Abstract: The present invention relates to a method and system for determining devices connected to a private network through a gateway. A Network Management System (NMS) through the use of inquiries and Port Address Translation (PAT) commands is able to determine the topology of the network of devices within a private network and thus communicate with them. This is achieved through the use of Port Address Translation (PAT) initiated by the NMS to set a port for each device connected to the gateway.

Abstract: A system or method for a circuit network that receives an RF signal, and where a plurality of switching transistors receive an RF signal output by the circuit network and perform mixing with a local oscillation (LO) signal received on a LO input. An active bias circuit performs active bias of the plurality of switching transistors in a feedback loop provided between the LO input and an output of the plurality of switching transistors.

Abstract: A semiconductor wafer having solder bumps thereon for use in flip-chip bonded integrated circuits comprises a semiconductor substrate formed with metal bond pads at selected locations thereon, a metal electroplating buss layer or layers over the bond pads, a layer of solder-wettable under bump metal on the buss layer, a layer of barrier metal which overlies and encapsulates the solder-wettable metal, and a solder bump formed on the barrier metal.

Abstract: A semiconductor wafer having solder bumps thereon for use in flip-chip bonded integrated circuits comprises a semiconductor substrate formed with metal bond pads at selected locations thereon, a metal electroplating buss layer or layers over the bond pads, a layer of solder-wettable under bump metal on the buss layer, a layer of barrier metal which overlies and encapsulates the solder-wettable metal, and a solder bump formed on the barrier metal.

Abstract: A method of fabrication of solder bumps on a semiconductor wafer provided with metal bond pads comprises the steps of: (a) applying a metal adhesion/barrier/electroplating buss layer or layers on at least the bond pads; (b) forming a layer of a resist in a predefined pattern defining openings therein over the bond pads; (c) applying a layer of solder-wettable under bump metal into the openings; (d) removing a volume of resist from the regions of the openings to create an opening between an edge of the layer of wettable metal and the resist; (e) applying a layer of a barrier metal over the layer of solder-wettable metal including the openings created at step (d) while encapsulates the layer of wettable metal; (f) fabricating a solder bump onto the layer of barrier metal; and (g) removing the resist material; and (h) removing any exposed adhesion/barrier layer.

Abstract: An apparatus (10) for processing at least one analogue audio signal, including means (24) for receiving a first analogue audio signal, means (48) for converting said first analogue signal into a first digital signal, means for comparing said first digital signal with data representing musical notes, means (44) for selecting a datum representing a reference musical note from said data representing musical notes on the basis of result of comparing said first digital signal with said data representing musical notes, means (62) for converting said datum into a second analogue audio signal, means (28) for outputting said second analogue audio signal, and means (32) for visually representing said second analogue audio signal.

Abstract: A report is generated in an object oriented software environment. A report iterator and a data iterator must have communications there between. The report iterator includes a report group header, a report group body having at least one report field, and a report group footer. Dependency is created between the contents of the report fields and an attribute of the current object. As a result of the communications established, a plurality of objects are stepped through sequentially. The dependency system is signalled each time the current object has changed. Each time the current object has changed, a new value is sent to a report field in the report group body.

Abstract: A reforming process using a Supported Group VIII noble metal reforming catalyst which has been pretreated with an unsaturated aliphatic hydrocarbon at elevated temperatures, thereby lowering activity during initial reforming operations and reducing gas production during the initial operation.

Abstract: Supported Group VIII noble metal reforming catalysts are pretreated with an unsaturated aliphatic hydrocarbon at elevated temperatures, thereby lower activity during initial reforming operation and reducing gas production during the initial operation.

Abstract: A lignocellulosic material, such as wood chips, is pretreated with an aqueous solution containing from 0.1 to 10% by weight of a water soluble lower aliphatic amine selected from monoethanolamine, methylamine and dimethylamine, at elevated temperature and pressure in a closed vessel. This pretreated material is then subjected to conventional soda or two-stage soda-oxygen pulping.