Abstract: A pressure regulating device cooperates with a semiconductor production system to regulate a pressure in a pipe of a semiconductor production apparatus in the semiconductor production system. The pressure regulating device reduces the pressure in the pipe of the semiconductor apparatus by a suction pump to prevent from liquid leakage when the pipe is broken. In addition, the pressure regulating device can periodically record the pressure change in the pipe to facilitate an operator to judge whether the pipe is damaged and analyze the cause of decrease in production yield.

Abstract: A pressure regulating device cooperates with a semiconductor production system to regulate a pressure in a pipe of a semiconductor production apparatus in the semiconductor production system. The pressure regulating device reduces the pressure in the pipe of the semiconductor apparatus by a suction pump to prevent from liquid leakage when the pipe is broken. In addition, the pressure regulating device can periodically record the pressure change in the pipe to facilitate an operator to judge whether the pipe is damaged and analyze the cause of decrease in production yield.

Abstract: A carbon dioxide gas treatment system comprises: ammonia gas production device for providing ammonia gas; a waste gas treatment device, having a first washing column, a gas inlet, a first circulation water inlet, a first circulation water outlet, a first outlet and a second outlet, the carbon dioxide gas from the gas inlet may mix with ammonia gas to form a mixed gas before get into the first washing column and the mixed gas may mix with water from circulation water inlet in the first washing column to form solid ammonium bicarbonate and liquid ammonia; and a waste water treatment device, having a second washing column, a water inlet, a second circulation water inlet, a second circulation water outlet and a third outlet, the liquid ammonia get into the second washing column through the water inlet and mixed with water from second circulation water inlet to form ammonia gas.

Abstract: A wastewater treatment device includes a showering-guided furnace, which comprises a tank, a cyclic heating device and a showering structure. The tank has a water inlet port, a cyclic water inlet port, a cyclic water outlet port, a water outlet port and a gas outlet port. The cyclic heating device is used to draw out the wastewater from the tank, heat the drawn wastewater to a cyclic temperature, and guide the heated wastewater into the tank through the cyclic water inlet port. The showering structure is used to make the wastewater to be formed into a plurality of smaller water flows which are showered. A specific composition of the wastewater is gasified and is drawn out from the tank through the gas outlet port. The above-mentioned wastewater treatment device can save much energy and achieve higher recovery efficiency.

Abstract: A method for manufacturing a magnetic write head that allows the location of the flare point of a write pole to be accurately located relative to the air bearing surface. The method includes the construction of a lapping guide having an edge feature that is easily and accurately located relative to the flare point of the write pole. This edge feature provides an abrupt change in electrical resistance across the lapping guide at a point when lapping should be terminated. And, since this feature can accurately located relative to the flare point, this provides an easily discernable ending point for lapping.

Abstract: A method for manufacturing a magnetic head for magnetic data recording, that allows a lapping termination point to be easily and accurately determined during lapping. The method includes constructing a lapping guide that has an electrically is formed to provide an abrupt change in resistance at a point where lapping should be terminated. This point of abrupt resistance change is located relative to the flare point of the write pole that the distance between the flare point and the air bearing surface can be accurately maintained. This abrupt resistance change also makes it possible to monitor both a stripe height defining rough lapping and an angled kiss lapping process using a single measurement channel.

Abstract: A magnetic write head for perpendicular magnetic recording that is resistant to write pole and trailing shield protrusion. The write pole includes a magnetic return pole that is magnetically connected with the trailing shield, the return pole being resistant to deformation or recession such as from mechanically abrasive slider cleaning operations such as soda blast.

Abstract: A method for manufacturing a magnetic head for magnetic data recording, that allows a lapping termination point to be easily and accurately determined during lapping. The method includes constructing a lapping guide that has an electrically is formed to provide an abrupt change in resistance at a point where lapping should be terminated. This point of abrupt resistance change is located relative to the flare point of the write pole that the distance between the flare point and the air bearing surface can be accurately maintained. This abrupt resistance change also makes it possible to monitor both a stripe height defining rough lapping and an angled kiss lapping process using a single measurement channel.

Abstract: A method for manufacturing a magnetic write head that allows the location of the flare point of a write pole to be accurately located relative to the air bearing surface. The method includes the construction of a lapping guide having an edge feature that is easily and accurately located relative to the flare point of the write pole. This edge feature provides an abrupt change in electrical resistance across the lapping guide at a point when lapping should be terminated. And, since this feature can accurately located relative to the flare point, this provides an easily discernable ending point for lapping.

Abstract: A structure and method for performing magnetic inductance testing of write heads formed on a wafer. The structure and method allows for the effective inductive testing of magnetic write heads at wafer level even if the write heads have an inductance that is too low to be effectively measured directly. A test head is constructed having a structure similar to that of the write heads, but having a significantly higher magnetic inductance. The higher magnetic inductance of the write head can be provided by extending the shaping layer to or beyond the air bearing surface plane ABS. The inductance of the test head can be further increased by increasing the width of the portion of the shaping layer that extends to the ABS (ie. shaping layer throat) and by increasing the width of the write pole throat.

Abstract: A structure and method for performing magnetic inductance testing of write heads formed on a wafer. The structure and method allows for the effective inductive testing of magnetic write heads at wafer level even if the write heads have an inductance that is too low to be effectively measured directly. A test head is constructed having a structure similar to that of the write heads, but having a significantly higher magnetic inductance. The higher magnetic inductance of the write head can be provided by extending the shaping layer to or beyond the air bearing surface plane ABS. The inductance of the test head can be further increased by increasing the width of the portion of the shaping layer that extends to the ABS (ie. shaping layer throat) and by increasing the width of the write pole throat.

Abstract: A magnetic write head for perpendicular magnetic recording that is resistant to write pole and trailing shield protrusion. The write pole includes a magnetic return pole that is magnetically connected with the trailing shield, the return pole being resistant to deformation or recession such as from mechanically abrasive slider cleaning operations such as soda blast.

Abstract: A disk drive thin-film write head has a first ferromagnetic pole tip that includes a pedestal pole layer and a capping layer on the pedestal pole layer. A substantial portion of the pedestal pole layer is formed of a lower-moment alloy and the capping layer is formed of a higher-moment alloy and is made thick enough to compensate for the lower-moment alloy in the pedestal pole layer. The pedestal pole layer may be a bilayer of two different NiFe alloys with the upper layer in the bilayer having a higher moment, and the capping layer may be a CoFe alloy. The width of the pedestal pole layer is substantially reduced to reduce the pole tip area exposed. The reduced pole tip area and the increased use of lower-moment alloys enable a thinner protective film to be used to protect the pole tips from corrosion.

Abstract: A magnetic write head for use in a data recording system having first and second magnetic pole, the first pole having a P1 pedestal. An electrically conductive coil passes through a space between the first and second poles for inducing a magnetic flux through the yoke formed by the first and second poles. A bi-layer insulation layer disposed between the poles includes a layer of photoresist for preventing voids and a layer of alumina formed thereover to provide a structural brace to prevent recession of the P1 pedestal during manufacturing operations such as soda blast.

Abstract: During fabrication of a write head via holes are first opened in a gap layer, followed by formation of seed layers instead of the other way around. Moreover a first seed layer is formed, and without the first seed layer being used a second seed layer is formed. The second seed layer (which is the topmost layer) is used in plating to form coils (e.g. of copper) for the write head. After coil formation, the first seed layer is used for plating to form vias (e.g. of NiFe). The two seed layers may be formed in a single operation by using two different targets in a vacuum deposition chamber. Moreover, a single insulation layer is sufficient to insulate and protect all plated elements, regardless of whether they are formed by use of the first seed layer or the second seed layer.

Abstract: The present invention discloses a method for driving a full-color LED display board with high resolution. It features three original color LED pixels that are arranged in a diamond pattern to form LED array, and an interlacing scan circuit is used to control the LED array. As a result, the display of a new pixel can be inserted between two contiguous pixels and the resolution of the full-color LED display board increases.

Abstract: The specification discloses a highly heat dissipative chip module along with its substrate. The chip module contains a highly heat dissipative substrate with several chips installed thereon. The highly heat dissipative substrate is prepared by forming an insulating layer on the surface of a metal compound plate. A copper wired layer is installed on the insulating layer. The copper wired layer can be used to adhere to the chip. The material of the substrate is preferably an aluminum compound material with a high thermal conduction coefficient. It has the advantages of having a light weight and reducing thermal deformations. The insulating layer is also formed using a material with good thermal conductivity, particularly metal oxides with thermal conduction coefficients higher than resins or fibers. The chip can thus homogeneously distribute heat to the whole printed circuit board, dissipating heat into the ambient space.

Abstract: A display media real-time rebroadcasting network system and its rebroadcasting method in which a plurality of displays are connected to a broadcast center through a communication network, and virtual display players connected between the broadcast center and the displays to drive the displays to broadcast program tapes or scene live individually and/or to rebroadcast same programs and same scene live.

Abstract: The present invention discloses a method for driving a full-color LED display board with high resolution. It features three original color LED pixels that are arranged in a diamond pattern to form LED array, and an interlacing scan circuit is used to control the LED array. As a result, the display of a new pixel can be inserted between two contiguous pixels and the resolution of the full-color LED display board increases.

Abstract: A Light Emitting Diode Display Module with high heat-dispersion and the substrate thereof; the Light Emitting Diode Display Module comprises a substrate having high heat-dispersion and a plurality of light emitting diode settled on the substrate; forming an insulating layer on the surface of a metal plate, next to settle the copper circuit layer on the insulating layer, the copper circuit layer could be used on the surface mount light emitting display device, the insulating layer is also a material with fine heat conductivity, especially a metal oxide which conductivity coefficient higher than resin or cellulose, thus the display module will diffuse the produced heat onto the whole circuit board and the heat could be dispersed into the air.