Abstract: The present disclosure provides a semiconductor package, including a first semiconductor structure, including an active region in a first substrate portion, wherein the active region includes at least one of a transistor, a diode, and a photodiode, a first bonding metallization over the first semiconductor structure, a first bonding dielectric over the first semiconductor structure, surrounding and directly contacting the first bonding metallization, a second semiconductor structure over a first portion of the first semiconductor structure, wherein the second semiconductor structure includes a conductive through silicon via, a second bonding dielectric at a back surface of the second semiconductor structure, a second bonding metallization surrounded by the second bonding dielectric and directly contacting the second bonding dielectric, and a conductive through via over a second portion of the first semiconductor structure different from the first portion.

Abstract: This application relates to the field of lighting, and discloses an LED filament. The LED filament includes an LED chip unit, a light conversion layer, and an electrode. The light conversion layer covers the LED chip unit and part of the electrode, and a color of a light emitted by the LED filament after lighting is different from a color of the light conversion layer. This application has the characteristics of uniform light emission and good heat dissipation effect.

Abstract: A method includes putting a first package component into contact with a second package component. The first package component comprises a first dielectric layer including a first dielectric material, and the first dielectric material is a silicon-oxide-based dielectric material. The second package component includes a second dielectric layer including a second dielectric material different from the first dielectric material. The second dielectric material comprises silicon and an element selected from the group consisting of carbon, nitrogen, and combinations thereof. An annealing process is performed to bond the first dielectric layer to the second dielectric layer.

Abstract: A method of fabricating a color filter includes steps of forming a transparent-matrix on a flexible and transparent substrate for dividing the substrate to a plurality of pixel regions; printing the a plurality of pixel regions with color ink; and curing the ink to form a plurality of color filters on the surface of the substrate. The light transmittance ability of the color filter can be effectively improved by forming a transparent-matrix instead of a black-matrix on the substrate.

Abstract: An exemplary circuit board includes a plate body and a multilayer capacitor installed on a surface of the plate body. The multilayer capacitor includes a multilayer body and two outer electrodes located at the two opposite ends of the multilayer body. The multilayer body includes a plurality of ceramic layers and a plurality of internal electrodes alternately arranged. The two outer electrodes are connected to the plate body, and a stacking direction of the multilayer body is substantially parallel to the surface of the plate body.

Abstract: An eraser includes a housing (20) having a receiving chamber (21), a collection zone (23) and a plurality of reinforcing ribs (26), a mounting board (30) mounted on the housing, a cleaning member (40) mounted on the mounting board, a support bracket (50) mounted on the housing, a door (60) removably mounted on the housing to cover the collection zone, a hollow separation member (70) mounted in the housing to separate the receiving chamber from the collection zone, and a control valve (80) movable to open the separation member so as to connect the receiving chamber with the collection zone or to close the separation member so as to interrupt a connection between the receiving chamber and the collection zone, and two decorative covers mounted on the housing and each abutting the reinforcing ribs.

Abstract: The present invention discloses a multi-channel multi-media data processing method, comprising the steps of: providing a demodulator circuit and a multi-media processing circuit, the multi-media processing circuit including a DRAM; receiving multi-channel analog signals, and performing analog-to-digital conversion and demodulation on the signals by the demodulator circuit; storing the converted and demodulated multi-channel signals in the DRAM; and reading the signals of at least one channel from the DRAM.

Abstract: An eraser includes a housing (20) having a receiving chamber (21), a collection zone (23) and a plurality of reinforcing ribs (26), a mounting board (30) mounted on the housing, a cleaning member (40) mounted on the mounting board, a support bracket (50) mounted on the housing, a door (60) removably mounted on the housing to cover the collection zone, a hollow separation member (70) mounted in the housing to separate the receiving chamber from the collection zone, and a control valve (80) movable to open the separation member so as to connect the receiving chamber with the collection zone or to close the separation member so as to interrupt a connection between the receiving chamber and the collection zone, and two decorative covers mounted on the housing and each abutting the reinforcing ribs.

Abstract: The present invention discloses a multi-media data processing method for use in an integrated circuit having an error correction circuit, the method comprising the steps of: receiving broadcasted analog data; converting the analog data to digital data; and storing the digital data into a main memory without error correction, wherein the digital data stored in the main memory are subject to error correction only when it is required, but are not subject to error correction if it is not required.

Abstract: The present invention discloses a multi-channel multi-media data processing method, comprising the steps of: providing a demodulator circuit and a multi-media processing circuit, the multi-media processing circuit including a DRAM; receiving multi-channel analog signals, and performing analog-to-digital conversion and demodulation on the signals by the demodulator circuit; storing the converted and demodulated multi-channel signals in the DRAM; and reading the signals of at least one channel from the DRAM.

Abstract: The present invention discloses an interleaving memory read/write method, which comprises the steps of: providing a main memory storing readable data; and non-sequentially reading the data in the main memory by batches, wherein each batch of data includes at least two data. The data read from the main memory is stored in an auxiliary memory for further processing; the further processing does not occupy the operation time of the main memory.

Abstract: An ambient temperature control apparatus used for measuring ambient temperature. The apparatus has a bottom plate, a panel fitting apparatus, an external mask, and a temperature control device. The panel fitting apparatus is disposed on the bottom plate and is suitable for use to fix a liquid crystal panel. The external mask is detachably mounted on the bottom plate to form a cavity, in which the panel fitting apparatus and the liquid crystal panel are enclosed. The external mask includes at least a window allowing the photometer to measure the liquid crystal panel therefrom. The temperature control device mounted to the external mask is suitable to control the temperature variation of the cavity.

Abstract: An ambient temperature control apparatus used for measuring ambient temperature. The apparatus has a bottom plate, a panel fitting apparatus, an external mask, and a temperature control device. The panel fitting apparatus is disposed on the bottom plate and is suitable for use to fix a liquid crystal panel. The external mask is detachably mounted on the bottom plate to form a cavity, in which the panel fitting apparatus and the liquid crystal panel are enclosed. The external mask includes at least a window allowing the photometer to measure the liquid crystal panel therefrom. The temperature control device mounted to the external mask is suitable to control the temperature variation of the cavity.

Abstract: An ambient temperature control apparatus used for measuring ambient temperature. The apparatus has a bottom plate, a panel fitting apparatus, an external mask, and a temperature control device. The panel fitting apparatus is disposed on the bottom plate and is suitable for use to fix a liquid crystal panel. The external mask is detachably mounted on the bottom plate to form a cavity, in which the panel fitting apparatus and the liquid crystal panel are enclosed. The external mask includes at least a window allowing the photometer to measure the liquid crystal panel therefrom. The temperature control device mounted to the external mask is suitable to control the temperature variation of the cavity.

Abstract: An ambient temperature control apparatus used for measuring ambient temperature. The apparatus has a bottom plate, a panel fitting apparatus, an external mask, and a temperature control device. The panel fitting apparatus is disposed on the bottom plate and is suitable for use to fix a liquid crystal panel. The external mask is detachably mounted on the bottom plate to form a cavity, in which the panel fitting apparatus and the liquid crystal panel are enclosed. The external mask includes at least a window allowing the photometer to measure the liquid crystal panel therefrom. The temperature control device mounted to the external mask is suitable to control the temperature variation of the cavity.

Abstract: A wafer positioning checking system used in a vertical furnace as found in a semiconductor manufacturing facility for manufacturing chips. The system utilizes a first sensor such as a photoelectric or laser sensor that checks the peripheral alignment of the wafers loaded in the boat. A second sensor is mounted on a robot having a wafer-handling arm for checking the position of a wafer that has just been loaded into the boat. An algorithm in a control unit responds to electrical signals generated by these two sensors to allow the loading operation to continue as long as the wafers are properly positioned and to controllable monitoring the wafers during a portion of the processing.