Abstract: A method of using a non-volatile memory that utilizes a charge-trapping layer for data storage is described. A refresh step is performed, after the non-volatile memory is subject to multiple write/erase cycles causing hard-to-erase electrons in the charge-trapping layer, to eliminate the hard-to-erase electrons. After the refresh step, the non-volatile memory is used again.

Abstract: A chalcogenide memory cell includes a lower electrode, a chalcogenide layer, and an upper electrode. The lower electrode includes a tapered cavity. The chalcogenide layer is formed in the tapered cavity of the lower electrode. One side of the chalcogenide layer is adjacent to the lower electrode. The upper electrode is formed in a second cavity formed by the chalcogenide layer so that the upper electrode substantially fills the second cavity. The upper electrode is adjacent to the other side of the chalcogenide layer. Information is stored and retrieved by passing current between the upper electrode and the lower electrode. The tapered cavity of the lower electrode is formed through anisotropic etching or through sidewall-application. Undesired currents are prevented using an additional dielectric layer or by using an additional conductive layer that forms a p-n junction with the lower electrode.

Abstract: A non-volatile memory is described. The non-volatile memory includes a first source/drain region, a second source/drain region, a charge-trapping layer and a gate layer. The first source/drain region is disposed beside the top sidewall of a trench in a substrate. The second source/drain region is disposed in the substrate at the bottom of the trench. The gate layer is disposed in the trench and on the substrate. The charge-trapping layer is disposed between the gate layer and the substrate. A plurality of assisted charges is stored in one of the sides of the charge-trapping layer.

Abstract: A method for manufacturing a non-volatile memory. The method comprises steps of forming a first dielectric layer on a substrate and forming a dummy gate layer on the first dielectric layer. Further, the dummy gate layer is defined to form a plurality of dummy gates and a doped region is formed in the substrate by using the dummy gates as a mask. A second dielectric layer is formed on a portion of the first dielectric layer corresponding to the location of the doped region and the dummy gates are removed to expose a portion of the first dielectric layer. A conductive layer is formed over the substrate to cover the second dielectric layer and the first dielectric layer.

Abstract: A method of using a non-volatile memory that utilizes a charge-trapping layer for data storage is described. A refresh step is performed, after the non-volatile memory is subject to multiple write/erase cycles causing hard-to-erase electrons in the charge-trapping layer, to eliminate the hard-to-erase electrons. After the refresh step, the non-volatile memory is used again.

Abstract: A chalcogenide random access memory (CRAM) is provided. The CRAM includes a substrate, a first dielectric layer, a bottom electrode, a top electrode, a second dielectric layer, a modified chalcogenide spacer and an un-modified chalcogenide thin film. The first dielectric layer is disposed on the substrate and the bottom electrode is located inside the first dielectric layer. The second dielectric layer is disposed on the first dielectric layer and it has at least one opening exposing the bottom electrode. The modified chalcogenide spacer is disposed on the sidewall of the opening exposing portion of the bottom electrode. The top electrode is disposed on the bottom electrode. The un-modified chalcogenide thin film is disposed between the modified chalcogenide spacer and the top electrode and also disposed between the bottom electrode and the top electrode. The modified chalcogenide spacer has a better etching resistivity than the un-modified chalcogenide thin film.

Abstract: A method of fabricating a chalcogenide random access memory (CRAM) is provided. The method is to provide a substrate having a bottom electrode thereon and then form a chalcogenide film and a patterned mask corresponding to the bottom electrode sequentially over the substrate. Thereafter, using the patterned mask, an ion implantation is performed to convert a portion of the chalcogenide film into a modified region while the chalcogenide film underneath the patterned mask is prevented from receiving any dopants and hence is kept as a non-modified region. The modified region has a lower conductivity than the non-modified region. After that, the patterned mask is removed and then a top electrode is formed over the non-modified region. Utilizing the ion implantation as a modifying treatment, the contact area between the chalcogenide film and the bottom electrode is decreased and the operating current of the CRAM is reduced.