Abstract: A semiconductor package includes a first die and a through via. The through via is electrically connected to the first die. The through via includes a first conductive layer having a first width, a second conductive layer having a second width different from the first width and a first seed layer disposed aside an interface between the first conductive layer and the second conductive layer.

Abstract: A method for fabricating minimal fin length includes the steps of first forming a fin-shaped structure extending along a first direction on a substrate, forming a first single-diffusion break (SDB) trench and a second SDB trench extending along a second direction to divide the fin-shaped structure into a first portion, a second portion, and a third portion, and then performing a fin-cut process to remove the first portion and the third portion.

Abstract: A package structure includes a plurality of stacked die units and an insulating encapsulant. The plurality of stacked die units is stacked on top of one another, where each of the plurality of stacked die units include a first semiconductor die, a first bonding chip. The first semiconductor die has a plurality of first bonding pads. The first bonding chip is stacked on the first semiconductor die and has a plurality of first bonding structure. The plurality of first bonding structures is bonded to the plurality of first bonding pads through hybrid bonding. The insulating encapsulant is encapsulating the plurality of stacked die units.

Abstract: A method includes: obtaining at least one real-time console log from a compute instance; tagging the at least one real-time console log with at least one log category based on at least one entry within the at least one real-time console log; generating at least one categorized console log; generating at least one encrypted categorized console log based on a public encryption key; publishing the at least one encrypted categorized console log to a log bus; communicating the at least one encrypted categorized console log over at least one multi-port secure tunnel to a user terminal device of a subscribed user; and publishing a private encryption key to the user terminal device of the subscribed user wherein the private encryption key facilitates decrypting the at least one encrypted categorized console log.

Abstract: Impurities in a liquefied solid fuel utilized in a droplet generator of an extreme ultraviolet photolithography system are removed from vessels containing the liquefied solid fuel. Removal of the impurities increases the stability and predictability of droplet formation which positively impacts wafer yield and droplet generator lifetime.

Abstract: A stacking structure including a first die, a second die stacked on the first die, and a third die and a fourth die disposed on the second die. The first die has a first metallization structure, and the first metallization structure includes first through die vias. The second die has a second metallization structure, and second metallization structure includes second through die vias. The first through die vias are bonded with the second through die vias, and sizes of the first through die vias are different from sizes of the second through die vias. The third and fourth dies are disposed side-by-side and are bonded with the second through die vias.

Abstract: A power supply device includes a first battery and a second battery, and a first switching unit, configured to select the first battery to supply power to a load; a second switching unit, configured to select the second battery to supply power to the load; a processing unit, configured to detect power of the first battery and the second battery; when the power of the second battery is greater than a first preset value, the processing unit disconnects the first switching unit and turns on the second switching unit to enable the second battery to supply power to the load; the processing unit controls the second battery to charge the first battery when the power of the first battery is less than a second preset value; and when the power of the first battery is greater than a third preset value, the second battery stops charging the first battery.

Abstract: A package structure including a bottom die, a first die, a second die, an encapsulant and a first dummy structure is provided. The first die and a second die are bonded to a first side of the bottom die. The encapsulant laterally encapsulates the first die and the second die. The first dummy structure is bonded to the first side of the bottom die, wherein a sidewall of the first dummy structure is coplanar with a first sidewall of the bottom die.

Abstract: An electronic device includes a first body, a second body, two hinges, and at least one electronic assembly. The two hinges are connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the two hinges. The electronic assembly is connected to the second body and is located between the two hinges.

Abstract: An electronic device includes a first body, a second body, two hinges, and at least one electronic assembly. The two hinges are connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the two hinges. The electronic assembly is connected to the second body and is located between the two hinges.

Abstract: An electronic device includes a first body, a second body, two hinges, and at least one electronic assembly. The two hinges are connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the two hinges. The electronic assembly is connected to the second body and is located between the two hinges.

Abstract: An electronic device includes a first body, a second body, two hinges, and at least one electronic assembly. The two hinges are connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the two hinges. The electronic assembly is connected to the second body and is located between the two hinges.

Abstract: An assembled electronic apparatus and a control method thereof are provided. The assembled electronic apparatus includes a first body and a second body. A second processor shares a partial content of a sensing record generated by a sensing module through a second information sharing module. The first body and the second body are connected with each other through the first connector and the second connector. After being connected with each other, a message is transmitted by one of the first processor and the second processor to another one of the first processor and the second processor, so that a function is executed by the another one of the first processor and the second processor through the corresponding first processor or the corresponding second processor according to the message. The first processor shares a content of the sensing record generated by the sensing module through a first information sharing module.

Abstract: An electronic device includes a housing, a touch panel, a processor and one or more conductive rubbers. The touch panel has a contact surface. The processor is disposed inside the housing and coupled to the touch panel. When the one or more conductive rubbers contact the contact surface of the touch panel and the one or more conductive rubbers are compressed by a gravity provided by an object, the processor detects a first value on touch panel and obtains a weight of the object according to the first value.

Abstract: An assembled electronic apparatus and a control method thereof are provided. The assembled electronic apparatus includes a first body and a second body. A second processor shares a partial content of a sensing record generated by a sensing module through a second information sharing module. The first body and the second body are connected with each other through the first connector and the second connector. After being connected with each other, a message is transmitted by one of the first processor and the second processor to another one of the first processor and the second processor, so that a function is executed by the another one of the first processor and the second processor through the corresponding first processor or the corresponding second processor according to the message. The first processor shares a content of the sensing record generated by the sensing module through a first information sharing module.

Abstract: A transformer is disclosed. The transformer includes a first pin, a second pin, a first side winding, a second side winding, and a jump pin. The second side winding is coupled to the first pin and the second pin. The first pin is between the jump pin and the second pin. The jump pin is coupled to the second pin inside the transformer.

Abstract: A vibration module is suitable for an electronic device. The vibration module includes a vibration element, a plurality of pressing units, and a vibration regulating circuit. The pressing units are disposed on the electronic device and respectively have a coordinate relative to the vibration element. The vibration regulating circuit is disposed in the electronic device and coupled to the vibration element and the pressing units. The vibration regulating circuit calculates a distance between one of the pressing units and the vibration element and regulates an output vibration strength of the vibration element based on the distance.

Abstract: A method for storing data is disclosed. The method is used for storing data into a program memory used for storing program codes. The program memory is divided into a first buffer storage area and a second buffer storage area. By alternate accessing of the first buffer storage area and the second buffer storage area, instantly accessible data can be stored in the program memory, such that the conventional data memory can be replaced by the program memory of the present invention and the cost of the product can be reduced.

Abstract: A multi-lamp backlight apparatus is disclosed. The multi-lamp backlight apparatus includes 2N lamps, N balancing transformers, and a high-voltage power source. N is a positive integer and k is an integer index ranging from 1 to N. The kth balancing transformer among the N balancing transformers includes a first primary winding, a second primary winding, and a secondary winding. The first primary winding connects in series with the (2k?1)th lamp of the 2N lamps. The second primary winding connects in series with the first primary winding and the (2k)th lamp. The secondary winding corresponds to the first primary winding and the second primary winding. The high-voltage power source is connected between the first primary windings and the second primary windings.

Abstract: The invention provides a balance transformer and a backlight apparatus using the same. The balance transformer comprises a first main coil, a second main coil, a first induction coil, and a conductor. The first main coil has a first contact point and a second contact point, and the second main coil has a third contact point and a fourth contact point. The first induction coil is corresponding to the first main coil and the second main coil. The conductor is then series connected to the first contact point and the fourth contact point. Accordingly, the balance transformer drives the backlight apparatus to light and balances the currents of a plurality of light units of the backlight apparatus.