Patents by Inventor Ming-Fu Tseng

Ming-Fu Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12002706
    Abstract: Methods and devices are provided herein for enhancing robustness of a bipolar electrostatic discharge (ESD) device. The robustness of a bipolar ESD device includes providing an emitter region and a collector region adjacent to the emitter region. An isolation structure is provided between the emitter region and the collector region. A ballasting characteristic at the isolation structure is modified by inserting at least one partition structure therein. Each partition structure extends substantially abreast at least one of the emitter and the collector regions.
    Type: Grant
    Filed: July 3, 2023
    Date of Patent: June 4, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Alexander Kalnitsky, Jen-Chou Tseng, Chia-Wei Hsu, Ming-Fu Tsai
  • Patent number: 11942433
    Abstract: In an embodiment, a structure includes: a first integrated circuit die including first die connectors; a first dielectric layer on the first die connectors; first conductive vias extending through the first dielectric layer, the first conductive vias connected to a first subset of the first die connectors; a second integrated circuit die bonded to a second subset of the first die connectors with first reflowable connectors; a first encapsulant surrounding the second integrated circuit die and the first conductive vias, the first encapsulant and the first integrated circuit die being laterally coterminous; second conductive vias adjacent the first integrated circuit die; a second encapsulant surrounding the second conductive vias, the first encapsulant, and the first integrated circuit die; and a first redistribution structure including first redistribution lines, the first redistribution lines connected to the first conductive vias and the second conductive vias.
    Type: Grant
    Filed: January 17, 2022
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Jen-Fu Liu, Ming Hung Tseng, Tsung-Hsien Chiang, Yen-Liang Lin, Tzu-Sung Huang
  • Patent number: 10500428
    Abstract: The present invention provides a trampoline comprising a top panel, and a main body, wherein the method that the top panel attached to the mail body is RF welding or heat sealing. The present invention also provides a trampoline wherein the top panel and the main body are formed as a single piece. The present invention further provides a method of manufacturing trampoline wherein the top panel is attached to the mail body by RF welding or heat sealing, or the top panel and the mail body are formed as a single piece.
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: December 10, 2019
    Inventor: Ming Fu Tseng
  • Publication number: 20180280749
    Abstract: The present invention provides a trampoline comprising a top panel, and a main body, wherein the method that the top panel attached to the mail body is RF welding or heat sealing. The present invention also provides a trampoline wherein the top panel and the main body are formed as a single piece. The present invention further provides a method of manufacturing trampoline wherein the top panel is attached to the mail body by RF welding or heat sealing, or the top panel and the mail body are formed as a single piece.
    Type: Application
    Filed: July 6, 2017
    Publication date: October 4, 2018
    Inventor: Ming Fu TSENG
  • Publication number: 20090298380
    Abstract: A back assembly for an animal to bear a doll comprises a first back sheet capable of covering upon a back of an animal; the first back sheet having an first upper combining portion at an upper side thereof; two rear connecting units at two rear ends of the first back sheet; two front straps at two front ends of the first back sheet; each front strap having a front connecting unit at a distal end of the front strap; the front connecting unit being combinable to a respective one of the rear connecting units; a doll having a lower combining portion at a lower side thereof; the lower combining portion being combinable to the first upper combining portion of the first back sheet. The doll is placed upon the first back sheet by the combination of the lower combining portion to the first upper combining portion.
    Type: Application
    Filed: June 1, 2008
    Publication date: December 3, 2009
    Inventors: Ming-Fu Tseng, Hsiu-Chen Lu
  • Patent number: D407568
    Type: Grant
    Filed: February 11, 1998
    Date of Patent: April 6, 1999
    Inventor: Ming-Fu Tseng