Patents by Inventor Ming-Fu Chang

Ming-Fu Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200135651
    Abstract: A package structure is provided. The package structure includes a redistribution layer and a first integrated circuit chip having a first chip edge and a second integrated circuit chip having a second chip edge over the redistribution layer. The package structure also includes first bumps electrically connected to the first integrated circuit chip through the redistribution layer. In addition, the first bumps overlap the first integrated circuit chip and are arranged along a first chip edge of the first integrated circuit chip. The package structure further includes second bumps electrically connected to the first integrated circuit chip through the redistribution layer without overlapping the first integrated circuit chip and the second integrated circuit chip. In addition, none of the second bumps is arranged between the first chip edge and the second chip edge.
    Type: Application
    Filed: December 23, 2019
    Publication date: April 30, 2020
    Inventors: Ming-Yen CHIU, Hsin-Chieh HUANG, Ching-Fu CHANG
  • Patent number: 10629588
    Abstract: Some embodiments relate to a semiconductor device on a substrate. An interconnect structure is disposed over the substrate, and a first conductive pad is disposed over the interconnect structure. A second conductive pad is disposed over the interconnect structure and is spaced apart from the first conductive pad. A third conductive pad is disposed over the interconnect structure and is spaced apart from the first and second conductive pads. A fourth conductive pad is disposed over the interconnect structure and is spaced apart from the first, second, and third conductive pads. A first ESD protection element is electrically coupled between the first and second pads; and a second ESD protection element is electrically coupled between the third and fourth pads. A first device under test is electrically coupled between the first and third conductive pads; and a second device under test is electrically coupled between the second and fourth pads.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: April 21, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jen-Chou Tseng, Ming-Fu Tsai, Tzu-Heng Chang
  • Publication number: 20200101711
    Abstract: The present invention provides a method of laminating a film for a dye-sensitized cell. First, a composite film is taken by a robotic arm, in which the composite film includes a release layer, a protective layer and a hot glue layer between the release layer and the protective layer, and the release layer is removed by the robotic arm. Then, the hot glue layer is precisely attached to a substrate by a target positioning step. Next, the protective layer is removed by the robotic arm.
    Type: Application
    Filed: October 2, 2019
    Publication date: April 2, 2020
    Inventors: Ching-Fu CHEN, Hao-Wei CHEN, Kun-Tai HO, Wan-Tun HUNG, Po-Min CHEN, Liang-Kun HUANG, Chih-Chou CHANG, Yung-Liang TUNG, Po-Tsung HSIAO, Ming-De LU
  • Patent number: 10580937
    Abstract: An optoelectronic device includes a semiconductor structure having a first side and a second side opposite to the first side, a first pad at the first side, a first finger connected to the electrode pad and having a first width, an insulating layer at the second side and comprising a first part under the first finger, the first part having a bottom surface with a second width larger than the first width and a side surface inclined to the bottom surface, and a contact layer covering the bottom surface and the side surface.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: March 3, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Chun-Yu Lin, Yung-Fu Chang, Rong-Ren Lee, Kuo-Feng Huang, Cheng-Long Yeh, Yi-Ching Lee, Ming-Siang Huang, Ming-Tzung Liou
  • Patent number: 10564760
    Abstract: A touch system, a stylus, a touch apparatus, and a control method of the touch apparatus are provided. The control method includes following steps. At least one characteristic data of at least one input tool is obtained. An identifier of the input tool is generated according to the characteristic data. If a touch operation on the touch panel is performed with the input tool, a specific function of the touch apparatus is determined according to the identifier of the input tool.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: February 18, 2020
    Assignee: Wistron Corporation
    Inventors: Yao-Tsung Chang, Ching-Fu Hsu, Ming-Chih Chen, Kuo-Hsing Wang, Jui-Ta Hsieh, Chih-Chung Chiang, Wen-Hua Chang
  • Publication number: 20200051486
    Abstract: A display device includes multiple shift register groups, multiple multiplexer groups, a driver IC, and multiple pixel circuits. The driver IC is configured to control the multiple shift register groups and the multiple multiplexer groups. A shift register group of the multiple shift register groups and a multiplexer group of the multiple multiplexer groups cooperatively drive a part of pixel circuits of the multiple pixel circuits. When the shift register group and the multiplexer group are enabled in a first time period, other shift register groups and other multiplexer groups are enabled in a second time period within the first time period. The first time period is longer than the second time period to render the part of pixel circuits and another part of pixel circuits to respectively have a first frame rate and a second frame rate.
    Type: Application
    Filed: August 7, 2019
    Publication date: February 13, 2020
    Inventors: Che-Chia CHANG, Ming-Hsien LEE, Chun-Fu CHUNG, Ming-Hung CHUANG
  • Publication number: 20200051480
    Abstract: A display apparatus includes a plurality of pixel lines, a multiplexer, a first switch and a second switch. The pixel lines are respectively coupled to a plurality of data lines. The data lines include a first selected data line, a second selected data line and a plurality of other data lines. The first switch is coupled between the first selected data line and a first non-selected data line among the other data lines and is turned on or turned off according to a first control signal. The second switch is coupled between the first selected data line and a second non-selected data line among the other data lines and is turned on or cut off according to a second control signal.
    Type: Application
    Filed: July 17, 2019
    Publication date: February 13, 2020
    Applicant: Au Optronics Corporation
    Inventors: Che-Chia Chang, Ming-Hung Chuang, Ming-Hsien Lee, Chun-Fu Chung
  • Publication number: 20200023242
    Abstract: A golf club head and a striking plate for connecting a shell of a golf club head are provided. The striking plate includes a plate body and at least one rib member. The plate body has a crown-connecting side, a sole-connecting side, a toe-connecting side, a heel-connecting side respectively connecting to a crown, a sole, a toe and a heel, a central portion surrounded by the crown-connecting side, the sole-connecting side, the toe-connecting side and the heel-connecting side, a front striking face, and a rear face. The at least one rib member includes two opposite end portions projecting rearwardly from the rear face, and a bridge portion connected between the two opposite end portions and spaced apart from the rear face.
    Type: Application
    Filed: November 6, 2018
    Publication date: January 23, 2020
    Inventors: Te-Fu HSIAO, Min-Tsung CHEN, Ming-Fu SU, Chin-Tang CHANG
  • Publication number: 20200018786
    Abstract: An insulation resistance measuring device for detecting insulation resistance of an electric vehicle comprising a battery system, a measuring unit, a control unit and a calculation unit. The measuring unit comprises a circuit module, a first switch, a second switch and a voltage detecting unit. The circuit module comprises a plurality of resistances, which connected between a positive side and a negative side of the battery system. The first switch is connected between the circuit module and a ground side. The second switch is connected between the circuit module and the negative side. The voltage detecting unit is arranged at a connecting node of the resistances of the circuit module. The control unit is configured to control the first switch and the second switch to turn on or turn off. The calculation unit is configured to calculate a high potential insulation resistance and a low potential insulation resistance of the electric vehicle.
    Type: Application
    Filed: December 10, 2018
    Publication date: January 16, 2020
    Inventors: Pao Hung Lin, Po Shen Chen, Kuo Ho Cheng, Ming Chun Chang, Tsai Fu Lin
  • Patent number: 10515899
    Abstract: A package structure is provided. The package structure includes a molding compound. The package structure also includes an integrated circuit chip having a chip edge in the molding compound. The package structure further includes a passivation layer below the integrated circuit chip and the molding compound. In addition, the package structure includes a redistribution layer in the passivation layer. The package structure also includes first bumps electrically connected to the integrated circuit chip through the redistribution layer. The first bumps are inside the chip edge and arranged along the chip edge. The package structure further includes second bumps electrically connected to the integrated circuit chip through the redistribution layer. The second bumps are outside the chip edge and arranged along the chip edge. The first bumps are next to the second bumps. The first and second bumps are spaced apart from the chip edge.
    Type: Grant
    Filed: October 3, 2016
    Date of Patent: December 24, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming-Yen Chiu, Hsin-Chieh Huang, Ching-Fu Chang
  • Publication number: 20190252323
    Abstract: An integrated fan-out package including an integrated circuit, an insulating encapsulation, and a redistribution circuit structure is provided. The integrated circuit includes an antenna region. The insulating encapsulation encapsulates the integrated circuit. The redistribution circuit structure is disposed on the integrated circuit and the insulating encapsulation. The redistribution circuit structure is electrically connected to the integrated circuit, and the redistribution circuit structure includes a redistribution region and a dummy region including a plurality of dummy patterns embedded therein, wherein the antenna region includes an inductor and a wiring-free dielectric portion, and the wiring-free dielectric portion of the antenna region is between the inductor and the dummy region.
    Type: Application
    Filed: April 29, 2019
    Publication date: August 15, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ming-Yen Chiu, Ching-Fu Chang, Hsin-Chieh Huang
  • Publication number: 20190148599
    Abstract: An optoelectronic device includes a semiconductor stack including a first surface and a second surface opposite to the first surface; a first contact layer on the first surface; and a second contact layer on the second surface. The second contact layer is not overlapped with the first contact layer in a vertical direction. The second contact layer includes a plurality of dots separating to each other and formed of semiconductor material.
    Type: Application
    Filed: December 20, 2018
    Publication date: May 16, 2019
    Inventors: Chun-Yu LIN, Yung-Fu CHANG, Rong-Ren LEE, Kuo-Feng HUANG, Cheng-Long YEH, Yi-Ching LEE, Ming-Siang HUANG, Ming-Tzung LIOU
  • Patent number: 7691390
    Abstract: The present invention is directed to an isolated polypeptide containing SEQ ID NO: 1 or an immunogenic fragment thereof. Also disclosed is an isolated nucleic acid encoding the polypeptide or containing a sequence at least 70% identical to SEQ ID NO: 3. Within the scope of this invention are related expression vectors, host cells, and antibodies. Also disclosed are methods of producing the polypeptide, diagnosing coronavirus infection, and identifying a test compound for treating coronavirus infection.
    Type: Grant
    Filed: September 19, 2007
    Date of Patent: April 6, 2010
    Inventors: Fang-Jen Lee, Chia-Jung Yu, Ming-Fu Chang, Hong-Nerng Ho
  • Publication number: 20090068636
    Abstract: The present invention is directed to an isolated polypeptide containing SEQ ID NO: 1 or an immunogenic fragment thereof. Also disclosed is an isolated nucleic acid encoding the polypeptide or containing a sequence at least 70% identical to SEQ ID NO: 3. Within the scope of this invention are related expression vectors, host cells, and antibodies. Also disclosed are methods of producing the polypeptide, diagnosing coronavirus infection, and identifying a test compound for treating coronavirus infection.
    Type: Application
    Filed: September 19, 2007
    Publication date: March 12, 2009
    Inventors: Fang-Jen Lee, Chia-Jung Yu, Ming-Fu Chang, Hong-Nerng Ho