Abstract: A semiconductor structure includes a first die; a plurality of first conductive vias adjacent to the first die. The semiconductor structure further includes a plurality of second conductive vias disposed over the first conductive vias, each of the second conductive vias corresponding to one of the first conductive vias; a plurality of third conductive vias disposed over the first die; and a molding material encapsulating the first die, the first conductive vias, the second conductive vias and the third conductive vias. A first width of each of the plurality of first conductive vias, a second width of each of the plurality of second conductive vias and a third width of the plurality of third conductive vias are different from each other.

Abstract: A semiconductor structure includes a first die; a second die disposed over the first die; a plurality of first conductive vias adjacent to the first die. The semiconductor structure further includes a plurality of second conductive vias disposed over the first conductive vias, each of the second conductive vias corresponding to one of the first conductive vias; a plurality of third conductive vias disposed over the first die and adjacent to the second die; and a molding material encapsulating the first die, the second die, the first conductive vias, the second conductive vias and the third conductive vias. A stepped shape is formed around an interface between each of the first conductive vias and the corresponding one of the second conductive vias.

Abstract: The present invention provides a trampoline comprising a top panel, and a main body, wherein the method that the top panel attached to the mail body is RF welding or heat sealing. The present invention also provides a trampoline wherein the top panel and the main body are formed as a single piece. The present invention further provides a method of manufacturing trampoline wherein the top panel is attached to the mail body by RF welding or heat sealing, or the top panel and the mail body are formed as a single piece.

Abstract: The present invention provides a trampoline comprising a top panel, and a main body, wherein the method that the top panel attached to the mail body is RF welding or heat sealing. The present invention also provides a trampoline wherein the top panel and the main body are formed as a single piece. The present invention further provides a method of manufacturing trampoline wherein the top panel is attached to the mail body by RF welding or heat sealing, or the top panel and the mail body are formed as a single piece.

Abstract: A back assembly for an animal to bear a doll comprises a first back sheet capable of covering upon a back of an animal; the first back sheet having an first upper combining portion at an upper side thereof; two rear connecting units at two rear ends of the first back sheet; two front straps at two front ends of the first back sheet; each front strap having a front connecting unit at a distal end of the front strap; the front connecting unit being combinable to a respective one of the rear connecting units; a doll having a lower combining portion at a lower side thereof; the lower combining portion being combinable to the first upper combining portion of the first back sheet. The doll is placed upon the first back sheet by the combination of the lower combining portion to the first upper combining portion.