Abstract: Provided is a pharmaceutical composition including an active pharmaceutical ingredient, a toll-like receptor (TLR) agonist, a stimulator of interferon genes (STING) agonist, and a pharmaceutically acceptable carrier. Also provided are a method for inducing immune response and a method for treating or preventing cancer or an infectious disease, including administering an effective amount of the pharmaceutical composition to a subject in need thereof.

Abstract: A micro-electromechanical system microstructure includes: a substrate adapted to support an electrode thereon; a suspension mechanism supported on the substrate; and a movable active part adapted to cooperate with the electrode to define a capacitor therebetween, and suspended on the substrate through the suspension mechanism so as to be movable to and fro relative to the substrate and the electrode. The suspension mechanism includes at least one supporting frame that protrudes from and that cooperates with an outer surface of the substrate to define a frame space therebetween, and at least one cantilever beam interconnecting the supporting frame and the active part.

Abstract: The present invention discloses a thermal module with heat reservoir, which is arranged with respect to a chip, and the thermal module comprises: a housing, disposed at a appropriate position corresponding to the chip and made of a material of high heat conductivity; a phase change material, disposed within the housing, capable of changing from a first state to a second state by absorbing heat and changing from the second state to the first state by releasing the heat stored therein; wherein the thermal module can be either mounted on the chip at an appropriate location or disposed at a location separated from the chip by an appropriate distance, in addition, the phase change process of the phase change material changing between the first state and the second state can be either a physical process or a chemical process.

Abstract: A method for determining the thermal resistance constant of a modular heat sink. The method can be carried out by first providing a heat capacity tank formed of a high thermal conductivity metal. A modular heat sink is then mounted on top of the heat capacity tank and heated together with the tank to a temperature of at least 40° C. The heating is then stopped and the heat sink/heat capacity tank is allowed to cool for at least 30 seconds before the temperature and the cooling time of the heat capacity tank is monitored and recorded. The function of dT/dt is then calculated. The amount of heat dissipated is then calculated from the equation of Q=W·Cp·(dT/dt), while the thermal resistance constant is calculated by the equation of R=(T−Tamb)/Q.