.

Abstract: A coil module for an inductive power supply system includes a first coil, a processor and a control element. The processor, coupled to the first coil, is configured to detect a plurality of resonant frequencies of the first coil corresponding to a plurality of coordinate points, respectively. The control element, coupled to the processor, is configured to control the position of the first coil according to the plurality of resonant frequencies.

Abstract: The present disclosure provides a toughened resin composition, which includes: (A) a toughened and modified compound, which includes a styrene maleic anhydride compound, an anhydride grafted olefin polymer, and a diisocyanate compound; (B) a thermosetting polymer; and (C) a toughening resin; wherein, in the toughened and modified compound, the diisocyanate compound forms a polyimide bond with the styrene maleic anhydride compound and the anhydride grafted olefin polymer, respectively. The present disclosure has high toughness and excellent mechanical properties; thus, it may have a wide range of applications in the fields of electronics, aerospace and the like.

Abstract: A noise reduction structure includes an antenna, a noise source, an electromagnetic conductor, and a grounding member. The antenna has a transmission and reception bandwidth. The noise source radiates an electromagnetic wave. Frequency of the electromagnetic wave falls within the transmission and reception bandwidth. The electromagnetic conductor is closer to the antenna than the noise source. The grounding member is disposed at the noise source in such a manner to face the antenna. The grounding member is electrically isolated from the electromagnetic conductor and forms a good grounding path to the noise source. Furthermore, a transmission dock with the noise reduction structure is provided.

Abstract: A signal analysis circuit for determining whether a supplying-end module of an induction type power supply system receives a modulation signal from a receiving-end module includes a signal receiving circuit, a gain amplifier, a ramp generator, a comparator, a timer and a processor. The signal receiving circuit is configured to obtain a coil signal on a supplying-end coil of the supplying-end module. The gain amplifier is configured to adjust a voltage level of the coil signal to generate an amplification signal. The ramp generator is configured to generate and output a ramp signal. The comparator is configured to compare the amplification signal with the ramp signal to determine a trigger time on which the amplification signal and the ramp signal intersect. The timer is configured to obtain a time data corresponding to the trigger time. The processor is configured to analyze the modulation signal according to the time data.