Abstract: A method includes attaching a die to a thermal compression bonding (TCB) head through vacuum suction, wherein the die comprises a plurality of conductive pillars, attaching a first substrate to a chuck through vacuum suction, wherein the first substrate comprises a plurality of solder bumps, contacting a first conductive pillar of the plurality of conductive pillars to a first solder bump of the plurality of solder bumps, wherein contacting the first conductive pillar to the first solder bump results in a first height between a topmost surface of the first conductive pillar and a bottommost surface of the first solder bump, and adhering the first solder bump to the first conductive pillar to form a first joint, wherein adhering the first solder bump to the first conductive pillar comprises heating the TCB head.

Abstract: A lighting device includes a light board and a light dimmer circuit. The light board includes multiple first light emitting elements and second light emitting elements. The first light emitting elements are disposed in a first area of the light board. The second light emitting elements are disposed in a second area of the light board. The light dimmer circuit is configured to drive the second light emitting elements to generate flickering lights from the second area of the light board, and is configured to drive the first light emitting elements to generate non-flickering lights from the first area of the light board.

Abstract: A semiconductor package includes a conductive pillar and a solder. The conductive pillar has a first sidewall and a second sidewall opposite to the first sidewall, wherein a height of the first sidewall is greater than a height of the second sidewall. The solder is disposed on and in direct contact with the conductive pillar, wherein the solder is hanging over the first sidewall and the second sidewall of conductive pillar.

Abstract: A method includes directing light at a first side of a semiconductor structure; detecting a first light intensity at a second side of the semiconductor structure, wherein the first light intensity corresponds to the light that penetrated the semiconductor structure from the first side to the second side; and comparing the first light intensity to a second light intensity, wherein the second light intensity corresponds to an expected intensity of light.

Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a UE. In certain configurations, the UE establishes a connection supporting an extended reality (XR) application service with a base station. The UE reports, to the base station under a trigger condition, a buffer status report (BSR) to indicate a buffer size for data to be transmitted to the base station. The BSR includes information related to a corresponding BSR table. The UE receives a configuration instruction from the base station. The UE configures resources on the UE.

Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a UE. In certain configurations, the UE establishes a connection supporting an extended reality (XR) application service with a base station. The UE reports, to the base station, a delay status report (DSR) to indicate a buffer size for data to be transmitted to the base station. The DSR includes timing information. The UE receives a configuration instruction from the base station. The UE configures resources on the UE according to the configuration instruction to transmit the data to the base station.

Abstract: A radar signal processing system with a self-interference cancelling function includes an analog front end (AFE) processor, an analog to digital converter (ADC), an adaptive interference canceller (AIC), and a digital to analog converter (DAC). The AFE processor receives an original input signal and generates an analog input signal. The ADC converts the analog input signal to a digital input signal. The AIC generates a digital interference signal digital interference signal by performing an adaptive interference cancellation process according to the digital input signal. The DAC converts the digital interference signal to an analog interference signal. Finally, the analog interference signal is fed back to the AFE and cancelled from the original input signal in the AFE processor while performing the front end process, reducing the interference of the static interference from the leaking of a close-by transmitter during the front end process.

Abstract: A light-folding element includes an object-side surface, an image-side surface, a reflection surface and a connection surface. The reflection surface is configured to reflect imaging light passing through the object-side surface to the image-side surface. The connection surface is connected to the object-side, image-side and reflection surfaces. The light-folding element has a recessed structure located at the connection surface. The recessed structure is recessed from the connection surface an includes a top end portion, a bottom end portion and a tapered portion located between the top end and bottom end portions. The top end portion is located at an edge of the connection surface. The tapered portion has two tapered edges located on the connection surface. The tapered edges are connected to the top end and bottom end portions. A width of the tapered portion decreases in a direction from the top end portion towards the bottom end portion.

Abstract: A timing method and communication apparatus therefor. The timing method, performed by a mobile communication device, includes: activating a first communication module; receiving updated information when the first communication module is active; determining and setting an expiry time for an adaptive timer based on the updated information; activating the adaptive timer to count to the determined expiry time; and activating a second communication module when the adaptive timer expires.

Abstract: A timing method and communication apparatus therefor. The timing method, performed by a mobile communication device, includes: activating a first communication module; receiving updated information when the first communication module is active; determining and setting an expiry time for an adaptive timer based on the updated information; activating the adaptive timer to count to the determined expiry time; and activating a second communication module when the adaptive timer expires.

Abstract: A printed circuit board includes an insulated base sheet, a heat-conducting layer, an insulated layer, a plurality of heat-conducting blocks, and a plurality of bonding pads. The heat-conducting layer is disposed on the insulated base sheet. The insulated layer is partially coated on the heat-conducting layer, leaving a plurality of exposed zones remaining thereon. The heat-conducting blocks are correspondingly formed on the exposed zones. The bonding pads are positioned on the heat-conducting layer for soldering circuit elements.

Abstract: A method of reducing interference between two communication systems operating in adjacent frequency bands and coexisting in a communication device is provided, and the two communication systems are a first communication system and a second communication system. The method includes deciding whether to perform an arbitration procedure on a downlink subframe of the first communication system according to a CINR of the first communication system and a RSSI of the second communication system; deciding whether to perform the arbitration procedure on an uplink subframe of the first communication system according to a transmit power of the first communication system and a RSSI value of the second communication system; and when deciding to perform the arbitration procedure on the downlink or uplink subframe, further deciding whether to send a specific packet to request one or more stations not to send packets to the second communication system.

Abstract: A printed circuit board includes an insulated base sheet, a heat-conducting layer, an insulated layer, a plurality of heat-conducting blocks, and a plurality of bonding pads. The heat-conducting layer is disposed on the insulated base sheet. The insulated layer is partially coated on the heat-conducting layer, leaving a plurality of exposed zones remaining thereon. The heat-conducting blocks are correspondingly formed on the exposed zones. The bonding pads are positioned on the heat-conducting layer for soldering circuit elements.

Abstract: A printed circuit board includes an insulated base sheet, a heat-conducting layer, and a plurality of heat-conducting blocks. The heat-conducting layer is disposed on the insulated base sheet. The heat-conducting blocks are formed on the heat-conducting layer. Each of the heat-conducting blocks is separated from each other.

Abstract: A method of reducing interference between two communication systems operating in adjacent frequency bands and coexisting in a communication device is provided, and the two communication systems are a first communication system using TDD and a second communication system which is content-based. The method includes deciding whether to perform an arbitration procedure on a downlink subframe of the first communication system according to a CINR of the first communication system and a RSSI of the second communication system; deciding whether to perform the arbitration procedure on an uplink subframe of the first communication system according to a transmit power of the first communication system and a RSSI value of the second communication system; and when deciding to perform the arbitration procedure on the downlink or uplink subframe, further deciding whether to send a specific packet to request one or more stations not to send packets to the second communication system.

Abstract: A printed circuit board includes an insulated base sheet, a heat-conducting layer, and a plurality of heat-conducting blocks. The heat-conducting layer is disposed on the insulated base sheet. The heat-conducting blocks are formed on the heat-conducting layer. Each of the heat-conducting blocks is separated from each other.