Patents by Inventor Ming-Han Tsai

Ming-Han Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240139301
    Abstract: The disclosure provides a method of active immunotherapy for a cancer patient, comprising administering vaccines against Globo series antigens (i.e., Globo H, SSEA-3 and SSEA-4). Specifically, the method comprises administering Globo H-CRM197 (OBI-833/821) in patients with cancer. The disclosure also provides a method of selecting a cancer patient who is suitable as treatment candidate for immunotherapy. Exemplary immune response can be characterized by reduction of the severity of disease, including but not limited to, prevention of disease, delay in onset of disease, decreased severity of symptoms, decreased morbidity and delayed mortality.
    Type: Application
    Filed: November 19, 2021
    Publication date: May 2, 2024
    Inventors: Ming-Tain LAI, Cheng-Der Tony YU, I-Ju CHEN, Wei-Han LEE, Chueh-Hao YANG, Chun-Yen TSAO, Chang-Lin HSIEH, Chien-Chih OU, Chen-En TSAI
  • Patent number: 11954824
    Abstract: An image pre-processing method and an image processing apparatus for a fundoscopic image are provided. A region of interest (ROI) is obtained from a fundoscopic image to generate a first image. The ROI is focused on an eyeball in the fundoscopic image. A smoothing process is performed on the first image to generate a second image. A value difference between neighboring pixels in the second image is increased to generate a third image.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: April 9, 2024
    Assignee: Acer Medical Inc.
    Inventors: Yi-Jin Huang, Chin-Han Tsai, Ming-Ke Chen
  • Patent number: 11955423
    Abstract: Methods for forming dummy under-bump metallurgy structures and semiconductor devices formed by the same are disclosed. In an embodiment, a semiconductor device includes a first redistribution line and a second redistribution line over a semiconductor substrate; a first passivation layer over the first redistribution line and the second redistribution line; a second passivation layer over the first passivation layer; a first under-bump metallurgy (UBM) structure over the first redistribution line, the first UBM structure extending through the first passivation layer and the second passivation layer and being electrically coupled to the first redistribution line; and a second UBM structure over the second redistribution line, the second UBM structure extending through the second passivation layer, the second UBM structure being electrically isolated from the second redistribution line by the first passivation layer.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ting-Li Yang, Po-Hao Tsai, Ming-Da Cheng, Yung-Han Chuang, Hsueh-Sheng Wang
  • Patent number: 11953078
    Abstract: A gear module includes a rotating cylinder, a first planetary gear set, a second planetary gear set, a concave-convex structure, and a limit bearing set. The first planetary gear set is accommodated in the rotating cylinder and includes a driven gear; the second planetary gear set includes a positioning frame, second planetary gears pivoted to a positioning frame, a driven gear engaged with the second planetary gears, and the positioning frame has a through hole; the concave-convex structure includes a convex column extended from the rotating cylinder and a concave hole formed on the positioning frame, the convex column is plugged into the concave hole; the limit bearing set includes a first ball bearing sheathing the driven gear and mounted between the driven gear and the through hole, and a second ball bearing sheathing the convex column and mounted between the convex column and the concave hole.
    Type: Grant
    Filed: August 16, 2023
    Date of Patent: April 9, 2024
    Assignee: SHA YANG YE INDUSTRIAL CO., LTD.
    Inventors: Feng-Chun Tsai, Ming-Han Tsai, Chin-Fa Lu, Kai-Hsien Wang
  • Patent number: 11929314
    Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Hsien Huang, Peng-Fu Hsu, Yu-Syuan Cai, Min-Hsiu Hung, Chen-Yuan Kao, Ken-Yu Chang, Chun-I Tsai, Chia-Han Lai, Chih-Wei Chang, Ming-Hsing Tsai
  • Publication number: 20240080505
    Abstract: A method, comprising: detecting an outage of at least one functionality in a live streaming; performing an first operation toward a second user terminal; storing data of the first operation in a database of the first user terminal; and displaying an effect corresponding to the first operation during the outage. The present disclosure may store the data of operation performed by the user terminal during outage and process the operation after the outage is recovered. Therefore, the streamers and viewers may feel interested and satisfied, instead of feeling anxious, and the user experience may be enhanced.
    Type: Application
    Filed: June 23, 2023
    Publication date: March 7, 2024
    Inventors: Yung-Chi HSU, Hsing-Yu TSAI, Chia-Han CHANG, Yi-Jou LEE, Ming-Che CHENG
  • Patent number: 11885689
    Abstract: The present invention discloses a wearable device with combined sensing capabilities, which includes a wearable assembly and at least one multi-function sensor module. The wearable assembly is suitable to be worn on apart of a user's body. The wearable assembly includes at least one light-transmissible window. The multi-function sensor module is located inside the wearable assembly, for performing an image sensing function and an infrared temperature sensing function. The multi-function sensor module includes an image sensor module for sensing a physical or a biological feature of an object through the light-transmissible window by way of image sensing; and an infrared temperature sensor module for sensing temperature through the light-transmissible window by way of infrared temperature sensing.
    Type: Grant
    Filed: October 11, 2020
    Date of Patent: January 30, 2024
    Assignee: PIXART IMAGING INCORPORATION
    Inventors: Chih-Ming Sun, Ming-Han Tsai
  • Publication number: 20230358412
    Abstract: There is provided an auto detection system including a thermal detection device and a host. The host controls an indication device to indicate a prompt message or detection results according to a slope variation of voltage values or 2D distribution of temperature values detected by the thermal detection device, wherein the voltage values include the detected voltage of a single pixel or the sum of detected voltages of multiple pixels of a thermal sensor.
    Type: Application
    Filed: July 20, 2023
    Publication date: November 9, 2023
    Inventors: CHIH-MING SUN, MING-HAN TSAI, CHIUNG-WEN LIN, PO-WEI YU, WEI-MING WANG, SEN-HUANG HUANG
  • Publication number: 20230321138
    Abstract: The present invention provides methods of preventing or treating coronavirus infection and reducing coronavirus infection rate in vitro with antiviral composition comprising poly(3,4-ethylenedioxythiophene):poly(styrene sulfonate) (PEDOT:PSS), wherein the PEDOT:PSS is selected from PEDOT:PSS aqueous solutions in various formulas. Specifically, the molar ratio of PEDOT to PSS in the PEDOT:PSS aqueous solution in the antiviral composition may be 1:1.5 to 1:6 and the resistivity of the PEDOT:PSS aqueous solution in the antiviral composition may be 100 ?/sq to 5×107 ?/sq. The antiviral composition is used to inhibit the binding between the spike protein of the coronavirus and the host cells with angiotensin-converting enzyme 2 (ACE2) on surface. The coronavirus may be SARS-CoV-2.
    Type: Application
    Filed: June 14, 2022
    Publication date: October 12, 2023
    Inventor: Ming-Han TSAI
  • Publication number: 20230314229
    Abstract: A wearable device includes a case and a temperature sensing device. The case has a first opening. The temperature sensing device is disposed inside the case of the wearable device. The temperature sensing device includes a first substrate, a sensor chip, and a metal shielding structure. The sensor chip is disposed on the first substrate. The metal shielding structure surrounds the sensor chip, and has a second opening. The sensor chip faces towards the first opening and the second opening.
    Type: Application
    Filed: June 7, 2023
    Publication date: October 5, 2023
    Inventors: CHIH-MING SUN, MING-HAN TSAI, CHENG-NAN TSAI
  • Patent number: 11754293
    Abstract: There is provided an auto detection system including a thermal detection device and a host. The host controls an indication device to indicate a prompt message or detection results according to a slope variation of voltage values or 2D distribution of temperature values detected by the thermal detection device, wherein the voltage values include the detected voltage of a single pixel or the sum of detected voltages of multiple pixels of a thermal sensor.
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: September 12, 2023
    Assignee: PIXART IMAGING INC.
    Inventors: Chih-Ming Sun, Ming-Han Tsai, Chiung-Wen Lin, Po-Wei Yu, Wei-Ming Wang, Sen-Huang Huang
  • Publication number: 20230273070
    Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.
    Type: Application
    Filed: May 4, 2023
    Publication date: August 31, 2023
    Inventors: MING-HAN TSAI, CHIH-MING SUN, JIAN-CHENG LIAO
  • Patent number: 11719579
    Abstract: A wearable device includes a case and a far infrared temperature sensing device. The case has a first opening. The far infrared temperature sensing device is disposed inside the case of the wearable device. The far infrared temperature sensing device includes an assembly structure, a sensor chip, a filter structure, and a metal shielding structure. The assembly structure has an accommodating space and a top opening. The sensor chip is disposed in the accommodating space of the assembly structure. The filter structure is disposed above the sensor chip. The metal shielding structure is disposed above the sensor chip, and has a second opening to expose the filter structure. The first and second openings are communicated to cooperatively define a through hole.
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: August 8, 2023
    Assignee: PIXART IMAGING INC.
    Inventors: Chih-Ming Sun, Ming-Han Tsai, Cheng-Nan Tsai
  • Publication number: 20230233632
    Abstract: The present disclosure pertains to the use of an immunomodulatory protein in preventing, inhibiting and/or reducing coronavirus (CoV) infections. The Ganoderma immunomodulatory protein, a recombinant thereof or a fragment thereof of the disclosure is able to induce ACE2 degradation via activating the protein degradation system.
    Type: Application
    Filed: August 22, 2022
    Publication date: July 27, 2023
    Inventors: Tung-Yi LIN, Ming-Han TSAI
  • Publication number: 20230225062
    Abstract: An electronic device including a first casing and a second casing is provided. The first casing includes a first plate portion, a first position-limiting structure and a second position-limiting structure. The first position-limiting structure and an inner surface of the first plate portion form a position-limiting groove. The second position-limiting structure is disposed on the inner surface of the first plate portion. The second casing includes a protruding structure. The protruding structure is inserted in the position-limiting groove, and the first position-limiting structure and the second position-limiting structure abut two opposite sides of the protruding structure.
    Type: Application
    Filed: December 12, 2022
    Publication date: July 13, 2023
    Applicant: Innolux Corporation
    Inventors: Ming-Han Tsai, Hsuan-Yin Wang
  • Patent number: 11686623
    Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: June 27, 2023
    Assignee: PIXART IMAGING INC.
    Inventors: Ming-Han Tsai, Chih-Ming Sun, Jian-Cheng Liao
  • Patent number: 11643325
    Abstract: A MEMS package including a fixed frame, a moveable platform and elastic restoring members is provided. The moveable platform is moved with respect to the fixed frame. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position.
    Type: Grant
    Filed: September 7, 2022
    Date of Patent: May 9, 2023
    Assignee: PIXART IMAGING INC.
    Inventors: Chih-Ming Sun, Ming-Han Tsai, Yu-Tao Lee
  • Publication number: 20230031112
    Abstract: There is provided a far infrared (FIR) sensor device including a substrate, a thermopile structure and a heat absorption layer. The thermopile structure is arranged on the substrate. The heat absorption layer covers upon the thermopile structure, wherein the heat absorption layer has a hollow space which is formed by etching a metal layer in the heat absorption layer.
    Type: Application
    Filed: May 9, 2022
    Publication date: February 2, 2023
    Inventors: Ming-Han TSAI, Chih-Fan HU
  • Publication number: 20230002214
    Abstract: A MEMS package including a fixed frame, a moveable platform and elastic restoring members is provided. The moveable platform is moved with respect to the fixed frame. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position.
    Type: Application
    Filed: September 7, 2022
    Publication date: January 5, 2023
    Inventors: CHIH-MING SUN, MING-HAN TSAI, YU-TAO LEE
  • Publication number: 20220400323
    Abstract: An electronic device includes: a housing, a first restraining holder, a second restraining holder and at least one protruding rib structure. The housing includes a first surface. The first restraining holder, the second restraining holder and at least part of the protruding rib structure are arranged on the first surface, and at least part of the protruding rib structure is disposed between the first restraining holder and the second restraining holder.
    Type: Application
    Filed: May 16, 2022
    Publication date: December 15, 2022
    Inventors: Hsuan-Yin WANG, Ming-Han TSAI, Chia-Hui CHEN