Abstract: Manufacturing of a shoe or a portion of a shoe is enhanced by executing various shoe-manufacturing processes in an automated fashion. For example, information describing a shoe part may be determined, such as an identification, an orientation, a color, a surface topography, an alignment, a size, etc. Based on the information describing the shoe part, automated shoe-manufacturing apparatuses may be instructed to apply various shoe-manufacturing processes to the shoe part, such as a pickup and placement of the shoe part with a pickup tool.

Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.

Abstract: Some embodiments of the present disclosure relate to an integrated chip including an extended via that spans a combined height of a wire and a via and that has a smaller footprint than the wire. The extended via may replace a wire and an adjoining via at locations where the sizing and the spacing of the wire are reaching lower limits. Because the extended via has a smaller footprint than the wire, replacing the wire and the adjoining via with the extended via relaxes spacing and allows the size of the pixel to be further reduced. The extended via finds application for capacitor arrays used for pixel circuits.

Abstract: In a method of manufacturing a semiconductor device, underlying structures comprising gate electrodes and source/drain epitaxial layers are formed, one or more layers are formed over the underlying structures, a hard mask layer is formed over the one or more layers, one or more first resist layers are formed over the hard mask layer, a first photo resist pattern is formed over the one or more first resist layers, a width of the first photo resist pattern is adjusted, the one or more first resist layers are patterned by using the first photo resist pattern as an etching mask, thereby forming a first hard mask pattern, and the hard mask layer is patterned by using the first hard mask pattern, thereby forming a second hard mask pattern.

Abstract: A manufacturing method of a semiconductor structure is provided. A first semiconductor die includes a first semiconductor substrate, a first interconnect structure formed thereon, a first bonding conductor formed thereon, and a conductive via extending from the first interconnect structure toward a back surface of the first semiconductor substrate. The first semiconductor substrate is thinned to accessibly expose the conductive via to form a through semiconductor via (TSV). A second semiconductor die is bonded to the first semiconductor die. The second semiconductor die includes a second semiconductor substrate including an active surface facing the back surface of the first semiconductor substrate, a second interconnect structure between the second and the first semiconductor substrates, and a second bonding conductor between the second interconnect structure and the first semiconductor substrate and bonded to the TSV.

Abstract: An electronic device includes a first body, a second body, two hinges, and at least one electronic assembly. The two hinges are connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the two hinges. The electronic assembly is connected to the second body and is located between the two hinges.

Abstract: An electronic device includes a first body, a second body, two hinges, and at least one electronic assembly. The two hinges are connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the two hinges. The electronic assembly is connected to the second body and is located between the two hinges.

Abstract: An electronic device includes a first body, a second body, two hinges, and at least one electronic assembly. The two hinges are connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the two hinges. The electronic assembly is connected to the second body and is located between the two hinges.

Abstract: An electronic device includes a first body, a second body, two hinges, and at least one electronic assembly. The two hinges are connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the two hinges. The electronic assembly is connected to the second body and is located between the two hinges.

Abstract: An assembled electronic apparatus and a control method thereof are provided. The assembled electronic apparatus includes a first body and a second body. A second processor shares a partial content of a sensing record generated by a sensing module through a second information sharing module. The first body and the second body are connected with each other through the first connector and the second connector. After being connected with each other, a message is transmitted by one of the first processor and the second processor to another one of the first processor and the second processor, so that a function is executed by the another one of the first processor and the second processor through the corresponding first processor or the corresponding second processor according to the message. The first processor shares a content of the sensing record generated by the sensing module through a first information sharing module.

Abstract: An electronic device includes a housing, a touch panel, a processor and one or more conductive rubbers. The touch panel has a contact surface. The processor is disposed inside the housing and coupled to the touch panel. When the one or more conductive rubbers contact the contact surface of the touch panel and the one or more conductive rubbers are compressed by a gravity provided by an object, the processor detects a first value on touch panel and obtains a weight of the object according to the first value.

Abstract: An assembled electronic apparatus and a control method thereof are provided. The assembled electronic apparatus includes a first body and a second body. A second processor shares a partial content of a sensing record generated by a sensing module through a second information sharing module. The first body and the second body are connected with each other through the first connector and the second connector. After being connected with each other, a message is transmitted by one of the first processor and the second processor to another one of the first processor and the second processor, so that a function is executed by the another one of the first processor and the second processor through the corresponding first processor or the corresponding second processor according to the message. The first processor shares a content of the sensing record generated by the sensing module through a first information sharing module.

Abstract: A transformer is disclosed. The transformer includes a first pin, a second pin, a first side winding, a second side winding, and a jump pin. The second side winding is coupled to the first pin and the second pin. The first pin is between the jump pin and the second pin. The jump pin is coupled to the second pin inside the transformer.

Abstract: A vibration module is suitable for an electronic device. The vibration module includes a vibration element, a plurality of pressing units, and a vibration regulating circuit. The pressing units are disposed on the electronic device and respectively have a coordinate relative to the vibration element. The vibration regulating circuit is disposed in the electronic device and coupled to the vibration element and the pressing units. The vibration regulating circuit calculates a distance between one of the pressing units and the vibration element and regulates an output vibration strength of the vibration element based on the distance.

Abstract: A method for storing data is disclosed. The method is used for storing data into a program memory used for storing program codes. The program memory is divided into a first buffer storage area and a second buffer storage area. By alternate accessing of the first buffer storage area and the second buffer storage area, instantly accessible data can be stored in the program memory, such that the conventional data memory can be replaced by the program memory of the present invention and the cost of the product can be reduced.

Abstract: A multi-lamp backlight apparatus is disclosed. The multi-lamp backlight apparatus includes 2N lamps, N balancing transformers, and a high-voltage power source. N is a positive integer and k is an integer index ranging from 1 to N. The kth balancing transformer among the N balancing transformers includes a first primary winding, a second primary winding, and a secondary winding. The first primary winding connects in series with the (2k?1)th lamp of the 2N lamps. The second primary winding connects in series with the first primary winding and the (2k)th lamp. The secondary winding corresponds to the first primary winding and the second primary winding. The high-voltage power source is connected between the first primary windings and the second primary windings.

Abstract: The invention provides a balance transformer and a backlight apparatus using the same. The balance transformer comprises a first main coil, a second main coil, a first induction coil, and a conductor. The first main coil has a first contact point and a second contact point, and the second main coil has a third contact point and a fourth contact point. The first induction coil is corresponding to the first main coil and the second main coil. The conductor is then series connected to the first contact point and the fourth contact point. Accordingly, the balance transformer drives the backlight apparatus to light and balances the currents of a plurality of light units of the backlight apparatus.

Abstract: A transformer is disclosed. The transformer includes a first pin, a second pin, a first side winding, a second side winding, and a jump pin. The second side winding is coupled to the first pin and the second pin. The first pin is between the jump pin and the second pin. The jump pin is coupled to the second pin inside the transformer.

Abstract: The invention provides a backlight module comprising a plurality of lighting units and at least one balance transformer. Each of the lighting units comprises a first electrode terminal and a second electrode terminal, and the first electrode terminals are coupled to a power source. The at least one balance transformer is coupled to at least one of the second electrode terminals. The primary side of the at least one balance transformer could be connected to each other to form a close loop. Accordingly, the backlight module could be used for large size panel.

Abstract: The invention provides a balance transformer and a backlight apparatus using the same. The balance transformer comprises a first main coil, a second main coil, a first induction coil, and a conductor. The first main coil has a first contact point and a second contact point, and the second main coil has a third contact point and a fourth contact point. The first induction coil is corresponding to the first main coil and the second main coil. The conductor is then series connected to the first contact point and the fourth contact point. Accordingly, the balance transformer drives the backlight apparatus to light and balances the currents of a plurality of light units of the backlight apparatus.