Abstract: A sensor device includes a plurality of wires that are adapted to be disposed on an object, a control circuit that is electrically coupled to the wires, and a conductive member that is electrically coupled to the control circuit. Each of the wires has a detection section. The conductive member is operable to contact the detection sections of the wires. The detection sections are urged to move relative to the conductive member when the object is deformed, so that a quantity of the detection sections in contact with the conductive member varies with deformation of the object. When the conductive member is in contact with the detection section of any one of the wires, the conductive member and the one of the wires cooperatively form one closed circuit. The control circuit is adapted to transmit data of a quantity of the closed circuit to an external device.

Abstract: Systems, methods and apparatus for dispensing of paper products. A dispenser comprising a housing comprising a product holding area defined by a front, back and two sides, and a dispenser throat defining an opening through the housing; a motor coupled to the rolled product and configured to rotate the rolled product in first and second directions; and a feed mechanism having a first side opening and a second side opening different from the first side opening, wherein both the first side and second side openings are different from that dispenser throat, and wherein the first side opening is configured to accept the tail when the rolled product has a first orientation and is rotated in the first direction and the second side opening is configured to accept the tail when the rolled product has a second orientation and is rotated in the second direction.

Abstract: An antenna device includes a first substrate, a second substrate, an antenna layer, and a redistribution layer. The first substrate has a first surface, a second surface opposite to the first surface, and an inclined sidewall adjoining the first and second surfaces. The second substrate is below the first substrate. The first surface of the first substrate faces toward the second substrate. The antenna layer is located on the first surface of the first substrate. The redistribution layer extends from the second surface of the first substrate to the second substrate along the inclined sidewall of the first substrate, and the redistribution layer has a first section in contact with an end of the antenna layer.

Abstract: A chip package includes a semiconductor substrate, a supporting element, an antenna layer, and a redistribution layer. The semiconductor substrate has an inclined sidewall and a conductive pad that protrudes from the inclined sidewall. The supporting element is located on the semiconductor substrate, and has a top surface facing away from the semiconductor substrate, and has an inclined sidewall adjoining the top surface. The antenna layer is located on the top surface of the supporting element. The redistribution layer is located on the inclined sidewall of the supporting element, and is in contact with a sidewall of the conductive pad and an end of the antenna.

Abstract: Systems, methods and apparatus for dispensing of paper products. A dispenser comprising a housing comprising a product holding area defined by a front, back and two sides, and a dispenser throat defining an opening through the housing; a motor coupled to the rolled product and configured to rotate the rolled product in first and second directions; and a feed mechanism having a first side opening and a second side opening different from the first side opening, wherein both the first side and second side openings are different from that dispenser throat, and wherein the first side opening is configured to accept the tail when the rolled product has a first orientation and is rotated in the first direction and the second side opening is configured to accept the tail when the rolled product has a second orientation and is rotated in the second direction.

Abstract: An antenna device includes a first substrate, a second substrate, an antenna layer, and a redistribution layer. The first substrate has a first surface, a second surface opposite to the first surface, and an inclined sidewall adjoining the first and second surfaces. The second substrate is below the first substrate. The first surface of the first substrate faces toward the second substrate. The antenna layer is located on the first surface of the first substrate. The redistribution layer extends from the second surface of the first substrate to the second substrate along the inclined sidewall of the first substrate, and the redistribution layer has a first section in contact with an end of the antenna layer.

Abstract: A chip package includes a semiconductor substrate, a supporting element, an antenna layer, and a redistribution layer. The semiconductor substrate has an inclined sidewall and a conductive pad that protrudes from the inclined sidewall. The supporting element is located on the semiconductor substrate, and has a top surface facing away from the semiconductor substrate, and has an inclined sidewall adjoining the top surface. The antenna layer is located on the top surface of the supporting element. The redistribution layer is located on the inclined sidewall of the supporting element, and is in contact with a sidewall of the conductive pad and an end of the antenna.

Abstract: The invention provides an electronic device package and method for manufacturing thereof. The electronic device package includes a substrate, an electronic chip, a bonding pad, a first passivation layer, a conductive layer, a second passivation layer, and a solder ball. The conductive layer has a first side end and a second side end, and the solder ball is positioned on the first side end of the conductive layer. The second passivation layer contacts with both the upper surface and the sidewall of the second side end of the conductive layer, and the first passivation layer contacts with the lower surface of the second side end of the conductive layer, so as to completely encapsulate the second end of the conductive layer. The electronic device package accordingly prevents the moisture penetration and to enhance the reliability of the electronic device.

Abstract: The invention provides an electronic device package and method for manufacturing thereof. The electronic device package includes a substrate, an electronic chip, a bonding pad, a first passivation layer, a conductive layer, a second passivation layer, and a solder ball. The conductive layer has a first side end and a second side end, and the solder ball is positioned on the first side end of the conductive layer. The second passivation layer contacts with both the upper surface and the sidewall of the second side end of the conductive layer, and the first passivation layer contacts with the lower surface of the second side end of the conductive layer, so as to completely encapsulate the second end of the conductive layer. The electronic device package accordingly prevents the moisture penetration and to enhance the reliability of the electronic device.

Abstract: A media pick system includes a pick-up rack, a pick-up roller, a separate roller, a swing gear arm, a swing gear lever, and a part of action. While the separate roller and the swing gear arm are driven to rotate, the swing gear lever would be driven to rotate. Therefore, while the torque generated on the pick-up rack by the part of action so that the pick-up rack could be lifted up or pushed down to pick up the media.

Abstract: A media pick system includes a pick-up rack, a pick-up roller, a separate roller, a swing gear arm, a swing gear lever, and a part of action. While the separate roller and the swing gear arm are driven to rotate, the swing gear lever would be driven to rotate. Therefore, while the torque generated on the pick-up rack by the part of action so that the pick-up rack could be lifted up or pushed down to pick up the media.