Abstract: The present disclosure provides an electronic device including a substrate, a semiconductor disposed on the substrate, and a conductive layer disposed on the semiconductor. The conductive layer has a first electrode and a second electrode, in which the first electrode is electrically connected to the semiconductor, and the second electrode surrounds the first electrode in a top view direction of the electronic device.

Abstract: A method includes attaching a die to a thermal compression bonding (TCB) head through vacuum suction, wherein the die comprises a plurality of conductive pillars, attaching a first substrate to a chuck through vacuum suction, wherein the first substrate comprises a plurality of solder bumps, contacting a first conductive pillar of the plurality of conductive pillars to a first solder bump of the plurality of solder bumps, wherein contacting the first conductive pillar to the first solder bump results in a first height between a topmost surface of the first conductive pillar and a bottommost surface of the first solder bump, and adhering the first solder bump to the first conductive pillar to form a first joint, wherein adhering the first solder bump to the first conductive pillar comprises heating the TCB head.

Abstract: An electronic device includes a first substrate structure, multiple electronic elements and a second substrate structure. The first substrate structure includes a first substrate. The electronic elements are disposed on the first substrate. The second substrate structure is coupled to the first substrate structure. The second substrate structure includes a second substrate, a protection circuit, a driving circuit and a bonding pad. The protection circuit is disposed on the second substrate. The driving circuit is disposed on the second substrate and configured to drive at least a part of the electronic elements. The bonding pad is disposed on the second substrate. The protection circuit is respectively coupled to the bonding pad and the driving circuit. The electronic device may reduce the damage caused by electrostatic discharge or reduce the impact of the bonding process of the bonding pad on signal conduction.

Abstract: A modulation device includes a substrate, an electrostatic discharge protection element, an electronic element, and a driving element. The substrate has an active region. The electrostatic discharge protection element is arranged around the active region. The electronic element is disposed in the active region. The driving element is electrically connected to the electronic element.

Abstract: An electrical connection structure is provided. The electrical connection structure includes a through hole, a first pad, a second pad and a conductive bridge. The through hole has a first end and a second end. The first pad at least partially surrounds the first end of the through hole and is electrically connected to a first circuit. The second pad is located at the second end of the through hole and is electrically connected to a second circuit. The conductive bridge is connected to the first pad and second pad through the through hole, thereby making the first and second circuits electrically connected to each other.

Abstract: Some embodiments of the present disclosure relate to an integrated chip including an extended via that spans a combined height of a wire and a via and that has a smaller footprint than the wire. The extended via may replace a wire and an adjoining via at locations where the sizing and the spacing of the wire are reaching lower limits. Because the extended via has a smaller footprint than the wire, replacing the wire and the adjoining via with the extended via relaxes spacing and allows the size of the pixel to be further reduced. The extended via finds application for capacitor arrays used for pixel circuits.

Abstract: The present disclosure provides an electronic device including a substrate, a common electrode, and a plurality of pixels. The common electrode is disposed on the substrate. The pixels are disposed on the substrate, and at least one of the pixels includes a thin film transistor, a first electrode, a second electrode, and an auxiliary electrode. The first electrode is electrically connected to the thin film transistor. The auxiliary electrode is partially overlapped with the first electrode in a top view direction of the electronic device. The auxiliary electrode is electrically connected to the common electrode and electrically isolated from the first electrode, and the first electrode and the auxiliary electrode have a minimum distance less than a minimum distance between the first electrode and the common electrode.

Abstract: The ventilative sole structure includes a sole, a first one-way valve, and a second one-way valve. The sole's heel portion includes a hollow chamber inside and a bottom piece beneath the chamber. The first one-way valve is configured on a circumferential wall of the chamber. The second one-way valve is configured between a tread portion of the sole and the chamber. When a user wears a shoe with the ventilative sole structure, air enters the chamber through the first one-way valve when the user raises his/her feet, and air is released from the chamber through the second one-way valve towards the tread portion when the user treads on the ground and compresses the chamber, thereby enhancing ventilation and removing odor of the shoe.

Abstract: The ventilative sole structure includes a sole, a first one-way valve, and a second one-way valve. The sole's heel portion includes a hollow chamber inside and a bottom piece beneath the chamber. The first one-way valve is configured on a circumferential wall of the chamber. The second one-way valve is configured between a tread portion of the sole and the chamber. When a user wears a shoe with the ventilative sole structure, air enters the chamber through the first one-way valve when the user raises his/her feet, and air is released from the chamber through the second one-way valve towards the tread portion when the user treads on the ground and compresses the chamber, thereby enhancing ventilation and removing odor of the shoe.

Abstract: A keyboard definition updating method for a computer system includes generating an updating scan code; storing the updating scan code into a storage device of the computer system; and accessing the updating scan code when the updating scan code stored in the storage device is detected and utilizing the updating scan code for the scan code of the computer system.

Abstract: A keyboard definition updating method for a computer system includes generating an updating scan code; storing the updating scan code into a storage device of the computer system; and accessing the updating scan code when the updating scan code stored in the storage device is detected and utilizing the updating scan code for the scan code of the computer system.