Abstract: A package structure and method of manufacturing is provided, whereby heat dissipating features are provided for heat dissipation. Heat dissipating features include conductive vias formed in a die stack, thermal chips, and thermal metal bulk, which can be bonded to a wafer level device. Hybrid bonding including chip to chip, chip to wafer, and wafer to wafer provides thermal conductivity without having to traverse a bonding material, such as a eutectic material. Plasma dicing the package structure can provide a smooth sidewall profile for interfacing with a thermal interface material.

Abstract: The present disclosure relates to a semiconductor device including a substrate having a top surface and a gate stack. The semiconductor device also includes a multi-spacer structure. The multi-spacer includes a first spacer formed on a sidewall of the gate stack, a second spacer, and a third spacer. The second spacer includes a first portion formed on a sidewall of the first spacer and a second portion formed on the top surface of the substrate. The second portion of the second spacer has a thickness in a first direction that gradually decreases. The third spacer is formed on the second portion of the second spacer and on the top surface of the substrate. The semiconductor device further includes a source/drain region formed in the substrate, and a portion of the third spacer abuts the source/drain region and the second portion of the second spacer.

Abstract: A method of fabricating a color filter includes steps of forming a transparent-matrix on a flexible and transparent substrate for dividing the substrate to a plurality of pixel regions; printing the a plurality of pixel regions with color ink; and curing the ink to form a plurality of color filters on the surface of the substrate. The light transmittance ability of the color filter can be effectively improved by forming a transparent-matrix instead of a black-matrix on the substrate.

Abstract: An exemplary circuit board includes a plate body and a multilayer capacitor installed on a surface of the plate body. The multilayer capacitor includes a multilayer body and two outer electrodes located at the two opposite ends of the multilayer body. The multilayer body includes a plurality of ceramic layers and a plurality of internal electrodes alternately arranged. The two outer electrodes are connected to the plate body, and a stacking direction of the multilayer body is substantially parallel to the surface of the plate body.

Abstract: An eraser includes a housing (20) having a receiving chamber (21), a collection zone (23) and a plurality of reinforcing ribs (26), a mounting board (30) mounted on the housing, a cleaning member (40) mounted on the mounting board, a support bracket (50) mounted on the housing, a door (60) removably mounted on the housing to cover the collection zone, a hollow separation member (70) mounted in the housing to separate the receiving chamber from the collection zone, and a control valve (80) movable to open the separation member so as to connect the receiving chamber with the collection zone or to close the separation member so as to interrupt a connection between the receiving chamber and the collection zone, and two decorative covers mounted on the housing and each abutting the reinforcing ribs.

Abstract: The present invention discloses a multi-channel multi-media data processing method, comprising the steps of: providing a demodulator circuit and a multi-media processing circuit, the multi-media processing circuit including a DRAM; receiving multi-channel analog signals, and performing analog-to-digital conversion and demodulation on the signals by the demodulator circuit; storing the converted and demodulated multi-channel signals in the DRAM; and reading the signals of at least one channel from the DRAM.

Abstract: An eraser includes a housing (20) having a receiving chamber (21), a collection zone (23) and a plurality of reinforcing ribs (26), a mounting board (30) mounted on the housing, a cleaning member (40) mounted on the mounting board, a support bracket (50) mounted on the housing, a door (60) removably mounted on the housing to cover the collection zone, a hollow separation member (70) mounted in the housing to separate the receiving chamber from the collection zone, and a control valve (80) movable to open the separation member so as to connect the receiving chamber with the collection zone or to close the separation member so as to interrupt a connection between the receiving chamber and the collection zone, and two decorative covers mounted on the housing and each abutting the reinforcing ribs.

Abstract: The present invention discloses a multi-media data processing method for use in an integrated circuit having an error correction circuit, the method comprising the steps of: receiving broadcasted analog data; converting the analog data to digital data; and storing the digital data into a main memory without error correction, wherein the digital data stored in the main memory are subject to error correction only when it is required, but are not subject to error correction if it is not required.

Abstract: The present invention discloses a multi-channel multi-media data processing method, comprising the steps of: providing a demodulator circuit and a multi-media processing circuit, the multi-media processing circuit including a DRAM; receiving multi-channel analog signals, and performing analog-to-digital conversion and demodulation on the signals by the demodulator circuit; storing the converted and demodulated multi-channel signals in the DRAM; and reading the signals of at least one channel from the DRAM.

Abstract: The present invention discloses an interleaving memory read/write method, which comprises the steps of: providing a main memory storing readable data; and non-sequentially reading the data in the main memory by batches, wherein each batch of data includes at least two data. The data read from the main memory is stored in an auxiliary memory for further processing; the further processing does not occupy the operation time of the main memory.

Abstract: An ambient temperature control apparatus used for measuring ambient temperature. The apparatus has a bottom plate, a panel fitting apparatus, an external mask, and a temperature control device. The panel fitting apparatus is disposed on the bottom plate and is suitable for use to fix a liquid crystal panel. The external mask is detachably mounted on the bottom plate to form a cavity, in which the panel fitting apparatus and the liquid crystal panel are enclosed. The external mask includes at least a window allowing the photometer to measure the liquid crystal panel therefrom. The temperature control device mounted to the external mask is suitable to control the temperature variation of the cavity.

Abstract: An ambient temperature control apparatus used for measuring ambient temperature. The apparatus has a bottom plate, a panel fitting apparatus, an external mask, and a temperature control device. The panel fitting apparatus is disposed on the bottom plate and is suitable for use to fix a liquid crystal panel. The external mask is detachably mounted on the bottom plate to form a cavity, in which the panel fitting apparatus and the liquid crystal panel are enclosed. The external mask includes at least a window allowing the photometer to measure the liquid crystal panel therefrom. The temperature control device mounted to the external mask is suitable to control the temperature variation of the cavity.

Abstract: An ambient temperature control apparatus used for measuring ambient temperature. The apparatus has a bottom plate, a panel fitting apparatus, an external mask, and a temperature control device. The panel fitting apparatus is disposed on the bottom plate and is suitable for use to fix a liquid crystal panel. The external mask is detachably mounted on the bottom plate to form a cavity, in which the panel fitting apparatus and the liquid crystal panel are enclosed. The external mask includes at least a window allowing the photometer to measure the liquid crystal panel therefrom. The temperature control device mounted to the external mask is suitable to control the temperature variation of the cavity.

Abstract: An ambient temperature control apparatus used for measuring ambient temperature. The apparatus has a bottom plate, a panel fitting apparatus, an external mask, and a temperature control device. The panel fitting apparatus is disposed on the bottom plate and is suitable for use to fix a liquid crystal panel. The external mask is detachably mounted on the bottom plate to form a cavity, in which the panel fitting apparatus and the liquid crystal panel are enclosed. The external mask includes at least a window allowing the photometer to measure the liquid crystal panel therefrom. The temperature control device mounted to the external mask is suitable to control the temperature variation of the cavity.

Abstract: A wafer positioning checking system used in a vertical furnace as found in a semiconductor manufacturing facility for manufacturing chips. The system utilizes a first sensor such as a photoelectric or laser sensor that checks the peripheral alignment of the wafers loaded in the boat. A second sensor is mounted on a robot having a wafer-handling arm for checking the position of a wafer that has just been loaded into the boat. An algorithm in a control unit responds to electrical signals generated by these two sensors to allow the loading operation to continue as long as the wafers are properly positioned and to controllable monitoring the wafers during a portion of the processing.