Abstract: A semiconductor package includes a conductive pillar and a solder. The conductive pillar has a first sidewall and a second sidewall opposite to the first sidewall, wherein a height of the first sidewall is greater than a height of the second sidewall. The solder is disposed on and in direct contact with the conductive pillar, wherein the solder is hanging over the first sidewall and the second sidewall of conductive pillar.

Abstract: A micro electro mechanical system (MEMS) includes a circuit substrate comprising electronic circuitry, a support substrate having a recess, a bonding layer disposed between the circuit substrate and the support substrate, through holes passing through the circuit substrate to the recess, a first conductive layer disposed on a front side of the circuit substrate, and a second conductive layer disposed on an inner wall of the recess. The first conductive layer extends into the through holes and the second conductive layer extends into the through holes and coupled to the first conductive layer.

Abstract: An electrostatic sensing system configured to sense an electrostatic information of a fluid inside a fluid distribution component and including an electrostatic sensing assembly, a signal amplifier and an analog-to-digital converter. The electrostatic sensing assembly includes a sensing component, and a shield. The sensing component is configured to be disposed at the fluid distribution component. The sensing component is disposed through the fluid distribution component so as to be partially located in the fluid distribution component. The shield surrounds a part of the sensing component that is located in the fluid distribution component. At least part of the shield is located on an upstream side of the sensing component. The signal amplifier is electrically connected to the sensing component. The analog-to-digital converter is electrically connected to the signal amplifier. The shield has an opening spaced apart from the sensing component.

Abstract: A paper warping detection device comprises: an input tray for loading a plurality of pieces of paper to be fed; a processor for storing a first threshold; a first emitting unit disposed at a front end of the input tray that forms a first angle with the input tray, and then emits a first ultrasonic beam toward the input tray in an obliquely and downward direction; a first receiving unit which is disposed at the front end of the input tray and formed a second angle with the input tray for receiving the ultrasonic beam reflected by the paper loaded in the input tray in a direction leaned downward; and a first analog to digital converter which is electrically connected to the first receiving unit and the processor respectively, for converting the reflected first ultrasonic beam received by the first receiving unit into a first digital signals and outputting the first digital signals to the processor.

Abstract: A paper warping detection device includes an input tray, a processor, a first emitting element, a first receiving element and a first analog-to-digital converter. A first critical value is stored in the processor. The first emitting element is electrically connected with the processor. The first receiving element is disposed to the other side of the input tray. The first receiving element and the first emitting element face each other. When the first emitting element is switched on, the first emitting element emits first ultrasonic wave signals towards the first receiving element. The first analog-to-digital converter is electrically connected with the first receiving element and the processor for converting the first ultrasonic wave signals into first digital signals and outputting the first digital signals to the processor. The processor reads the first digital signals and compares the first digital signals with the first critical value.

Abstract: A paper warping detection device includes an input tray, a processor, a first emitting element, a first receiving element and a first analog-to-digital converter. A first critical value is stored in the processor. The first emitting element is electrically connected with the processor. The first receiving element is disposed to the other side of the input tray. The first receiving element and the first emitting element face each other. When the first emitting element is switched on, the first emitting element emits first ultrasonic wave signals towards the first receiving element. The first analog-to-digital converter is electrically connected with the first receiving element and the processor for converting the first ultrasonic wave signals into first digital signals and outputting the first digital signals to the processor. The processor reads the first digital signals and compares the first digital signals with the first critical value.