Patents by Inventor Ming-Chun Huang

Ming-Chun Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153945
    Abstract: The present invention provides a chip including an I/O pin and an ESD protection circuit. The ESD protection circuit includes a P-type device and a first diode, wherein the P-type device is coupled between the I/O pin and a ground voltage, and an anode of the first diode is directly connected to the I/O pin. In addition, the ESD protection circuit does not comprise any device whose N-type doping/diffusion is directly connected to the I/O pin.
    Type: Application
    Filed: September 27, 2023
    Publication date: May 9, 2024
    Applicant: MEDIATEK INC.
    Inventors: Ming-Chun Chen, Bo-Shih Huang
  • Publication number: 20240151814
    Abstract: The present disclosure provides a radar object recognition method, which includes steps as follows. The radar image generation is performed on radar data to generate a radar image; the radar image is inputted into an object recognition model, so that the object recognition model outputs a recognition result; the post-process is performed on the recognition result to eliminate recognition errors from the recognition result.
    Type: Application
    Filed: February 21, 2023
    Publication date: May 9, 2024
    Inventors: Ta-Sung LEE, Ming-Chun LEE, Tai-Yuan HUANG, Chia-Hsing YANG
  • Patent number: 11977249
    Abstract: An optical device is provided. The optical device includes a ring waveguide and a bus waveguide. The ring waveguide includes a coupling region. The bus waveguide is disposed adjacent to and spaced apart from the coupling region of the ring waveguide. The bus waveguide includes a coupling structure corresponding to the coupling region.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: May 7, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Cheng-Tse Tang, Chewn-Pu Jou, Lan-Chou Cho, Ming Yang Jung, Tai-Chun Huang
  • Publication number: 20240134193
    Abstract: The present specification describes examples of position-based switching of display devices. An example augmented reality (AR) device includes an AR display device to render display data. The example AR device also includes a wireless communication device to transmit and receive wireless signals. The example AR device further includes a processor to: 1) determine a position of the AR device relative to a computing device based on wireless signals communicated with the computing device; and 2) switch an activity state of the AR display device based on the determined position of the AR device relative to the computing device.
    Type: Application
    Filed: October 24, 2022
    Publication date: April 25, 2024
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chung-Chun CHEN, Ming-Shien TSAI, Chih-Ming HUANG
  • Publication number: 20240115616
    Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 11, 2024
    Inventors: Po-Cheng Lin, Pi-Chun Huang, Zih-Han Hong, Ming-Hsi Chuang, Yi-Chun Lin, Chia-Hsin Lee, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang
  • Patent number: 11955484
    Abstract: A semiconductor device includes a semiconductor substrate having a first region and a second region, insulators, gate stacks, and first and second S/Ds. The first and second regions respectively includes at least one first semiconductor fin and at least one second semiconductor fin. A width of a middle portion of the first semiconductor fin is equal to widths of end portions of the first semiconductor fin. A width of a middle portion of the second semiconductor fin is smaller than widths of end portions of the second semiconductor fin. The insulators are disposed on the semiconductor substrate. The first and second semiconductor fins are sandwiched by the insulators. The gate stacks are over a portion of the first semiconductor fin and a portion of the second semiconductor fin. The first and second S/Ds respectively covers another portion of the first semiconductor fin and another portion of the second semiconductor fin.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuan-Jung Chen, I-Chih Chen, Chih-Mu Huang, Kai-Di Wu, Ming-Feng Lee, Ting-Chun Kuan
  • Patent number: 11935871
    Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang, Ming-Hung Tseng, Kris Lipu Chuang, Chung-Ming Weng, Tsung-Yuan Yu, Tzuan-Horng Liu
  • Patent number: 11920996
    Abstract: A pressure sensor array can be used to record a pressure distribution in gait analysis and/or tactile sensing applications. The pressure sensor array can include a piezo-resistive material and a uniform distribution of a plurality of flexible circuits. Each of the plurality of flexible circuits comprise at least one wire connecting an internal portion of a respective flexible circuit to a common port. A device housing the pressure sensor array can be customized to a size and used for a gait analysis and/or tactile sensing application. The arrangement of the wiring permits partial sensors to be used as part of the pressure sensor array during the gait analysis and/or tactile sensing application.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: March 5, 2024
    Assignee: CASE WESTERN RESERVE UNIVERSITY
    Inventors: Ming-Chun Huang, Diliang Chen
  • Patent number: 11617537
    Abstract: A fabric-based pressure sensor array includes: (1) a first layer including M elongated conductive strips coated thereon; (2) a second layer including N elongated conductive strips coated thereon, the M elongated conductive strips extending crosswise relative to the N elongated conductive strips to define M×N intersections; and (3) a unitary textile sheet extending between the first layer and the second layer so as to overlap the M×N intersections, the textile sheet having a variable resistivity in response to applied pressure so as to define M×N pressure sensors at locations corresponding to the M×N intersections.
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: April 4, 2023
    Assignees: The Regent of the University of California, Medisens Wireless, Inc.
    Inventors: Majid Sarrafzadeh, Wenyao Xu, Ming-Chun Huang, Nitin Raut, Behrooz Yadegar
  • Patent number: 11497630
    Abstract: A system can be used to record real-time pressure and/or shear force data within a socket for a prosthetic device. The system includes a socket for a prosthetic device that can be designed to fit a patient's residual limb. The system also includes a sensor array that can be placed within the socket for the prosthetic device to detect pressure and/or shear force on the patient's residual limb. The sensor array includes a piezo-electric material and a uniform distribution of a plurality of metal pads on either side of the piezo-electric material. Each of the plurality of metal pads on either side of the piezo-electric material comprises at least one wire connected to a common port.
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: November 15, 2022
    Assignee: CASE WESTERN RESERVE UNIVERSITY
    Inventors: Ming-Chun Huang, Hongping Zhao
  • Publication number: 20210048358
    Abstract: A pressure sensor array can be used to record a pressure distribution in gait analysis and/or tactile sensing applications. The pressure sensor array can include a piezo-resistive material and a uniform distribution of a plurality of flexible circuits. Each of the plurality of flexible circuits comprise at least one wire connecting an internal portion of a respective flexible circuit to a common port. A device housing the pressure sensor array can be customized to a size and used for a gait analysis and/or tactile sensing application.
    Type: Application
    Filed: March 11, 2019
    Publication date: February 18, 2021
    Inventors: Ming-Chun Huang, Diliang Chen
  • Patent number: 10918312
    Abstract: This disclosure relates to systems and methods to analyze gait, balance or posture information extracted from data collected by one or more wearable and connected sensor devices with sensors embedded therewithin. The embedded sensors include a three-axis accelerometer, a three-axis gyroscope and an array of pressure sensors. Sensor data detected by the sensors can be received by a mobile computing device, which can analyze the sensor data to identify a pattern related to gait, balance or posture within the sensor data; and apply a statistical/machine learning-based classification to the pattern related to gait, balance or posture to assign a clinical parameter to the pattern characterizing a risk of a slip, trip and fall event.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: February 16, 2021
    Assignees: CASE WESTERN RESERVE UNIVERSITY, THE RESEARCH FOUNDATION FOR STATE UNIVERSITY OF NEW YORK
    Inventors: Ming-Chun Huang, Wenyao Xu
  • Publication number: 20190307584
    Abstract: A system can be used to record real-time pressure and/or shear force data within a socket for a prosthetic device. The system includes a socket for a prosthetic device that can be designed to fit a patient's residual limb. The system also includes a sensor array that can be placed within the socket for the prosthetic device to detect pressure and/or shear force on the patient's residual limb. The sensor array includes a piezo-electric material and a uniform distribution of a plurality of metal pads on either side of the piezo-electric material. Each of the plurality of metal pads on either side of the piezo-electric material comprises at least one wire connected to a common port.
    Type: Application
    Filed: April 9, 2019
    Publication date: October 10, 2019
    Inventors: Ming-Chun Huang, Hongping Zhao
  • Publication number: 20180279915
    Abstract: This disclosure relates to systems and methods to analyze gait, balance or posture information extracted from data collected by one or more wearable and connected sensor devices with sensors embedded therewithin. The embedded sensors include a three-axis accelerometer, a three-axis gyroscope and an array of pressure sensors. Sensor data detected by the sensors can be received by a mobile computing device, which can analyze the sensor data to identify a pattern related to gait, balance or posture within the sensor data; and apply a statistical/machine learning-based classification to the pattern related to gait, balance or posture to as sign a clinical parameter to the pattern characterizing a risk of a slip, trip and fall event.
    Type: Application
    Filed: September 28, 2016
    Publication date: October 4, 2018
    Inventors: Ming-Chun Huang, Wenyao Xu
  • Publication number: 20160135744
    Abstract: A fabric-based pressure sensor array includes: (1) a first layer including M elongated conductive strips coated thereon; (2) a second layer including N elongated conductive strips coated thereon, the M elongated conductive strips extending crosswise relative to the N elongated conductive strips to define M×N intersections; and (3) a unitary textile sheet extending between the first layer and the second layer so as to overlap the M×N intersections, the textile sheet having a variable resistivity in response to applied pressure so as to define M×N pressure sensors at locations corresponding to the M×N intersections.
    Type: Application
    Filed: January 20, 2016
    Publication date: May 19, 2016
    Inventors: Majid Sarrafzadeh, Wenyao Xu, Ming-Chun Huang, Nitin Raut, Behrooz Yadegar
  • Patent number: 9330342
    Abstract: A system includes a pressure sensitive material that provides an indication of applied pressure for multiple locations on the material, and an analysis device in communication with the pressure sensitive material. The analysis device receives the indication of applied pressure, determines, for each of multiple measurement periods, a pressure image from the indication of applied pressure such that a sequence of pressure images is determined, and constructs a manifold representing the sequence of pressure images.
    Type: Grant
    Filed: December 10, 2013
    Date of Patent: May 3, 2016
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Majid Sarrafzadeh, Wenyao Xu, Ming-Chun Huang, Jason J. Liu
  • Patent number: 9271665
    Abstract: A fabric-based pressure sensor array includes: (1) a first layer including M elongated conductive strips coated thereon; (2) a second layer including N elongated conductive strips coated thereon, the M elongated conductive strips extending crosswise relative to the N elongated conductive strips to define M×N intersections; and (3) a unitary textile sheet extending between the first layer and the second layer so as to overlap the M×N intersections, the textile sheet having a variable resistivity in response to applied pressure so as to define M×N pressure sensors at locations corresponding to the M×N intersections.
    Type: Grant
    Filed: May 18, 2012
    Date of Patent: March 1, 2016
    Assignees: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA, MEDISENS WIRELESS, INC.
    Inventors: Majid Sarrafzadeh, Wenyao Xu, Ming-Chun Huang, Nitin Raut, Behrooz Yadegar
  • Publication number: 20140157911
    Abstract: A system includes a pressure sensitive material that provides an indication of applied pressure for multiple locations on the material, and an analysis device in communication with the pressure sensitive material. The analysis device receives the indication of applied pressure, determines, for each of multiple measurement periods, a pressure image from the indication of applied pressure such that a sequence of pressure images is determined, and constructs a manifold representing the sequence of pressure images.
    Type: Application
    Filed: December 10, 2013
    Publication date: June 12, 2014
    Inventors: Majid Sarrafzadeh, Wenyao Xu, Ming-Chun Huang, Jason J. Liu
  • Patent number: 8531339
    Abstract: An electronic device is provided, including a main body, a battery detachably received in the main body, a stopper disposed in a predetermined position to restrict the battery in the main body, an antenna disposed on the stopper, and a cover connected with the stopper and movable relative to the stopper between a first position and a second position. When the cover is in the first position, the cover is engaged with the main body and restricts the stopper in the predetermined position. When the cover is moved from the first position along a first direction to the second position, the cover is disengaged from the main body, and the stopper is releasable from the predetermined position along a second direction.
    Type: Grant
    Filed: January 28, 2011
    Date of Patent: September 10, 2013
    Assignee: HTC Corporation
    Inventors: Lin-Chin Huang, Chia-Yan Hsu, Kuo-Chuan Liao, Ming-Chun Huang
  • Publication number: 20120323501
    Abstract: A fabric-based pressure sensor array includes: (1) a first layer including M elongated conductive strips coated thereon; (2) a second layer including N elongated conductive strips coated thereon, the M elongated conductive strips extending crosswise relative to the N elongated conductive strips to define M×N intersections; and (3) a unitary textile sheet extending between the first layer and the second layer so as to overlap the M×N intersections, the textile sheet having a variable resistivity in response to applied pressure so as to define M×N pressure sensors at locations corresponding to the M×N intersections.
    Type: Application
    Filed: May 18, 2012
    Publication date: December 20, 2012
    Inventors: Majid Sarrafzadeh, Wenyao Xu, Ming-Chun Huang, Nitin Raut, Behrooz Yadegar