Patents by Inventor Ming-Fu Jiang
Ming-Fu Jiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240055419Abstract: An electronic device is provided. The electronic device includes a substrate, a plurality of diodes, at least one transistor, a chip, a conductive layer and a conductive layer. The substrate has a first surface and a second surface opposite to the first surface. The plurality of diodes are disposed on the first surface of the substrate. The at least one transistor is disposed on the first surface of the substrate and electrically connected to at least one of the plurality of diodes. The chip is disposed on the second surface of the substrate and electrically connected to the at least one transistor. The conductive layer is disposed between the substrate and the chip. The protection layer is disposed between the conductive layer and the chip. Moreover, the protection layer has an opening and through which the chip is electrically connected to the conductive layer.Type: ApplicationFiled: October 25, 2023Publication date: February 15, 2024Inventors: Wei-Cheng CHU, Ming-Fu JIANG, Chia-Cheng LIU, Chih-Yuan LEE
-
Patent number: 11837592Abstract: A device includes a substrate having a first surface and a second surface opposite to the first surface; a thin-film transistor array disposed on the first surface, including a plurality of transistors; a plurality of diodes disposed on the thin-film transistor array; a plurality of conductive structures penetrating through the substrate from the first surface to the second surface, wherein the plurality of conductive structures are corresponding to the plurality of diodes and electrically connected to the plurality of diodes; a driver unit disposed on the second surface of the substrate; a patterned conductive layer disposed between the substrate and the driver unit; a protection layer disposed on the patterned conductive layer, wherein the protection layer has an opening that exposes the patterned conductive layer; and a conductive material disposed in the opening.Type: GrantFiled: May 30, 2022Date of Patent: December 5, 2023Assignee: INNOLUX CORPORATIONInventors: Wei-Cheng Chu, Ming-Fu Jiang, Chia-Cheng Liu, Chih-Yuan Lee
-
Publication number: 20230037560Abstract: A flexible circuit structure includes: a flexible substrate having a surface; a plurality of first pads disposed on the surface; and an insulating layer disposed on the surface and between two adjacent first pads of the plurality of first pads, wherein the insulating layer has a first maximum height in a normal direction of the surface, one of the plurality of first pads has a second maximum height in the normal direction of the surface, and the first maximum height is less than or equal to the second maximum height.Type: ApplicationFiled: October 18, 2022Publication date: February 9, 2023Inventors: Wei-Cheng CHU, Chia-Cheng LIU, Ming-Fu JIANG
-
Patent number: 11510321Abstract: An electronic device includes a flexible circuit structure. The flexible circuit structure includes a flexible substrate and an insulator. The flexible substrate has a surface on which a plurality of pads are disposed. The insulator is disposed on the flexible substrate and is disposed between two adjacent pads of the plurality of pads.Type: GrantFiled: March 1, 2021Date of Patent: November 22, 2022Assignee: INNOLUX CORPORATIONInventors: Wei-Cheng Chu, Chia-Cheng Liu, Ming-Fu Jiang
-
Publication number: 20220293578Abstract: A device includes a substrate having a first surface and a second surface opposite to the first surface; a thin-film transistor array disposed on the first surface, including a plurality of transistors; a plurality of diodes disposed on the thin-film transistor array; a plurality of conductive structures penetrating through the substrate from the first surface to the second surface, wherein the plurality of conductive structures are corresponding to the plurality of diodes and electrically connected to the plurality of diodes; a driver unit disposed on the second surface of the substrate; a patterned conductive layer disposed between the substrate and the driver unit; a protection layer disposed on the patterned conductive layer, wherein the protection layer has an opening that exposes the patterned conductive layer; and a conductive material disposed in the opening.Type: ApplicationFiled: May 30, 2022Publication date: September 15, 2022Inventors: Wei-Cheng CHU, Ming-Fu JIANG, Chia-Cheng LIU, Chih-Yuan LEE
-
Patent number: 11380661Abstract: A display device is provided. The display device includes a substrate having a first surface and a second surface opposite to the first surface, a plurality of light-emitting units disposed on the first surface of the substrate, and a plurality of conductive structures extending into the substrate from the second surface of the substrate. The plurality of conductive structures are electrically connected to the plurality of light-emitting units.Type: GrantFiled: June 16, 2020Date of Patent: July 5, 2022Assignee: INNOLUX CORPORATIONInventors: Wei-Cheng Chu, Ming-Fu Jiang, Chia-Cheng Liu, Chih-Yuan Lee
-
Publication number: 20210298181Abstract: An electronic device includes a flexible circuit structure. The flexible circuit structure includes a flexible substrate and an insulator. The flexible substrate has a surface on which a plurality of pads are disposed. The insulator is disposed on the flexible substrate and is disposed between two adjacent pads of the plurality of pads.Type: ApplicationFiled: March 1, 2021Publication date: September 23, 2021Inventors: Wei-Cheng CHU, Chia-Cheng LIU, Ming-Fu JIANG
-
Patent number: 10825787Abstract: A first electronic element is disclosed, which includes: a first substrate having a first surface; a first electrode pad disposed on the first surface, wherein the first electrode pad has a second surface away from the first substrate; and an insulating layer disposed on the first surface, wherein the insulating layer includes an opening, the opening is disposed correspondingly to the first electrode pad, and the opening overlaps the first electrode pad in a normal direction of the first surface, wherein the insulating layer has a third surface away from the first substrate, a distance between the third surface and the second surface in the normal direction of the first surface is defined as a first distance, and the first distance is greater than 0 ?m and less than or equal to 14 ?m. In addition, the disclosure further provides an electronic device including the first electronic element.Type: GrantFiled: October 1, 2018Date of Patent: November 3, 2020Assignee: Innolux CorporationInventors: Wei-Cheng Chu, Ming-Fu Jiang, Chia-Cheng Liu, Tong-Jung Wang
-
Publication number: 20200312828Abstract: A display device is provided. The display device includes a substrate having a first surface and a second surface opposite to the first surface, a plurality of light-emitting units disposed on the first surface of the substrate, and a plurality of conductive structures extending into the substrate from the second surface of the substrate. The plurality of conductive structures are electrically connected to the plurality of light-emitting units.Type: ApplicationFiled: June 16, 2020Publication date: October 1, 2020Inventors: Wei-Cheng CHU, Ming-Fu JIANG, Chia-Cheng LIU, Chih-Yuan LEE
-
Patent number: 10720415Abstract: A display device is provided. The display device includes a substrate having a first surface and a second surface opposite to the first surface, a plurality of light-emitting units disposed on the first surface of the substrate, and a plurality of conductive structures extending into the substrate from the second surface of the substrate. The plurality of conductive structures are electrically connected to the plurality of light-emitting units.Type: GrantFiled: September 8, 2017Date of Patent: July 21, 2020Assignee: INNOLUX CORPORATIONInventors: Wei-Cheng Chu, Ming-Fu Jiang, Chia-Cheng Liu, Chih-Yuan Lee
-
Patent number: 10672829Abstract: The disclosure provides a manufacturing method of an LED display device, including the following steps: providing a substrate; forming at least one first bonding pad and at least one second bonding pad on the substrate; forming at least one spacer on the substrate, wherein the spacer is located between the first bonding pad and the second bonding pad, and a height of the spacer is P ?m; providing a conductive paste layer above the substrate, wherein the conductive paste layer includes a plurality of conductive particles; and bonding at least one LED on the substrate, wherein the LED includes a first electrode and a second electrode, and the first electrode and the second electrode have a height H ?m. The first electrode and the second electrode of the LED are respectively electrically connected to the first bonding pad and the second bonding pad of the substrate through the conductive particles of the conductive paste layer, and H+3.5 ?m?P ?m?H+0.48 ?M.Type: GrantFiled: December 5, 2018Date of Patent: June 2, 2020Assignee: Innolux CorporationInventors: Wei-Cheng Chu, Ming-Fu Jiang, Gu-Jhong Jhang
-
Publication number: 20190148320Abstract: A first electronic element is disclosed, which includes: a first substrate having a first surface; a first electrode pad disposed on the first surface, wherein the first electrode pad has a second surface away from the first substrate; and an insulating layer disposed on the first surface, wherein the insulating layer includes an opening, the opening is disposed correspondingly to the first electrode pad, and the opening overlaps the first electrode pad in a normal direction of the first surface, wherein the insulating layer has a third surface away from the first substrate, a distance between the third surface and the second surface in the normal direction of the first surface is defined as a first distance, and the first distance is greater than 0 ?m and less than or equal to 14 ?m. In addition, the disclosure further provides an electronic device including the first electronic element.Type: ApplicationFiled: October 1, 2018Publication date: May 16, 2019Inventors: Wei-Cheng CHU, Ming-Fu JIANG, Chia-Cheng LIU, Tong-Jung WANG
-
Publication number: 20190109174Abstract: The disclosure provides a manufacturing method of an LED display device, including the following steps: providing a substrate; forming at least one first bonding pad and at least one second bonding pad on the substrate; forming at least one spacer on the substrate, wherein the spacer is located between the first bonding pad and the second bonding pad, and a height of the spacer is P ?m; providing a conductive paste layer above the substrate, wherein the conductive paste layer includes a plurality of conductive particles; and bonding at least one LED on the substrate, wherein the LED includes a first electrode and a second electrode, and the first electrode and the second electrode have a height H ?m. The first electrode and the second electrode of the LED are respectively electrically connected to the first bonding pad and the second bonding pad of the substrate through the conductive particles of the conductive paste layer, and H+3.5 ?m?P ?m?H+0.48 ?M.Type: ApplicationFiled: December 5, 2018Publication date: April 11, 2019Applicant: Innolux CorporationInventors: Wei-Cheng Chu, Ming-Fu Jiang, Gu-Jhong Jhang
-
Publication number: 20190088196Abstract: A display device is provided. The display device includes a first light-emitting diode and a second light-emitting diode. The first light-emitting diode includes a first conductive pad, a second conductive pad adjacent to the first conductive pad, and a first light-emitting portion disposed on the first conductive pad. The second light-emitting diode includes a third conductive pad, a fourth conductive pad adjacent to the third conductive pad, and a second light-emitting portion disposed on the third conductive pad. A distance between the first conductive pad and the third conductive pad is less than a distance between the second conductive pad and the fourth conductive pad.Type: ApplicationFiled: August 28, 2018Publication date: March 21, 2019Inventors: Wei-Cheng CHU, Ming-Fu JIANG, Chia-Cheng LIU, Shun-Yuan HU, Ming-I CHAO
-
Patent number: 10186548Abstract: The disclosure provides an LED display device including a substrate, at least one first bonding pad and at least one second bonding pad, at least one spacer, at least one LED, and a conductive paste layer. The first and the second bonding pads are disposed on the substrate. The spacer is located between the first and the second bonding pads, wherein a height of the spacer is P ?m. The LED is disposed on the substrate and includes a first electrode and a second electrode. The first and the second electrodes have a height H ?m. The conductive paste layer is located between the substrate and the LED and includes a plurality of conductive particles. The first and the second electrodes are respectively electrically connected to the first and the second bonding pads through the conductive particles, and H+3.5 ?m?P ?m?H+0.48 ?m.Type: GrantFiled: August 16, 2017Date of Patent: January 22, 2019Assignee: Innolux CorporationInventors: Wei-Cheng Chu, Ming-Fu Jiang, Gu-Jhong Jhang
-
Publication number: 20180122787Abstract: A display device is provided. The display device includes a substrate having a first surface and a second surface opposite to the first surface, a plurality of light-emitting units disposed on the first surface of the substrate, and a plurality of conductive structures extending into the substrate from the second surface of the substrate. The plurality of conductive structures are electrically connected to the plurality of light-emitting units.Type: ApplicationFiled: September 8, 2017Publication date: May 3, 2018Inventors: Wei-Cheng CHU, Ming-Fu JIANG, Chia-Cheng LIU, Chih-Yuan LEE
-
Publication number: 20180053808Abstract: The disclosure provides an LED display device including a substrate, at least one first bonding pad and at least one second bonding pad, at least one spacer, at least one LED, and a conductive paste layer. The first and the second bonding pads are disposed on the substrate. The spacer is located between the first and the second bonding pads, wherein a height of the spacer is P ?m. The LED is disposed on the substrate and includes a first electrode and a second electrode. The first and the second electrodes have a height H ?m. The conductive paste layer is located between the substrate and the LED and includes a plurality of conductive particles. The first and the second electrodes are respectively electrically connected to the first and the second bonding pads through the conductive particles, and H+3.5 ?m?P ?m?H+0.48 ?m.Type: ApplicationFiled: August 16, 2017Publication date: February 22, 2018Applicant: Innolux CorporationInventors: Wei-Cheng Chu, Ming-Fu Jiang, Gu-Jhong Jhang