Patents by Inventor Ming Han Yu
Ming Han Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
METHOD AND SYSTEM OF IMAGE PROCESSING WITH POWER REDUCTION WHILE USING A UNIVERSAL SERIAL BUS CAMERA
Publication number: 20240069619Abstract: A method, system, and article provide image processing with power reduction while using universal serial bus cameras.Type: ApplicationFiled: August 29, 2022Publication date: February 29, 2024Applicant: Intel CorporationInventors: Ko Han Wu, Thiam Wah Loh, Kenneth K. Lau, Wen-Kuang Yu, Ming-Jiun Chang, Andy Yeh, Wei Chih Chen -
Patent number: 11746968Abstract: A miniature backlight kit includes a covering member, a light-shading element, a light guide element, a housing and a light-emitting unit. The light-emitting unit is disposed within a first concave structure of the light-shading element. The light-shading element is disposed within a second concave structure of the light guide element. The light guide element is covered by the lateral wall of the housing. The light-emitting unit emits a light beam. The light beam is reflected to the lateral wall of the housing by the light guide element. Consequently, a luminance gradient region is formed on the surface of the lateral wall of the housing.Type: GrantFiled: March 16, 2023Date of Patent: September 5, 2023Assignee: PRIMAX ELECTRONICS LTD.Inventors: Wei-Ping Chan, Ruey-Piin Wang, Chia-Ming Li, Yin-Liang Hu, Ming-Han Yu
-
Patent number: 10132571Abstract: A knockdown heat dissipation unit includes at least one combination body and multiple heat pipes. The combination body has two opposite connection sections. The heat pipes are respectively connected with the connection sections of the combination body to form a large area of thermal contact face. According to the structural design of the knockdown heat dissipation unit, the number of the heat pipes can be increased or reduced according to the heat dissipation requirement of a user. Also, the number of the heat pipes can be flexibly adjusted according to the size of a heat source to enhance the heat dissipation effect.Type: GrantFiled: October 6, 2015Date of Patent: November 20, 2018Assignee: ASIA VITAL COMPONENTS CO., LTD.Inventors: Ming-Han Yu, Chung-Hua Liao, Wen-Jui Chuang
-
Patent number: 9976813Abstract: A heat pipe fixing structure includes a heat pipe, a carrier body and a first fixing member. The heat pipe has a main body having a first side and a second side. The carrier body has a channel having an open side and a closed side. The heat pipe is disposed in the channel with the first and second sides respectively corresponding to the open side and the closed side. The first fixing member is disposed on upper side of the heat pipe and upper side of the carrier body. A free end of the first fixing member is in corresponding contact with the first side of the heat pipe to press and abut against or engage with the heat pipe. The heat pipe fixing structure serves to firmly fix the heat pipe to eliminate the shortcomings existing in the conventional welding process for fixing the heat pipe.Type: GrantFiled: March 17, 2015Date of Patent: May 22, 2018Assignee: ASIA VITAL COMPONENTS CO., LTD.Inventors: Ming-Han Yu, Jing-Ning Wu, Sheng-Pei Lee, Chun-Ming Wu
-
Patent number: 9897390Abstract: A fixing structure for heat dissipation element includes a base plate, a heat transfer element, and at least one fixing member. The base plate has a top surface, on which a receiving recess is defined for receiving the heat transfer element therein. At least one clearance is defined between the receiving recess and the heat transfer element. The fixing member has a fixing portion and an extended portion. The fixing portion is connected to the top surface of the base plate, whereas the extended portion is bent and inserted into the clearance to locate between the receiving recess and the heat transfer element, such that the heat transfer element is firmly held in the receiving recess of the base plate.Type: GrantFiled: March 17, 2015Date of Patent: February 20, 2018Assignee: Asia Vital Components Co., Ltd.Inventors: Ming-Han Yu, Jing-Ning Wu, Sheng-Pei Lee, Chun-Ming Wu
-
Publication number: 20170097195Abstract: A knockdown heat dissipation unit includes at least one combination body and multiple heat pipes. The combination body has two opposite connection sections. The heat pipes are respectively connected with the connection sections of the combination body to form a large area of thermal contact face. According to the structural design of the knockdown heat dissipation unit, the number of the heat pipes can be increased or reduced according to the heat dissipation requirement of a user. Also, the number of the heat pipes can be flexibly adjusted according to the size of a heat source to enhance the heat dissipation effect.Type: ApplicationFiled: October 6, 2015Publication date: April 6, 2017Inventors: Ming-Han Yu, Chung-Hua Liao, Wen-Jui Chuang
-
Publication number: 20160273844Abstract: A fixing structure for heat dissipation element includes a base plate, a heat transfer element, and at least one fixing member. The base plate has a top surface, on which a receiving recess is defined for receiving the heat transfer element therein. At least one clearance is defined between the receiving recess and the heat transfer element. The fixing member has a fixing portion and an extended portion. The fixing portion is connected to the top surface of the base plate, whereas the extended portion is bent and inserted into the clearance to locate between the receiving recess and the heat transfer element, such that the heat transfer element is firmly held in the receiving recess of the base plate.Type: ApplicationFiled: March 17, 2015Publication date: September 22, 2016Inventors: Ming-Han Yu, Jing-Ning Wu, Sheng-Pei Lee, Chun-Ming Wu
-
Publication number: 20160278238Abstract: A heat pipe fixing structure includes a heat pipe, a carrier body and a first fixing member. The heat pipe has a main body having a first side and a second side. The carrier body has a channel having an open side and a closed side. The heat pipe is disposed in the channel with the first and second sides respectively corresponding to the open side and the closed side. The first fixing member is disposed on upper side of the heat pipe and upper side of the carrier body. A free end of the first fixing member is in corresponding contact with the first side of the heat pipe to press and abut against or engage with the heat pipe. The heat pipe fixing structure serves to firmly fix the heat pipe to eliminate the shortcomings existing in the conventional welding process for fixing the heat pipe.Type: ApplicationFiled: March 17, 2015Publication date: September 22, 2016Inventors: Ming-Han Yu, Jing-Ning Wu, Sheng-Pei Lee, Chun-Ming Wu
-
Patent number: 9429369Abstract: A thermal module structure includes a base and at least one locating member. The base has at least one channel formed thereon and the channel has a closed bottom portion and an open top portion. At least one first coupling section is formed on the base at a position corresponding to the open top portion of the channel. The locating member is provided on one side with at least one second coupling section corresponding to the first coupling section, and is fitted above the channel with the second coupling section engaged with the first coupling section. Therefore, with the locating member, a heat pipe set in the channel can be quickly and firmly held to the base at upgraded efficiency and reduced time and labor cost.Type: GrantFiled: September 6, 2011Date of Patent: August 30, 2016Assignee: ASIA VITAL COMPONENTS CO., LTD.Inventors: Chun-Ming Wu, Ming-Han Yu
-
Publication number: 20150330715Abstract: A manufacturing method of thermal module includes steps of: providing a base seat and a heat pipe, the base seat having a first face and a second face; mechanically processing the base seat from the first face to the second face to form a receiving channel having a bottom section and a first side section and a second side section respectively vertically extending from two sides of the bottom section; placing the heat pipe into the receiving channel; mechanically processing the base seat and the heat pipe to hold the base seat and the heat pipe in a direction normal thereto; and horizontally mechanically processing the base seat and the heat pipe from outer sides to inner sides of the first and second side sections to form a recess on each of the first and second side sections, whereby a protrusion section is formed to press the heat pipe.Type: ApplicationFiled: May 14, 2014Publication date: November 19, 2015Applicant: ASIA VITAL COMPONENTS CO., LTD.Inventor: Ming-Han Yu
-
Publication number: 20140352925Abstract: A heat pipe structure includes a flat tubular body having a hollow section for contacting a heat source and at least one non-hollow section. A working fluid is contained in the hollow section and a capillary structure is disposed in the hollow section. The hollow section has a first outer side and a second outer side opposite to the first outer side. The non-hollow section is positioned on the first and second outer sides of the hollow section or a periphery thereof. The non-hollow section has a connection face for connecting with at least one retainer member.Type: ApplicationFiled: May 28, 2013Publication date: December 4, 2014Inventors: Ming-Han Yu, Chung-Hua Liao
-
Publication number: 20140165400Abstract: A heat-dissipation unit includes a base, at least one heat pipe, and a locating structure. The base has a first face, on which at least one channel is provided. A coupling section is formed on the first face at joints between the at least one channel and the first face. The heat pipe is set in the channel, and the locating structure is correspondingly fitted in the coupling section. In a method of manufacturing the heat-dissipation unit, the locating structure is molded between the at least one heat pipe and the base through a mechanical process, so that the at least one heat pipe is firmly held to the base in a highly efficient assembling manner with largely reduced time and labor to thereby enable reduced manufacturing cost.Type: ApplicationFiled: February 21, 2014Publication date: June 19, 2014Applicant: Asia Vital Components Co., Ltd.Inventors: Chun-Ming Wu, Ming-Han Yu
-
Publication number: 20130056179Abstract: A thermal module structure includes a base and at least one locating member. The base has at least one channel formed thereon and the channel has a closed bottom portion and an open top portion. At least one first coupling section is formed on the base at a position corresponding to the open top portion of the channel. The locating member is provided on one side with at least one second coupling section corresponding to the first coupling section, and is fitted above the channel with the second coupling section engaged with the first coupling section. Therefore, with the locating member, a heat pipe set in the channel can be quickly and firmly held to the base at upgraded efficiency and reduced time and labor cost.Type: ApplicationFiled: September 6, 2011Publication date: March 7, 2013Applicant: ASIA VITAL COMPONENTS CO., LTD.Inventors: Chun-Ming Wu, Ming-Han Yu
-
Publication number: 20130032313Abstract: A heat-dissipation unit includes a base, at least one heat pipe, and a locating structure. The base has a first face, on which at least one channel is provided. A coupling section is formed on the first face at joints between the at least one channel and the first face. The heat pipe is set in the channel, and the locating structure is correspondingly fitted in the coupling section. In a method of manufacturing the heat-dissipation unit, the locating structure is molded between the at least one heat pipe and the base through a mechanical process, so that the at least one heat pipe is firmly held to the base in a highly efficient assembling manner with largely reduced time and labor to thereby enable reduced manufacturing cost.Type: ApplicationFiled: August 5, 2011Publication date: February 7, 2013Inventors: Chun-Ming Wu, Ming-Han Yu
-
Patent number: 7852631Abstract: A heat sink assembly comprises a base consisting of an aluminum casting and a copper base plate, a heat sink consisting of heat fins, and at least a heat guide pipe; the heat guide pipe has a heat dissipation section passing through the heat fins; the aluminum casting has a hollow receiving space accommodating the copper base plate, and an elongated recess is disposed at the top sides of the copper base plate and the casting for placing the heat conduction part of the heat guide pipe; the copper base plate keeps contact the heat source and the heat transmits to the heat guide pipe and then is dissipated with the heat sink via the base rapidly. In addition, the weight of the heat sink assembly is decreased, and the manufacturing cost is reduced.Type: GrantFiled: December 2, 2008Date of Patent: December 14, 2010Assignee: Asia Vital Components Co., Ltd.Inventor: Ming Han Yu
-
Publication number: 20100134980Abstract: A heat sink assembly is characterized by comprising a base consisting of an aluminum casting and a copper base plate, a heat sink consisting of a plurality of aluminum heat fins, and at least a heat guide; wherein at least a groove is provided on each of the plurality of heat fins according to the quantity of said heat guide for passing the dissipation part of each said at least a heat guide, a cavity is opened on said aluminum casting for said copper base plate housing, and at least a trough is formed on the top surfaces of said copper base plate and said aluminum casting for placing the heat conduction part of each said at least a heat guide, and said copper base plate is placed against the heat source to transfer the heat through said base to said heat guide and then to said heat sink, so that the heat can be dissipated rapidly through said plurality of heat fins. In addition, the weight of the heat sink assembly is decreased, further more, the manufacturing costs reduced.Type: ApplicationFiled: December 2, 2008Publication date: June 3, 2010Inventor: Ming Han YU