Abstract: In an embodiment, a device includes: an integrated circuit die; a through via adjacent the integrated circuit die; a molding compound encapsulating the integrated circuit die and the through via; and a redistribution structure including: a first conductive via extending through a first dielectric layer, the first conductive via electrically connected to the integrated circuit die, the first dielectric layer being over the integrated circuit die, the through via, and the molding compound; and a first conductive line over the first dielectric layer and the first conductive via, the first conductive via extending into the first conductive line.

Abstract: A method for creating image and a device thereof are provided. The method includes the following steps. A first software content list of a plurality of electronic devices is loaded. An operating system (OS), a plurality of first drivers and a plurality of first software are downloaded according to the first software content list. The OS, the plurality of first drivers and the plurality of first software are compressed into first image. The first image is decompressed, the first image is executed on each of the plurality of electronic devices, and the OS, at least one of the plurality of first drivers, and at least one of the plurality of first software are installed.

Abstract: A method for creating image and a device thereof are provided. The method includes, loading a first software content list of a plurality of electronic devices; downloading an operating system (OS), a plurality of first drivers and a plurality of first software according to the first software content list; compressing the OS, the plurality of first drivers and the plurality of first software into first image. The method also includes, decompressing the first image, so as to execute the first image on each of the plurality of electronic devices, and install the OS, at least one of the plurality of first drivers, and at least one of the plurality of first software.