Patents by Inventor Ming-Chu Chueh

Ming-Chu Chueh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Probe head of probe card and manufacturing method of composite board of probe head
    Patent number: 9110130
    Abstract: A probe head of vertical probe card and a manufacturing method of a composite board thereof are provided. The probe head includes guide plate, composite board, and probe pin. The composite board includes first board layer and second board layer which are laminated together by joining operation. The composite board further includes through hole which is made by drilling and passed all the way through the first board layer and the second board layer. The friction coefficient of the first board layer is less than that of the second board layer, and the thermal expansion coefficient of the second board layer is less than that of the first board layer. The probe pin is penetrated all the way through the through hole of the composite board. By this, friction between the probe pin and composite board is reduced so as to stabilize the position of the probe pin.
    Type: Grant
    Filed: July 8, 2011
    Date of Patent: August 18, 2015
    Assignee: MPI Corporation
    Inventors: Ming-Chi Chen, Horng-Kuang Fan, Mao-Fa Shen, Ming-Chu Chueh, Bang-Shun Liu, Che-Wei Lin
  • PROBE HEAD OF PROBE CARD AND MANUFACTURING METHOD OF COMPOSITE BOARD OF PROBE HEAD
    Publication number: 20120007627
    Abstract: A probe head of vertical probe card and a manufacturing method of a composite board thereof are provided. The probe head includes guide plate, composite board, and probe pin. The composite board includes first board layer and second board layer which are laminated together by joining operation. The composite board further includes through hole which is made by drilling and passed all the way through the first board layer and the second board layer. The friction coefficient of the first board layer is less than that of the second board layer, and the thermal expansion coefficient of the second board layer is less than that of the first board layer. The probe pin is penetrated all the way through the through hole of the composite board. By this, friction between the probe pin and composite board is reduced so as to stabilize the position of the probe pin.
    Type: Application
    Filed: July 8, 2011
    Publication date: January 12, 2012
    Inventors: Ming-Chi CHEN, Horng-Kuang Fan, Mao-Fa Shen, Ming-Chu Chueh, Bang-Shun Liu, Che-Wei Lin