Patents by Inventor Ming-Chun Hsieh

Ming-Chun Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120235957
    Abstract: A portable electronic device, including a housing defining an earphone connector, a touch screen, and a stylus having a stylus body, a tip and a pin connecting the stylus body with tip, and the pin and the tip are detachably secured in the earphone connector.
    Type: Application
    Filed: October 28, 2011
    Publication date: September 20, 2012
    Applicant: CHI MEI COMMUNICATION SYSTEMS, INC.
    Inventors: YOU-ZHANG LIN, ZHANG-MING HUANG, MING-CHUN HSIEH, YUNG-SHENG HSU, CHUN-WEI WU
  • Patent number: 6877385
    Abstract: There is disclosed a semiconductor sensor for measuring the contact shear stress distribution between the socket of an above-knee (AK) prostheses and the soft tissue of an amputee's stump. The sensor is fabricated by the micro-electro-mechanical system (MEMS) technology, and its main sensing part is 2-X shaped with a flange structure. The sensor is prepared by anisotropic wet etching of bulk silicon in KOH solution and a square flange above the sensing diaphragm is formed through surface micromachining of deposited SiO2 thin film. This invention has the following characteristics: piezo-resistivity of the monolithic silicon will be utilized to convert shear deformation of the sensor into an electrical signal and a micro sensor which can measure the shear force vector acting on the sensing flange.
    Type: Grant
    Filed: October 22, 2001
    Date of Patent: April 12, 2005
    Assignee: National Science Council
    Inventors: Yean-Kuen Fang, Ming-Shanng Ju, Jyh-Jier Ho, Gin-Shin Chen, Ming-Chun Hsieh, Shyh-Fann Ting, Chung-Hsien Yang
  • Publication number: 20020174727
    Abstract: In this invention, a contact type micro piezoresistive shear-stress sensor is fabricated by the micro-electro-mechanical (MEMS) technology, and its main sensing part is a 2-X shaped with a flange structure, for measuring the shear stress distribution between socket of above-knee (AK) prostheses and the soft tissue of amputee's stump. Comparing with a conventional shear stress sensor, this invention owns the following characteristics: piezo-resistivity of the monolithic silicon will be utilized to convert shear deformation of the sensor into electrical signal and a micro sensor which can measure the shear force vector acting the sensing flange.
    Type: Application
    Filed: October 22, 2001
    Publication date: November 28, 2002
    Inventors: Yean-Kuen Fang, Ming-Shanng Ju, Jyh-Jier Ho, Gin-Shin Chen, Ming-Chun Hsieh, Shyh-Fann Ting, Chung-Hsien Yang