Patents by Inventor Ming-Hsien Chiang

Ming-Hsien Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11942433
    Abstract: In an embodiment, a structure includes: a first integrated circuit die including first die connectors; a first dielectric layer on the first die connectors; first conductive vias extending through the first dielectric layer, the first conductive vias connected to a first subset of the first die connectors; a second integrated circuit die bonded to a second subset of the first die connectors with first reflowable connectors; a first encapsulant surrounding the second integrated circuit die and the first conductive vias, the first encapsulant and the first integrated circuit die being laterally coterminous; second conductive vias adjacent the first integrated circuit die; a second encapsulant surrounding the second conductive vias, the first encapsulant, and the first integrated circuit die; and a first redistribution structure including first redistribution lines, the first redistribution lines connected to the first conductive vias and the second conductive vias.
    Type: Grant
    Filed: January 17, 2022
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Jen-Fu Liu, Ming Hung Tseng, Tsung-Hsien Chiang, Yen-Liang Lin, Tzu-Sung Huang
  • Patent number: 11935871
    Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang, Ming-Hung Tseng, Kris Lipu Chuang, Chung-Ming Weng, Tsung-Yuan Yu, Tzuan-Horng Liu
  • Patent number: 10139396
    Abstract: A method of noninvasively detecting plant pathogenic virus and an electronic apparatus thereof are provided. The method is adapted to the electronic apparatus for detecting pathogenic virus in plants. The method includes the following steps. An excitation light beam is projected to the plant, and a reaction light emitted by the plant in response to the excitation light is received. An analytic optical spectrum corresponding to the reaction light is obtained, and whether the plant has the pathogenic virus or not is determined according to the analytic optical spectrum.
    Type: Grant
    Filed: April 12, 2016
    Date of Patent: November 27, 2018
    Assignee: NATIONAL TAIWAN NORMAL UNIVERSITY
    Inventors: Jen-Jie Chieh, Yen-Hsiang Wang, Shien-Kuei Liaw, Wen-Chun Wei, Ming-Hsien Chiang
  • Publication number: 20160298161
    Abstract: A method of noninvasively detecting plant pathogenic virus and an electronic apparatus thereof are provided. The method is adapted to the electronic apparatus for detecting pathogenic virus in plants. The method includes the following steps. An excitation light beam is projected to the plant, and a reaction light emitted by the plant in response to the excitation light is received. An analytic optical spectrum corresponding to the reaction light is obtained, and whether the plant has the pathogenic virus or not is determined according to the analytic optical spectrum.
    Type: Application
    Filed: April 12, 2016
    Publication date: October 13, 2016
    Inventors: Jen-Jie Chieh, Yen-Hsiang Wang, Shien-Kuei Liaw, Wen-Chun Wei, Ming-Hsien Chiang