Patents by Inventor Ming-His Yeh

Ming-His Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130330906
    Abstract: A method of fabricating a semiconductor IC is disclosed. The method includes receiving a device. The device includes a semiconductor substrate, a plurality of fins and trenches between fins in the semiconductor substrate. The method also includes filling the trenches with a dielectric material to form shallow trench isolations (STI), applying a low-thermal-budget annealing to the dielectric material, and applying a wet-treatment to the dielectric material.
    Type: Application
    Filed: June 7, 2012
    Publication date: December 12, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Weibo Yu, Ming-His Yeh, Chih-Tang Peng, Hao-Ming Lien, Chao-Cheng Chen, Syun-Ming Jang