Abstract: The present disclosure provides a semiconductor package, including a first semiconductor structure, including an active region in a first substrate portion, wherein the active region includes at least one of a transistor, a diode, and a photodiode, a first bonding metallization over the first semiconductor structure, a first bonding dielectric over the first semiconductor structure, surrounding and directly contacting the first bonding metallization, a second semiconductor structure over a first portion of the first semiconductor structure, wherein the second semiconductor structure includes a conductive through silicon via, a second bonding dielectric at a back surface of the second semiconductor structure, a second bonding metallization surrounded by the second bonding dielectric and directly contacting the second bonding dielectric, and a conductive through via over a second portion of the first semiconductor structure different from the first portion.

Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.

Abstract: A package includes a redistribution structure, a die package on a first side of the redistribution structure including a first die connected to a second die by metal-to-metal bonding and dielectric-to-dielectric bonding, a dielectric material over the first die and the second die and surrounding the first die, and a first through via extending through the dielectric material and connected to the first die and a first via of the redistribution structure, a semiconductor device on the first side of the redistribution structure includes a conductive connector, wherein a second via of the redistribution structure contacts the conductive connector of the semiconductor device, a first molding material on the redistribution structure and surrounding the die package and the semiconductor device, and a package through via extending through the first molding material to contact a third via of the redistribution structure.

Abstract: A semiconductor device includes a semiconductor substrate having a first region and a second region, insulators, gate stacks, and first and second S/Ds. The first and second regions respectively includes at least one first semiconductor fin and at least one second semiconductor fin. A width of a middle portion of the first semiconductor fin is equal to widths of end portions of the first semiconductor fin. A width of a middle portion of the second semiconductor fin is smaller than widths of end portions of the second semiconductor fin. The insulators are disposed on the semiconductor substrate. The first and second semiconductor fins are sandwiched by the insulators. The gate stacks are over a portion of the first semiconductor fin and a portion of the second semiconductor fin. The first and second S/Ds respectively covers another portion of the first semiconductor fin and another portion of the second semiconductor fin.

Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.

Abstract: An electronic device includes a substrate, a first silicon transistor, a second silicon transistor and a first oxide semiconductor transistor. The first silicon transistor, the second silicon transistor and the first oxide semiconductor transistor are disposed on the substrate. The first silicon transistor has a first terminal electrically connected to a first voltage level, a second terminal and a control terminal. The second silicon transistor has a first terminal electrically connected to the second terminal of the first silicon transistor, a second terminal electrically connected to a second voltage level, and a control terminal electrically connected to the control terminal of the first silicon transistor. The first oxide semiconductor transistor has a first terminal electrically connected to the first terminal of the second silicon transistor. Wherein, a voltage value of the first voltage level is greater than a voltage value of the second voltage level.

Abstract: A device for encouraging and guiding a spirometer user includes a housing, a main valve, a visual assembly, and a sound making assembly. The housing has a guiding channel, a first outlet channel, a second outlet channel, and an inlet channel. The main valve is disposed in a housing communicating with the guiding channel, the first outlet channel, the second outlet channel or the inlet channel and configured to regulate or control fluid flowing paths. The visual assembly includes a check valve in the second outlet channel, and at least one movable member. The sound making assembly includes a check valve and a sound maker. So, it can generate the visual and sound encouraging effects for learning how to use a spirometer correctly.

Abstract: A lamp structure of an umbrella contains a body, an illumination device, and a control pusher. The body includes a shaft, a notch, a runner slidably, and multiple stretchers. The illumination device includes at least one lighting element, a circuit board, and a battery. The circuit board has a control switch, when the runner is moved upward to push the illumination device, the umbrella is opened. The control pusher is connected to the runner and includes a controlling element. The control pusher is slid vertically with respect to the shaft and is switched in three-section positions, such that the control pusher is slid to a first position, a second position, and a third position relative to the shaft to drive the control switch to be conducted or not so that the circuit board controls the at least one lighting element to power on or off.

Abstract: A manufacturing method of a semiconductor structure is provided. A first semiconductor die includes a first semiconductor substrate, a first interconnect structure formed thereon, a first bonding conductor formed thereon, and a conductive via extending from the first interconnect structure toward a back surface of the first semiconductor substrate. The first semiconductor substrate is thinned to accessibly expose the conductive via to form a through semiconductor via (TSV). A second semiconductor die is bonded to the first semiconductor die. The second semiconductor die includes a second semiconductor substrate including an active surface facing the back surface of the first semiconductor substrate, a second interconnect structure between the second and the first semiconductor substrates, and a second bonding conductor between the second interconnect structure and the first semiconductor substrate and bonded to the TSV.

Abstract: A semiconductor device including a first die and a second die bonded to one another. The first die includes a first passivation layer over a substrate, and first bond pads in the first passivation layer. The second die includes a second passivation layer, which may be bonded to the first passivation layer, and second bond pads in the second passivation layer, which may be bonded to the first bond pads. The second bond pads include inner bond pads and outer bond pads. The outer bond pads may have a greater diameter than the inner bond pads as well as the first bond pads.

Abstract: In an embodiment, a robotic arm includes: a base; at least one link secured to the base; a gripper secured to the at least one link, wherein: the gripper comprises a finger, the gripper is configured to secure a wafer while the at least one link is in motion, and the gripper is configured to release the wafer while the at least one link is stopped, a sensor disposed on the finger, the sensor configured to collect sensor data characterizing the robotic arm's interaction with a semiconductor processing chamber while the wafer is secured using the finger.

Abstract: Disclosed is a gas injector for a semiconductor processing system comprising a tube, and at least one nozzle head mounted on a downstream end of the tube wherein the at least one nozzle allows a fluid communication to discharge a gas from a upstream end of the tube through the at least one nozzle of the gas injector to ambient atmosphere surrounding the downstream end of the tube, wherein the at least one nozzle comprises: a body, and at least one adaptor comprising a plurality of flow regulation components to alter a flow direction of the gas at the downstream end, wherein the plurality of flow regulation components are each constructed and arranged such that a film buildup on inner surfaces of the gas injector is reduced.

Abstract: In an embodiment, a robotic arm includes: a base; at least one link secured to the base; a gripper secured to the at least one link, wherein: the gripper comprises a finger, the gripper is configured to secure a wafer while the at least one link is in motion, and the gripper is configured to release the wafer while the at least one link is stopped, a sensor disposed on the finger, the sensor configured to collect sensor data characterizing the robotic arm's interaction with a semiconductor processing chamber while the wafer is secured using the finger.

Abstract: In an embodiment, a robotic arm includes: a base; at least one link secured to the base; a gripper secured to the at least one link, wherein: the gripper comprises a finger, the gripper is configured to secure a wafer while the at least one link is in motion, and the gripper is configured to release the wafer while the at least one link is stopped, a sensor disposed on the finger, the sensor configured to collect sensor data characterizing the robotic arm's interaction with a semiconductor processing chamber while the wafer is secured using the finger.

Abstract: Disclosed is a gas injector for a semiconductor processing system comprising a tube, and at least one nozzle head mounted on a downstream end of the tube wherein the at least one nozzle allows a fluid communication to discharge a gas from a upstream end of the tube through the at least one nozzle of the gas injector to ambient atmosphere surrounding the downstream end of the tube, wherein the at least one nozzle comprises: a body, and at least one adaptor comprising a plurality of flow regulation components to alter a flow direction of the gas at the downstream end, wherein the plurality of flow regulation components are each constructed and arranged such that a film buildup on inner surfaces of the gas injector is reduced.

Abstract: In an embodiment, a robotic arm includes: a base; at least one link secured to the base; a gripper secured to the at least one link, wherein: the gripper comprises a finger, the gripper is configured to secure a wafer while the at least one link is in motion, and the gripper is configured to release the wafer while the at least one link is stopped, a sensor disposed on the finger, the sensor configured to collect sensor data characterizing the robotic arm's interaction with a semiconductor processing chamber while the wafer is secured using the finger.

Abstract: A portable computer and a hinge mechanism thereof are provided. The portable computer includes a display screen, a host and a hinge mechanism. The hinge mechanism is connected with the display screen and the host. The hinge mechanism is used for rotating the display screen around the host. The hinge mechanism includes a bottom board, a pivot, a network connecter and a slanting board. The pivot is disposed on the bottom board, wherein one end of the pivot is connected with the host and the other end of the pivot is connected with the display screen. The network connecter is disposed on the bottom board. The slanting board is disposed on the bottom board and slants to the pivot. The slanting board has an opening which exposes the network connecter.

Abstract: A portable computer and a hinge mechanism thereof are provided. The portable computer includes a display screen, a host and a hinge mechanism. The hinge mechanism is connected with the display screen and the host. The hinge mechanism is used for rotating the display screen around the host. The hinge mechanism includes a bottom board, a pivot, a network connecter and a slanting board. The pivot is disposed on the bottom board, wherein one end of the pivot is connected with the host and the other end of the pivot is connected with the display screen. The network connecter is disposed on the bottom board. The slanting board is disposed on the bottom board and slants to the pivot. The slanting board has an opening which exposes the network connecter.

Abstract: An herbal extract which induces immune cells to produce interferon and activates Toll-like receptors and a preparation method thereof are provided. The herbal extract is extracted from an effective amount of raw material including Glycyrrhizae Radix, Bupleuri Radix, Scutellariae Radix, Schisandrae Fructus and Paeoniae Rubra Radix. Glycyrrhizae Radix, Bupleuri Radix, Scutellariae Radix, Schisandrae Fructus and Paeoniae Rubra Radix have a weight ratio of 1-5:1-5:1-5:1-3:1-3.

Abstract: A playback apparatus for multiple memory cards of the same type. The apparatus comprises of a plurality of memory card slots of the same type, a memory card selecting unit, a microprocessor unit and a multimedia processor. The microprocessor unit electronically connects to the memory card selecting unit, receiving a memory card detecting signal from the memory card selecting unit and sending a memory card selecting signal to the memory card selecting unit. The multimedia processor electronically connects to the processor unit and the memory card selecting unit, reading the data from one memory card through the memory card selecting unit under the control of the microprocessor unit. Hence the playback apparatus selects one of the multiple memory cards of the same type, playing audio/video signals stored in the memory card. User therefore can select multiple memory cards of the same type for playing.