Abstract: An optical module includes an electronic assembly and an optical assembly. The electronic assembly includes a circuit board and a chip component. The optical assembly disposed on the electronic assembly includes a bracket and an optical component. The bracket surrounds the chip component and has at least two conductive layers separated from each other. The conductive layers are electrically connected to the electronic assembly. The optical assembly is disposed on the bracket and has at least one light-transmissive conductive layer which is electrically connected to the conductive layers.

Abstract: An optical module includes an electronic assembly and an optical component. The electronic assembly includes a chip component and a circuit board. The optical assembly disposed on the electronic assembly includes a bracket and an optical component. The bracket surrounds the chip component and has at least two conductive layers separated from each other. The conductive layers extend to the bottom of the bracket and are electrically connected to the electronic assembly. The optical assembly is disposed on the bracket and has at least one light-transmissive conductive layer which is electrically connected to the conductive layers.

Abstract: An optical module includes an electronic assembly and an optical component. The electronic assembly includes a chip component and a circuit board. The optical assembly disposed on the electronic assembly includes a bracket and an optical component. The bracket surrounds the chip component and has at least two conductive layers separated from each other. The conductive layers extend to the bottom of the bracket and are electrically connected to the electronic assembly. The optical assembly is disposed on the bracket and has at least one light-transmissive conductive layer which is electrically connected to the conductive layers.

Abstract: An optical module includes an electronic assembly and an optical assembly. The electronic assembly includes a circuit board and a chip component. The optical assembly disposed on the electronic assembly includes a bracket and an optical component. The bracket surrounds the chip component and has at least two conductive layers separated from each other. The conductive layers are electrically connected to the electronic assembly. The optical assembly is disposed on the bracket and has at least one light-transmissive conductive layer which is electrically connected to the conductive layers.

Abstract: The desulfurization of fossil fuels is provided by the combination of fossil fuels with an aqueous mixture of ozone or hydrogen peroxide and a Tetraoctylphosphonium salt phase transfer catalyst, and the mixture is then subjected to reactive mixing to form oxidize sulfur compounds in the fuel. The polar oxidized sulfones species are removed via another mixing step. The desulfurization device can be in the form of a portable device which provides for continuous mixing-assisted desulfurization for the removal of sulfur containing compounds from fossil fuels such as diesel fuel.

Abstract: The desulfurization of fossil fuels is provided by the combination of fossil fuels with an aqueous mixture of ozone or hydrogen peroxide and a Tetraoctylphosphonium salt phase transfer catalyst, and the mixture is then subjected to reactive mixing to form oxidize sulfur compounds in the fuel. The polar oxidized sulfones species are removed via another mixing step. The desulfurization device can be in the form of a portable device which provides for continuous mixing-assisted desulfurization for the removal of sulfur containing compounds from fossil fuels such as diesel fuel.

Abstract: The present invention relates to an apparatus for conduiting and piping, comprising (1) a device to produce negative pressure, and (2) a shuttle, comprising a body, to link a conducting wire on its rear end. The present invention also relates to a shuttle for conduiting and piping.