Patents by Inventor Ming Hao
Ming Hao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11923392Abstract: The present disclosure relates to an integrated chip. The integrated chip includes an image sensing element disposed within a substrate. A gate structure is disposed along a front-side of the substrate. A back-side of the substrate includes one or more first angled surfaces defining a central diffuser disposed over the image sensing element. The back-side of the substrate further includes second angled surfaces defining a plurality of peripheral diffusers laterally surrounding the central diffuser. The plurality of peripheral diffusers are a smaller size than the central diffuser.Type: GrantFiled: January 4, 2021Date of Patent: March 5, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Keng-Yu Chou, Chun-Hao Chuang, Jen-Cheng Liu, Kazuaki Hashimoto, Ming-En Chen, Shyh-Fann Ting, Shuang-Ji Tsai, Wei-Chieh Chiang
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Patent number: 11924162Abstract: A computing system is provided, including a processor and memory storing instructions that cause the processor to execute a domain name service (DNS) log analyzer configured to identify a container identifier associated with a DNS request and a destination IP address associated with a DNS response to the DNS request, using one or more DNS logs, a fleet management system record analyzer configured to identify a first service associated with the container identifier and a second service associated with the destination IP address, using one or more fleet management system logs, and a dependency map generator configured to generate a service-to-service dependency map between the identified first service and the identified second service.Type: GrantFiled: December 15, 2022Date of Patent: March 5, 2024Assignee: Microsoft Technology Licensing, LLCInventors: Abhishek Pathak, Sorabh Kumar Gandhi, Craig Henry Wittenberg, Ming Hao, Rohit Sanjay Galwankar, Vivek Sanjeev Tejwani
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Publication number: 20240071330Abstract: A display device includes a display panel. The display panel has a functional display area. The functional display area includes a plurality of display pixels and a plurality of light transmitting regions. The plurality of display pixels are around by the plurality of the light transmitting regions. A boundary between one of the plurality of display pixels and one of the plurality of light transmitting regions comprises an arc segment.Type: ApplicationFiled: November 3, 2023Publication date: February 29, 2024Applicant: Innolux CorporationInventors: Chia-Hao Tsai, Ming-Jou Tai, Yi-Shiuan Cherng, Yu-Shih Tsou, You-Cheng Lu, Yung-Hsun Wu
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Publication number: 20240071665Abstract: A wheel control mechanism includes a support base, a wheel module, a first magnetic module and a second magnetic module. The wheel module, the first magnetic module and the second magnetic module are installed on the support base. The first magnetic module generates a magnetic attractive force to attract a metal ratchet of the wheel module. By adjusting the position of the second magnetic module relative to the first magnetic module, the strength of the magnetic attractive force is changed. Consequently, the rotation of the wheel module results in a tactile feel or does not result in the tactile feel.Type: ApplicationFiled: September 14, 2022Publication date: February 29, 2024Inventors: Chun-Nan Su, Chun-Che Wu, Sheng-An Tsai, Ming-Hao Hsieh, Li-Kuei Cheng
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Publication number: 20240072021Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.Type: ApplicationFiled: October 26, 2023Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai, Ming-Shih Yeh, Ta-Wei Liu
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Publication number: 20240066236Abstract: The embodiments of the present disclosure provide booster mechanisms suitable for a liquid container. The booster mechanism may include a liquid storage assembly. A tail end of the liquid storage assembly may be provided with a strike space. The strike space may be provided with a movable assembly. The movable assembly may be capable of performing an axial movement along the strike space. The tail end of the movable assembly may be provided with a booster assembly and a deformation space. A front end of the booster assembly may be provided with a deformation trigger assembly. A deformation gap may be between the deformation space and the deformation trigger assembly.Type: ApplicationFiled: November 2, 2023Publication date: February 29, 2024Applicant: SUZHOU HEALTHY TREE MEDICAL TECHNOLOGY CO., LTD.Inventors: Changyan XIONG, Sixian HE, Linchuan YI, Ming HAO, Xingwu LI, Kai WANG
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Patent number: 11916084Abstract: A transparent display panel with driving electrode regions, circuit wiring regions, and optically transparent regions is provided. The driving electrode regions are arranged into an array in a first direction and a second direction. An average light transmittance of the circuit wiring regions is less than ten percent, and an average light transmittance of the optically transparent regions is greater than that of the driving electrode regions and the circuit wiring regions. The first direction intersects the second direction. The circuit wiring regions connect the driving electrode regions at intervals, such that each optically transparent region spans among part of the driving electrode regions. The transparent display panel includes first signal lines and second signal lines extending along the circuit wiring regions, and each circuit wiring region is provided with at least one of the first signal lines and at least one of the second signal lines.Type: GrantFiled: August 24, 2022Date of Patent: February 27, 2024Assignee: AUO CorporationInventors: Chun-Yu Lin, Kun-Cheng Tien, Jia-Long Wu, Ming-Lung Chen, Shu-Hao Huang
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Patent number: 11914794Abstract: A keyboard comprising a top case and a bottom case comprised of a transparent material and including: a plurality of recesses each configured to receive one of a plurality of light emitting diodes (LED); a plurality of cavities that extend linearly and radially from a middle portion of the bottom case toward an outer edge of the keyboard, where light emitted by the LEDs is directed radially towards and out of the outer edge of the keyboard, due in part to the emission pattern of the corresponding LED and by adjacent cavities of the plurality of cavities; and a plurality of screw bosses configured to receive screws that securedly couple the top case to the bottom case, wherein the bottom case is coupled to the top case forming an outer housing for the keyboard.Type: GrantFiled: September 29, 2022Date of Patent: February 27, 2024Assignee: Logitech Europe S.A.Inventors: Anthony Vuillemin, Ming-Hsiang Weng, Feng-Hao Lin, Sebastien Gadelle
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Patent number: 11910535Abstract: A printed circuit board stack structure includes a first printed circuit board, a second printed circuit board, and a filling glue layer. The first printed circuit board has at least one overflow groove, and includes first pads and a retaining wall surrounding the first pads. The second printed circuit board is disposed on the first printed circuit board, and includes second pads and conductive pillars located on some of the second pads. The conductive pillars are respectively connected to some of the first pads to electrically connect the second printed circuit board to the first printed circuit board. The filling glue layer fills between the first and the second printed circuit boards, and covers the first pads, the second pads, and the conductive pillars. The retaining wall blocks the filling glue layer so that a portion of the filling glue layer is accommodated in the overflow groove.Type: GrantFiled: March 3, 2022Date of Patent: February 20, 2024Assignee: Unimicron Technology Corp.Inventors: Ming-Hao Wu, Shih-Lian Cheng
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Publication number: 20230413430Abstract: The present disclosure provides a printed circuit board and a method thereof. The printed circuit board has a first substrate, at least one first trace layer and at least one second trace layer. The first substrate has a first surface and a second surface. The first surface and the second surface are corresponding to each other along an axis. The first trace layer is formed on the first surface and/or the second surface of the first substrate. The first trace layer has at least one first trace and at least one first gap beside the first trace by etching. The second trace layer is formed on the first trace layer. The second trace layer has at least one second trace and at least one second gap beside the second trace by etching.Type: ApplicationFiled: August 3, 2022Publication date: December 21, 2023Inventors: Po-Hsiang Wang, Ming-Hao Wu
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Publication number: 20230390455Abstract: The invention relates to a method for manufacturing a calcified tissue substitute, the method comprising: reacting ground nacre, monocalcium phosphate, and water to produce brushite; grinding the brushite; reacting ground nacre with the ground brushite in disodium hydrogenphosphate solution. The invention also relates to a calcified tissue substitute manufactured by the method, use of the calcified tissue substitute for repairing a calcified tissue, and a delivery device for delivering the calcified tissue.Type: ApplicationFiled: August 23, 2023Publication date: December 7, 2023Inventors: Rui Ruan, Ming-Hao Zheng
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Patent number: 11797108Abstract: A mouse device includes a roller module. The roller module includes a base member, a scroll wheel, a magnetic conductor, a swingable arm, a driving motor and an actuating element. The scroll wheel is installed on the base member. The magnetic conductor is located beside the scroll wheel. When the scroll wheel is rotated, the magnetic conductor is correspondingly rotated. The swingable arm is installed on the base member. The swingable arm includes a magnetic element. The swingable arm is swingable relative to the magnetic conductor. When the swingable arm is swung to a first position, the magnetic element is aligned with the magnetic conductor. Consequently, a magnetic attraction force between the magnetic element and the magnetic conductor is generated. When the swingable arm is swung to a second position, the magnetic attraction force between the magnetic element and the magnetic conductor is eliminated.Type: GrantFiled: February 2, 2023Date of Patent: October 24, 2023Assignee: PRIMAX ELECTRONICS LTD.Inventors: Chun-Nan Su, Chun-Che Wu, Shu-An Huang, Chun-Lin Chu, Ming-Hao Hsieh, Sheng-An Tsai, Li-Kuei Cheng
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Patent number: 11788569Abstract: An anti-pullout and low-resistance screw includes a shank, a screw-in portion, a head portion, and a thread. The thread is helically formed around both the screw-in portion and the shank and includes a plurality of thread convolutions. Each thread convolution includes an upper tooth surface facing the head portion and a lower tooth surface facing the screw-in portion. At least one tapered pressing structure is designed on the screw-in portion and/or the shank to define at least one section with its outer diameter tapering towards the screw-in portion gradually. The tapered pressing structure extends from a bottom edge of the lower tooth surface along a longitudinal axis of the shank. The lower tooth surface has a lower tooth surface height that is greater than the thread height. An annular anti-pullout plane is formed on the shank between two adjacent thread convolutions to enhance the anti-pullout strength of the screw.Type: GrantFiled: December 2, 2020Date of Patent: October 17, 2023Inventors: Kuo-Tai Hsu, Ming-Hao Hsu
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Patent number: 11771800Abstract: The invention relates to a method for manufacturing a calcified tissue substitute, the method comprising: reacting ground nacre, monocalcium phosphate, and water to produce brushite; grinding the brushite; reacting ground nacre with the ground brushite in disodium hydrogenphosphate solution. The invention also relates to a calcified tissue substitute manufactured by the method, use of the calcified tissue substitute for repairing a calcified tissue, and a delivery device for delivering the calcified tissue.Type: GrantFiled: June 1, 2018Date of Patent: October 3, 2023Assignee: Marine Biomedical Pty LtdInventors: Rui Ruan, Ming-Hao Zheng
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Publication number: 20230262890Abstract: A circuit board structure includes a substrate, a first build-up structure layer, first and second external circuit layers, at least one first conductive via, and second conductive vias. The first build-up structure layer is disposed on a first circuit layer of the substrate. The first external circuit layer is disposed on the first build-up structure layer. The second external circuit layer is disposed on a second circuit layer and a portion of a third dielectric layer of the substrate. The first conductive via is electrically connected to the first external circuit layer and the second external circuit layer to define a signal path. The second conductive vias surround the first conductive via, and the first external circuit layer, the second conductive vias, the first circuit layer, the outer conductive layer, and the second external circuit layer define a first ground path. The first ground path surrounds the signal path.Type: ApplicationFiled: September 7, 2022Publication date: August 17, 2023Applicant: Unimicron Technology Corp.Inventors: Chih-Chiang Lu, Chi-Min Chang, Ming-Hao Wu, Yi-Pin Lin, Tung-Chang Lin, Jun-Rui Huang
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Publication number: 20230262880Abstract: Provided is a circuit board structure including a substrate, a loop-wrapping ground layer, an insulating structure, a first build-up layer, a top wiring layer, a bottom wiring layer, a first conductive via, and a plurality of second conductive vias. The aforementioned structure defines a signal transmitting structure. An equivalent circuit of the signal transmitting structure at least includes a first equivalent circuit, a second equivalent circuit, a third equivalent circuit and a fourth equivalent circuit, which correspond to different uniform transmitting sections respectively. The first equivalent circuit, the second equivalent circuit, the third equivalent circuit and the fourth equivalent circuit are connected in series with each other according to an ABCD transmission matrix series connection principle.Type: ApplicationFiled: February 1, 2023Publication date: August 17, 2023Applicant: Unimicron Technology Corp.Inventors: Chih-Chiang Lu, Jun-Rui Huang, Ming-Hao Wu, Tung-Chang Lin
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Publication number: 20230262893Abstract: A circuit board, including a first dielectric material, a second dielectric material, a third dielectric material, a fourth dielectric material, a first external circuit layer, a second external circuit layer, a conductive structure, a first conductive via, and multiple second conductive vias, is provided. The first conductive via at least passes through the first dielectric material and the fourth dielectric material, and is electrically connected to the first external circuit layer and the second external circuit layer to define a signal path. The second conductive vias pass through the first dielectric material, the second dielectric material, the third dielectric material, and a part of the conductive structure, and surround the first conductive via. The second conductive vias are electrically connected to the first external circuit layer, the conductive structure, and the second external circuit layer to define a ground path, and the ground path surrounds the signal path.Type: ApplicationFiled: August 23, 2022Publication date: August 17, 2023Applicant: Unimicron Technology Corp.Inventors: Chih-Chiang Lu, Jun-Rui Huang, Ming-Hao Wu, Yi-Pin Lin, Tung-Chang Lin
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Patent number: 11728109Abstract: A key structure includes a casing, a covering member, a pressing element, a triggering post, a switch element. The casing has an opening. The opening is covered by the covering member. The pressing element is disposed within the opening and connected with the covering member. The pressing element includes a middle part and an extension part. The triggering post is installed on the middle part of the pressing element. The triggering post is extended in the direction toward the inner position of the casing. When an external force is applied to the middle part of the pressing element, the triggering post is moved toward the switch element to push the switch element. When the external force is applied to the extension part of the pressing element, the triggering post is correspondingly moved with the pressing element in an inclined manner to push the switch element.Type: GrantFiled: June 28, 2022Date of Patent: August 15, 2023Assignee: PRIMAX ELECTRONICS LTDInventors: Yung-Tai Pan, Chun-Che Wu, Ming-Hao Hsieh, Sheng-An Tsai
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Publication number: 20230240014Abstract: A printed circuit board stack structure includes a first printed circuit board, a second printed circuit board, and a filling glue layer. The first printed circuit board has at least one overflow groove, and includes first pads and a retaining wall surrounding the first pads. The second printed circuit board is disposed on the first printed circuit board, and includes second pads and conductive pillars located on some of the second pads. The conductive pillars are respectively connected to some of the first pads to electrically connect the second printed circuit board to the first printed circuit board. The filling glue layer fills between the first and the second printed circuit boards, and covers the first pads, the second pads, and the conductive pillars. The retaining wall blocks the filling glue layer so that a portion of the filling glue layer is accommodated in the overflow groove.Type: ApplicationFiled: March 3, 2022Publication date: July 27, 2023Applicant: Unimicron Technology Corp.Inventors: Ming-Hao Wu, Shih-Lian Cheng
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Publication number: 20230216499Abstract: A control wheel includes a casing, a wheel ring, a first magnetic element, a pivotal shaft and a second magnetic element. The casing includes an accommodation structure and a concave structure. The accommodation structure includes a base. The wheel ring is disposed within the accommodation structure. The wheel ring is exposed outside through the accommodation structure and the concave structure. The pivotal shaft is disposed within the wheel ring and connected with the base of the accommodation structure. The wheel ring is rotatable relative to the pivotal shaft. The first magnetic element is disposed within the wheel ring. The second magnetic element is disposed within the base of the accommodation structure. The first magnetic element of the wheel ring and the second magnetic element are magnetically attracted by each other. Consequently, a rotating speed of the wheel ring is decreased.Type: ApplicationFiled: July 5, 2022Publication date: July 6, 2023Inventors: Chun-Che Wu, Ming-Hao Hsieh, Sheng-An Tsai