Abstract: A smart pole assembly for a telecommunication network, a cabinet for enclosing computing equipment, and a method for installing computing equipment in a cabinet are disclosed. The smart pole assembly includes a cabinet and a case movably coupled to the cabinet and configured for receiving computing equipment. The case is movable between a first position and a second position. The first position is a service position in which the case is at least in part external to the cabinet, and the second position is a working position in which the case is within the cabinet in a rotated orientation relative to the first position. A method for installing computing equipment in a cabinet includes inserting computing equipment into the case that is in the first position and moving the case to the second position such that the case and computing equipment are in the rotated orientation within the cabinet.

Abstract: Pole mounts, pole mount kits, and poly mount assemblies are disclosed. Each kit and assembly includes a pole mount with a mounting bracket including a pair of coupling plates and at least one retaining plate. The pair of coupling plates is coupled to opposite ends of the at least one retaining plate. The at least one retaining plate defines a mounting area between the pair of coupling plates. The pole mount further includes at least two retaining brackets coupled to the at least one retaining plate. Each of the retaining brackets includes a base, opposing side walls extending from the base, and a front wall extending from the base and located between the opposing side walls. The base, the opposing side walls, and the front wall define a retaining area. The front wall defines a cutout region contiguous with the retaining area.

Abstract: Semiconductor devices and methods of manufacture are provided wherein a metallization layer is located over a substrate, and a power grid line is located within the metallization layer. A signal pad is located within the metallization layer and the signal pad is surrounded by the power grid line. A signal external connection is electrically connected to the signal pad.

Abstract: Pole mounts, pole mount kits, and poly mount assemblies are disclosed. Each kit and assembly includes a pole mount with a mounting bracket including a pair of coupling plates and at least one retaining plate. The pair of coupling plates is coupled to opposite ends of the at least one retaining plate. The at least one retaining plate defines a mounting area between the pair of coupling plates. The pole mount further includes at least two retaining brackets coupled to the at least one retaining plate. Each of the retaining brackets includes a base, opposing side walls extending from the base, and a front wall extending from the base and located between the opposing side walls. The base, the opposing side walls, and the front wall define a retaining area. The front wall defines a cutout region contiguous with the retaining area.

Abstract: A device includes standard cells in a layout of an integrated circuit. The standard cells include a first standard cell and a second standard cell disposed next to each other. The first standard cell is configured to operate as an electrostatic discharge (ESD) protection circuit and includes a first gate and a second gate. The first gate includes a first gate finger and a second gate finger that are arranged over a first active region, for forming a first transistor and a second transistor, respectively. The second gate is separate from the first gate. The second gate includes a third gate finger and a fourth gate finger that are arranged over a second active region, for forming a third transistor and a fourth transistor, respectively. The first transistor and the second transistor are connected in parallel, and the third transistor and the fourth transistor are connected in parallel.

Abstract: Semiconductor devices and methods of manufacture are provided wherein a metallization layer is located over a substrate, and a power grid line is located within the metallization layer. A signal pad is located within the metallization layer and the signal pad is surrounded by the power grid line. A signal external connection is electrically connected to the signal pad.

Abstract: An assistance mechanism includes a base, a rotatable link, a lifting unit and a power unit which provides power to the lifting unit so that the lifting unit drives the rotatable link. A seat is connected to the rotatable link so that when the rotatable link is activated, the user sitting on the seat is transformed from a sit status into a stand status. This effectively assists the user who does not have sufficient muscle forces to stand up by the assistance mechanism.

Abstract: An assistance mechanism includes a base, a rotatable link, a lifting unit and a power unit which provides power to the lifting unit so that the lifting unit drives the rotatable link. A seat is connected to the rotatable link so that when the rotatable link is activated, the user sitting on the seat is transformed from a sit status into a stand status. This effectively assists the user who does not have sufficient muscle forces to stand up by the assistance mechanism.