Abstract: Integrated circuit packages and methods of forming the same are provided. In an embodiment, a device includes: a power distribution interposer including: a first bonding layer; a first die connector in the first bonding layer; and a back-side interconnect structure including a power rail connected to the first die connector; and an integrated circuit die including: a second bonding layer directly bonded to the first bonding layer by dielectric-to-dielectric bonds; a second die connector in the second bonding layer, the second die connector directly bonded to the first die connector by metal-to-metal bonds; and a device layer on the second bonding layer, the device layer including a contact and a transistor, the transistor including a first source/drain region, the contact connecting a back-side of the first source/drain region to the second die connector.

Abstract: A semiconductor package includes a first semiconductor die and a second semiconductor die disposed laterally adjacent one another. The semiconductor package includes a semiconductor bridge overlapping a first corner of the first semiconductor die and a second corner of the second semiconductor die. The semiconductor bridge electrically couples the first semiconductor to the second semiconductor die. The semiconductor package includes a third semiconductor die and a fourth semiconductor die electrically coupled to the first semiconductor die and the second semiconductor die, respectively. The semiconductor bridge is interposed between the third semiconductor die and the fourth semiconductor die.

Abstract: A semiconductor device includes: a first chip including a plurality of first device features and a plurality of first interconnect structures disposed above the first device features; a second chip including a plurality of second device features and a plurality of second interconnect structures disposed above the second device features; and an interposer bonded to the first chip and the second chip, and disposed on an opposite side from the first and second device features with respect to the first and second interconnect structures; wherein the interposer includes a plurality of power rails configured to deliver power to the first and second chips.

Abstract: In an embodiment, a photoinitiation apparatus includes: a set of illumination sources or elements configured for outputting optical energy; a body structure having a proximal body structure portion confining a proximal volume of explosive medium, an intermediate body structure portion confining an intermediate volume of explosive medium, and a distal body structure portion confining a distal volume of explosive medium, wherein the proximal volume of explosive medium is optically coupled to portions of the first volume of explosive medium, at least one of the proximal volume of explosive medium and the distal volume of explosive medium is a tertiary explosive medium, and (a) the body structure does not carry a primary explosive composition and does not carry a secondary explosive composition, and/or (b) each of the proximal, intermediate, and distal volumes of explosive media has an initiation sensitivity that is less than cyclotrimethylenetrinitramine (RDX) based explosive compositions.

Abstract: In an embodiment, a photoinitiation apparatus includes: a set of illumination sources or elements configured for outputting optical energy; a body structure having a proximal body structure portion confining a proximal volume of explosive medium, an intermediate body structure portion confining an intermediate volume of explosive medium, and a distal body structure portion confining a distal volume of explosive medium, wherein the proximal volume of explosive medium is optically coupled to portions of the first volume of explosive medium, at least one of the proximal volume of explosive medium and the distal volume of explosive medium is a tertiary explosive medium, and (a) the body structure does not carry a primary explosive composition and does not carry a secondary explosive composition, and/or (b) each of the proximal, intermediate, and distal volumes of explosive media has an initiation sensitivity that is less than cyclotrimethylenetrinitramine (RDX) based explosive compositions.

Abstract: In an embodiment, a photoinitiation apparatus includes: a set of illumination sources or elements configured for outputting optical energy; a body structure having a proximal body structure portion confining a proximal volume of explosive medium, an intermediate body structure portion confining an intermediate volume of explosive medium, and a distal body structure portion confining a distal volume of explosive medium, wherein the proximal volume of explosive medium is optically coupled to portions of the first volume of explosive medium, at least one of the proximal volume of explosive medium and the distal volume of explosive medium is a tertiary explosive medium, and (a) the body structure does not carry a primary explosive composition and does not carry a secondary explosive composition, and/or (b) each of the proximal, intermediate, and distal volumes of explosive media has an initiation sensitivity that is less than cyclotrimethylenetrinitramine (RDX) based explosive compositions.

Abstract: This invention relates compositions containing compounds of formula (I) below: Each of R1, R2, R3, R4, R5, R6, R7, and R8 is defined in the specification.

Abstract: This invention relates compositions containing compounds of formula (I) below: Each of R1, R2, R3, R4, R5, R6, R7, and R8 is defined in the specification.

Abstract: This invention relates compositions containing compounds of formula (I) below: Each of R1, R2, R3, R4, R5, R6, R7, and R8 is defined in the specification.

Abstract: This invention relates to compositions containing a compound of formula (I) shown below: Each variable is defined in the specification. Also disclosed are methods of using these compositions to treat acne, psoriasis, and infective skin ulcer.

Abstract: A light emitting diode (LED) control circuit can control a liquid crystal display (LCD). The LED control circuit includes a switch and a constant-current circuit. Typically, the switch includes an input terminal connected to a power source via an LED to be controlled, a control terminal configured for receiving a control signal to turn on or turn off the switch, and an output terminal. The constant-current circuit includes a first transistor and a first resistor. A collector of the first transistor is connected to a control terminal of the switch. An output terminal of the switch and a base of the first transistor are both connected to an emitter of the first transistor via the first resistor. If the switch is turned on according to the control signal, then the power source is connected to provide a constant current for controlling the LED to emit light.

Abstract: This invention relates compositions containing compounds of formula (I) below: Each of R1, R2, R3, R4, R5, R6, R7, and R8 is defined in the specification.

Abstract: This invention relates to compositions containing a compound of formula (I) shown below: Each variable is defined in the specification. Also disclosed are methods of using these compositions to treat acne, psoriasis, and infective skin ulcer.