Abstract: An electronic structure includes a substrate body, an electronic package structure and a conductive unit. The electronic package structure is disposed on the substrate body. The electronic package structure includes a first inner electrode portion, a second inner electrode portion, a first outer electrode portion electrically connected to the first inner electrode portion, and a second outer electrode portion electrically connected to the second inner electrode portion. The conductive unit includes a first conductive body and a second conductive body respectively electrically contacting the first and the second outer electrode portions. The electronic package structure has a first notch and a second notch, the first outer electrode portion is extended into the first notch to contact the top surface of the first inner electrode portion, and the second outer electrode portion is extended into the second notch to contact the top surface of the second inner electrode portion.

Abstract: An electronic structure includes a substrate body, an electronic package structure and a conductive unit. The electronic package structure is disposed on the substrate body. The electronic package structure includes a first inner electrode portion, a second inner electrode portion, a first outer electrode portion electrically connected to the first inner electrode portion, and a second outer electrode portion electrically connected to the second inner electrode portion. The conductive unit includes a first conductive body and a second conductive body respectively electrically contacting the first and the second outer electrode portions. The electronic package structure has a first notch and a second notch, the first outer electrode portion is extended into the first notch to contact the top surface of the first inner electrode portion, and the second outer electrode portion is extended into the second notch to contact the top surface of the second inner electrode portion.

Abstract: The common mode filter of the instant disclosure includes a non-magnetic insulating substrate, a stacked-layer structure, an insulating layer, and a magnetic layer. The stacked-layer structure is arranged on the non-magnetic insulating substrate. The magnetic layer is covered on the stacked-layer structure by the insulating layer arranged therebetween. The stacked-layer structure comprises a first coil and second coil, wherein the first coil is coupled to the second coil to suppress the common mode noise. Specially, a width W (mm) and a length L (mm) of at least one coil in the first and second coils satisfy the relational expression of: [(14.1?fc)/6.5]2<L/W<[(16.7?fc)/4.5]2 Where fc (MHz) is the cutoff frequency of a differential-mode signal.

Abstract: One aspect of the present invention provides a method for preparing a thin film device with an insulation layer from a dry polyimide film and a method for preparing a common mode filter using the same. A method for preparing a thin film device according to this aspect of the present invention includes the steps of forming at least one first conductive pattern on a substrate; placing a dry polyimide film on the first conductive pattern; applying a force to the dry polyimide film such that the dry polyimide film fills spaces in the first conductive pattern; and forming at least one second conductive pattern on the dry polyimide film.