Patents by Inventor Ming-Chu Kuo

Ming-Chu Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11757216
    Abstract: In one embodiment, a clip pin of a secondary printed circuit board removably coupled to a primary printed circuit board and a backplate in an information handling system includes: an open end configured to receive a guide pin of the backplate within a clip pin hole of the primary printed circuit board, the guide pin configured to removably couple to the clip pin via the open end; a bulbous portion disposed proximate to the open end, the guide pin causing the bulbous portion to apply an outward force on an inner wall of the clip pin hole; and a plurality of signal pins disposed within the bulbous portion, the outward force causing the plurality of signal pins to communicably couple to the inner wall to transmit a signal from the secondary printed circuit board to the primary printed circuit board.
    Type: Grant
    Filed: February 9, 2022
    Date of Patent: September 12, 2023
    Assignee: Dell Products L.P.
    Inventors: Fong-An Kan, Ming Chu Kuo, Yi-Chu Hsieh, Chun-Min He
  • Publication number: 20230253723
    Abstract: In one embodiment, a clip pin of a secondary printed circuit board removably coupled to a primary printed circuit board and a backplate in an information handling system includes: an open end configured to receive a guide pin of the backplate within a clip pin hole of the primary printed circuit board, the guide pin configured to removably couple to the clip pin via the open end; a bulbous portion disposed proximate to the open end, the guide pin causing the bulbous portion to apply an outward force on an inner wall of the clip pin hole; and a plurality of signal pins disposed within the bulbous portion, the outward force causing the plurality of signal pins to communicably couple to the inner wall to transmit a signal from the secondary printed circuit board to the primary printed circuit board.
    Type: Application
    Filed: February 9, 2022
    Publication date: August 10, 2023
    Inventors: Fong-An Kan, Ming Chu Kuo, Yi-Chu Hsieh, Chun-Min He
  • Patent number: 8080864
    Abstract: For improving efficiency of a power device having an exposed surface capable of radiating energy, a shielding layer is disposed in between the exposed surface and a conductive layer. The shielding layer causes at least a portion of the energy to be directed back into the power device, thereby substantially preventing the energy from inducing eddy currents in the conductive layer. The conductive layer is fabricated from a metal foil for compliance with electromagnetic energy leakage regulations.
    Type: Grant
    Filed: December 15, 2008
    Date of Patent: December 20, 2011
    Assignee: Dell Products L.P.
    Inventors: Wen-Hung Huang, Ming-Chu Kuo, Hsien Tsung Lin
  • Patent number: 8018309
    Abstract: For improving efficiency of a power device having an exposed surface capable of radiating energy, a shielding layer is disposed in between the exposed surface and a conductive layer. The shielding layer causes at least a portion of the energy to be directed back into the power device, thereby substantially preventing the energy from inducing eddy currents in the conductive layer. The conductive layer is fabricated from a metal foil for compliance with electromagnetic energy leakage regulations.
    Type: Grant
    Filed: October 23, 2008
    Date of Patent: September 13, 2011
    Assignee: Dell Products L.P.
    Inventors: Wen-Hung Huang, Ming-Chu Kuo, Hsien Tsung Lin
  • Publication number: 20090091415
    Abstract: For improving efficiency of a power device having an exposed surface capable of radiating energy, a shielding layer is disposed in between the exposed surface and a conductive layer. The shielding layer causes at least a portion of the energy to be directed back into the power device, thereby substantially preventing the energy from inducing eddy currents in the conductive layer. The conductive layer is fabricated from a metal foil for compliance with electromagnetic energy leakage regulations.
    Type: Application
    Filed: December 15, 2008
    Publication date: April 9, 2009
    Applicant: DELL PRODUCTS L.P.
    Inventors: Wen-Hung Huang, Ming-Chu Kuo, Hsien Tsung Lin
  • Patent number: 7514765
    Abstract: For improving efficiency of a power device having an exposed surface capable of radiating energy, a shielding layer is disposed in between the exposed surface and a conductive layer. The shielding layer causes at least a portion of the energy to be directed back into the power device, thereby substantially preventing the energy from inducing eddy currents in the conductive layer. The conductive layer is fabricated from a metal foil for compliance with electromagnetic energy leakage regulations.
    Type: Grant
    Filed: April 25, 2006
    Date of Patent: April 7, 2009
    Assignee: Dell Products L.P.
    Inventors: Wen-Hung Huang, Ming-Chu Kuo, Hsien Tsung Lin
  • Publication number: 20090040003
    Abstract: For improving efficiency of a power device having an exposed surface capable of radiating energy, a shielding layer is disposed in between the exposed surface and a conductive layer. The shielding layer causes at least a portion of the energy to be directed back into the power device, thereby substantially preventing the energy from inducing eddy currents in the conductive layer. The conductive layer is fabricated from a metal foil for compliance with electromagnetic energy leakage regulations.
    Type: Application
    Filed: October 23, 2008
    Publication date: February 12, 2009
    Applicant: DELL PRODUCTS L.P.
    Inventors: Wen-Hung Huang, Ming-Chu Kuo, Hsien Tsung Lin
  • Publication number: 20070246749
    Abstract: For improving efficiency of a power device having an exposed surface capable of radiating energy, a shielding layer is disposed in between the exposed surface and a conductive layer. The shielding layer causes at least a portion of the energy to be directed back into the power device, thereby substantially preventing the energy from inducing eddy currents in the conductive layer. The conductive layer is fabricated from a metal foil for compliance with electromagnetic energy leakage regulations.
    Type: Application
    Filed: April 25, 2006
    Publication date: October 25, 2007
    Applicant: Dell Products L.P.
    Inventors: Wen-Hung Huang, Ming-Chu Kuo, Hsien Lin
  • Patent number: D440335
    Type: Grant
    Filed: June 2, 1999
    Date of Patent: April 10, 2001
    Inventor: Ming-Chu Kuo