Abstract: A method for making a semiconductor structure includes: providing a substrate with a contact feature thereon; forming a dielectric layer on the substrate; etching the dielectric layer to form an interconnect opening exposing the contact feature; forming a metal layer on the dielectric layer and outside of the contact feature; and forming a graphene conductive structure on the metal layer, the graphene conductive structure filling the interconnect opening, being electrically connected to the contact feature, and having at least one graphene layer that extends in a direction substantially perpendicular to the substrate.

Abstract: An expansion card with homogenized light outputs and light-homogenizing device thereof are disclosed. The expansion card includes a circuit board and a light-homogenizing device. The circuit board includes a light-emitting device disposed on a first side edge. The light-homogenizing device includes a light-guiding body, a light-diffusion element, and a light-turning element. The light-guiding body includes a light-input side and a light-output side opposite to each other, and the light-input side is adjacent to the first side edge. The light-diffusion element is disposed on the light-input side of the light-guiding body and opposite to the light-emitting device. The light-diffusion element and the light-out side are configured to diffuse the light beams entering into the light-guiding body from the light-emitting device and form a light-transmitting path.

Abstract: An expansion card with homogenized light outputs and light-homogenizing device thereof are disclosed. The expansion card includes a circuit board and a light-homogenizing device. The circuit board includes a light-emitting device disposed on a first side edge. The light-homogenizing device includes a light-guiding body, a light-diffusion element, and a light-turning element. The light-guiding body includes a light-input side and a light-output side opposite to each other, and the light-input side is adjacent to the first side edge. The light-diffusion element is disposed on the light-input side of the light-guiding body and opposite to the light-emitting device. The light-diffusion element and the light-out side are configured to diffuse the light beams entering into the light-guiding body from the light-emitting device and form a light-transmitting path.

Abstract: A memory controller is provided. The memory controller includes a memory interface and an encoding module. The memory interface is configured to couple to a memory chip. The encoding module is coupled to the memory interface and includes a shared memory and a parity generation module. The parity generation module is coupled to the shared memory. The parity generation module reads at least one basic vector from the shared memory, determines a dimension of the at least one basic vector, generates a generation matrix according to the at least one basic vector, converts a raw data into a codeword through the generation matrix, and stores the codeword into the memory chip through the memory interface.

Abstract: A memory controller is provided. The memory controller includes a memory interface and an encoding module. The memory interface is configured to couple to a memory chip. The encoding module is coupled to the memory interface and includes a shared memory and a parity generation module. The parity generation module is coupled to the shared memory. The parity generation module reads at least one basic vector from the shared memory, determines a dimension of the at least one basic vector, generates a generation matrix according to the at least one basic vector, converts a raw data into a codeword through the generation matrix, and stores the codeword into the memory chip through the memory interface.