Abstract: A lighting device includes a light board and a light dimmer circuit. The light board includes multiple first light emitting elements and second light emitting elements. The first light emitting elements are disposed in a first area of the light board. The second light emitting elements are disposed in a second area of the light board. The light dimmer circuit is configured to drive the second light emitting elements to generate flickering lights from the second area of the light board, and is configured to drive the first light emitting elements to generate non-flickering lights from the first area of the light board.

Abstract: A video decoding method includes: before residual decoding of a coding unit is completed, referring to available information to determine whether to decode information that an inverse transform (IT) circuit needs for applying inverse transform to transform blocks of the coding unit, and generating a determination result; and controlling coefficient transmission of the coding unit to the IT circuit according to the determination result.

Abstract: A semiconductor device includes a substrate, a dielectric layer disposed over the substrate, and an interconnect structure extending through the dielectric layer. The dielectric layer includes a low-k dielectric material which includes silicon carbonitride having a carbon content ranging from about 30 atomic % to about 45 atomic %. The semiconductor device further includes a thermal dissipation feature extending through the dielectric layer and disposed to be spaced apart from the interconnect structure.

Abstract: A semiconductor package comprises a substrate, a grounding layer, a encapsulant, a shielding layer, and a conductive element. The substrate includes a chip. The encapsulant encapsulates the grounding layer and the chip, wherein the encapsulant has an upper surface. The shielding layer is formed on the upper surface of the encapsulant. The conductive element surrounds a waveguide cavity and extends to the grounding layer. The grounding layer, the shielding layer and the conductive element together form a waveguide antenna.

Abstract: A printed circuit board (PCB) includes a top outer layer, a bottom outer layer, a signal transmission layer, an inner signal transmission layer, and a via system defined in the PCB. The via system includes two pairs of vias configured to transmit signals from a transmitter to a receiver. A signal transmission pathway is defined in the top outer layer, the signal transmission layer, and the inner signal transmission layer. Signals are sent from the transmitter to a first pair of vias, the signals are transmitted from the first pair of vias to a second pair of vias, and the signals are sent from the second pair of vias to the receiver. The two pairs of vias and the signal transmission pathway provide impedance matching to the signals.

Abstract: A printed circuit board (PCB) includes a top outer layer, a bottom outer layer, a signal transmission layer, an inner signal transmission layer, and a via system defined in the PCB. The via system includes two pairs of vias configured to transmit signals from a transmitter to a receiver. A signal transmission pathway is defined in the top outer layer, the signal transmission layer, and the inner signal transmission layer. Signals are sent from the transmitter to a first pair of vias, the signals are transmitted from the first pair of vias to a second pair of vias, and the signals are sent from the second pair of vias to the receiver. The two pairs of vias and the signal transmission pathway provide impedance matching to the signals.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a substrate, a semiconductor chip, a package body and an antenna layer. The semiconductor chip is disposed on the substrate. The package body encapsulates the semiconductor chip and includes an upper surface. The antenna layer is formed on the upper surface of the package body and includes two antenna slot groups connected together. Each antenna slot group includes a wave guiding slot extending along a first direction, and an irradiation slot group extending along a second direction, wherein the irradiation slot group is connected to the wave guiding slot.

Abstract: A game apparatus for allowing players to turnover building blocks, including block and flat for overturn, which are characterized in that: the building block is consisted of two to eight cubes, including at least eight corners and twelve ridges; the ridges are designed with balls outside and every balls has the same diameter outside; the flat has the same distance with the hole, which is a dimple, and the distance between two holes equals to the side length of cube ball; thus balls of the building block can function with hole and makes building block stands on the flat after the ball is inserted into the hole; the building block can work with any two balls as rotate axis to rotate 90 degrees of front, back right and left side on the flat; through many times of overturn, the building block can go from beginning place to the end and reach the effect of fun competition and brain exercise.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a substrate, a semiconductor chip, a package body and an antenna layer. The semiconductor chip is disposed on the substrate. The package body encapsulates the semiconductor chip and includes an upper surface. The antenna layer is formed on the upper surface of the package body and includes two antenna slot groups connected together. Each antenna slot group includes a wave guiding slot extending along a first direction, and an irradiation slot group extending along a second direction, wherein the irradiation slot group is connected to the wave guiding slot.

Abstract: A semiconductor package comprises a substrate, a grounding layer, a encapsulant, a shielding layer, and a conductive element. The substrate includes a chip. The encapsulant encapsulates the grounding layer and the chip, wherein the encapsulant has an upper surface. The shielding layer is formed on the upper surface of the encapsulant. The conductive element surrounds a waveguide cavity and extends to the grounding layer. The grounding layer, the shielding layer and the conductive element together form a waveguide antenna.

Abstract: Present invention provides an intellectual game model which includes a base with several grooves, level selector and 7 chain hexagonal bricks. There are 8 hexagon docks with numbers, and player is capable of selecting the level of difficulty of the game by moving level selector. There is also a hexagonal stud which is for increasing the difficulty of the game. Player uses 7 chain hexagonal bricks with different shapes to complete the shape which is built by empty grooves. The game inspires player's intelligence and is suitable for beginner or the one who want to challenge difficult levels of the game.

Abstract: Present invention provides an intellectual game model which includes a base with several grooves, level selector and 7 chain hexagonal bricks. There are 8 hexagon docks with numbers, and player is capable of selecting the level of difficulty of the game by moving level selector. There is also a hexagonal stud which is for increasing the difficulty of the game. Player uses 7 chain hexagonal bricks with different shapes to complete the shape which is built by empty grooves. The game inspires player's intelligence and is suitable for beginner or the one who want to challenge difficult levels of the game.

Abstract: A toy block set comprises a total 12 toy blocks, each block is consisted of at least one block unit and each unit joins another angledly by a 60 degree. The set includes 8 toy blocks formed by 5 block units and 4 toy blocks formed by 4 block units, a total 56 block units. Each block unit is a polyhedron with 50 faces arranged in 7 layers for improving the stability when assembling the shape formed by the toy blocks. Said 12 toy blocks can form a triangular pyramid of height of 6 units and 7 of said 12 toy blocks can form another triangular pyramid of height of 5 units.

Abstract: A set of overturn building block cube, including building block and flat for overturn, which is characterized in that: Said building block is consisted of two to eight cubes, including at least eight corners and twelve ridges; said ridges is designed with balls outside and every balls has the same diameter outside; said flat has the same distance with said hole, which is a dimple, and the distance between two holes equals to the side length of cube ball; thus balls of the building block can function with hole and makes building block stands on the flat after the ball is inserted into the hole; said building block can work with any two balls as rotate axis to rotate 90 degrees of front, back, right and left side on the flat; through many times of overturn, the building block can go from beginning place to the end and reach the effect of fun competition and brain exercise.

Abstract: A toy block set comprises a total 12 toy blocks, each block is consisted of at least one block unit and each unit joins another angledly by a 60 degree. The set includes 8 toy blocks formed by 5 block units and 4 toy blocks formed by 4 block units, a total 56 block units. Each block unit is a polyhedron with 50 faces arranged in 7 layers for improving the stability when assembling the shape formed by the toy blocks. Said 12 toy blocks can form a triangular pyramid of height of 6 units and 7 of said 12 toy blocks can form another triangular pyramid of height of 5 units.

Abstract: A toy block assembly puzzle, which is arranged diagonally, ideal for advanced users, comprises: a game tray (20) and plurality of assembly pieces (10) which will be arranged in a concave recess (21) of said game tray (20), characterized in that: said concave recess (21) of said game tray (20) including 50 concave slots (22), arranged in 11 rows; each odd row (row 1, 3, 5, 7, 9, 11) having 5 slots and each even row (row 2, 4, 6, 8, 10) having 4 slots; all slots (22) of said odd and even row are staggered arranged, forming 10 diagonal rows, each having an angle of 45 degree enclosed by said diagonal row and a border of said game tray (20); said assembly pieces (10) comprise 11 building blocks (1A˜1K), each having a different shape and formed by 3˜5 adjacent units; a total sum of units of said 11 building blocks (1A˜1K) are 50 units; said building blocks (1A˜1K) are placed diagonally with an oblique angle of 45 degree, into said 50 concave slots (22), which are provided on the game tray (20).

Abstract: A building plate assembly (10) formed by 216 units (U) comprises of 3 building plates (A, B, G) consisting of 16 units (U); 6 building plates (D, E, H, J, K, L) consisting of 18 units (U) and 3 building plates (C, F, I) consisting of 20 units (U), which the sum of all 12 building plates (A to L) is 216. Each of the building plates (A to L) has four rounded corners and is based on a rectangular region (R), having 3 units (U) for row and 6 units (U) for a column, a total of 18 adjacent units (U). Six predetermined zones (P1 to P6) are defined on the rectangular region (R) for forming concave or convex structures (11, 12), thus each of the building plates is in a different shape (A to L) by such configuration. By assembling the building plates (A to L) on different types of game tray (20), the game device provides different intellectual levels for players of all ages.