Patents by Inventor Ming-Hsien Liu

Ming-Hsien Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250242484
    Abstract: A tool box assembly has at least one tool box, and each tool box has a container, at least one first assembling structure, at least one second assembling structure, and at least one drawer. The container of each tool box has a base and a surrounding wall erectly disposed at the base. Each second assembling structure is configured to engage with each first assembling structure. The at least one drawer of each tool box is disposed within the container of the tool box and is able to enter or exit from the container via a front opening of the container.
    Type: Application
    Filed: January 31, 2024
    Publication date: July 31, 2025
    Inventor: Ming-Hsien Liu
  • Patent number: 11067623
    Abstract: A test system includes a plurality of test core devices and a plurality of first buses. The plurality of test core devices are electrically connected to a device under test (DUT). The plurality of first buses are electrically connected to the test core devices, where at least one set of test core devices selected from the plurality of test core devices are merged to be a merged test core device through one or more of the plurality of first buses.
    Type: Grant
    Filed: May 19, 2019
    Date of Patent: July 20, 2021
    Assignee: Test Research, Inc.
    Inventors: Ming-Hsien Liu, Hsin-Wei Huang
  • Publication number: 20200363465
    Abstract: A test system includes a plurality of test core devices and a plurality of first buses. The plurality of test core devices are electrically connected to a device under test (DUT). The plurality of first buses are electrically connected to the test core devices, where at least one set of test core devices selected from the plurality of test core devices are merged to be a merged test core device through one or more of the plurality of first buses.
    Type: Application
    Filed: May 19, 2019
    Publication date: November 19, 2020
    Inventors: Ming-Hsien LIU, Hsin-Wei HUANG
  • Patent number: 10814471
    Abstract: A tool box has a box body and a handle. The box body has a mounting portion mounted at the box body. The mounting portion has an upper positioning recess and a lower positioning recess. The handle has a holding portion, a connecting portion, and a marking portion. The holding portion is an elongated board and is engaged with the lower positioning recess, a cross section of the holding portion being U-shaped with an opening facing upward. The connecting portion is formed at an inner end of the holding portion and is an upright board. The marking portion is formed at a top portion of the connecting portion and is an elongated board and is engaged with the upper positioning recess, a cross section of the marking portion being U-shaped with an opening facing downward.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: October 27, 2020
    Inventor: Ming-Hsien Liu
  • Publication number: 20200086476
    Abstract: A positioning pad has a pad body and a coat layer. The pad body is made of a foaming material, is formed as a board, and has at least one tool recess defined in a top of the pad body. The coat layer is attached to the top of the pad body and has at least one window and a 3D (three dimensional) embossing pattern. The at least one window is defined through the coat layer and corresponds respectively to the at least one tool recess in the pad body in position and shape. The 3D embossing pattern is formed on a top of the coat layer and has multiple embossing units. Each embossing unit has an outer frame and a decorating surface enclosed by the outer frame.
    Type: Application
    Filed: September 18, 2018
    Publication date: March 19, 2020
    Inventor: Ming-Hsien Liu
  • Publication number: 20200078929
    Abstract: A stackable toolbox has a body and an engaging block rotatably mounted on the body. The body has corresponding engaging grooves of two first recesses and engaging ribs of two first protrusions in positions away from the engaging block. When two toolboxes are stacked up with each other, the engaging ribs of the first protrusions of one of the toolboxes are mounted in and engaged with the engaging grooves of the first recesses of the other toolbox, and the engaging block is turned to engage with the engaging bumps of the toolboxes. Multiple stackable toolboxes may be stacked and be lifted together.
    Type: Application
    Filed: September 6, 2018
    Publication date: March 12, 2020
    Inventor: Ming-Hsien Liu
  • Patent number: 8843357
    Abstract: An electrical connection defect simulation test method is provided. The electrical connection state simulation test method includes the steps as follows. A device under test is provided, wherein the device under test includes a plurality of pin groups each having a plurality of signal pins. A zero-frequency signal is transmitted from a signal-feeding device to each of the signal pins to simulate an open condition. An open test is performed on each of the signal pins. The signal pins of the device under test are connected to a relay matrix. The relay matrix is controlled to make any two of the signal pins in one of the pin groups electrically connected to simulate a short condition. A short test is performed on any two of the electrically connected signal pins. An electrical connection state simulation test system is disclosed herein as well.
    Type: Grant
    Filed: March 3, 2011
    Date of Patent: September 23, 2014
    Assignee: TEST Research, Inc.
    Inventors: Su-Wei Tsai, Ming-Hsien Liu
  • Publication number: 20120173214
    Abstract: An electrical connection defect simulation test method is provided. The electrical connection state simulation test method includes the steps as follows. A device under test is provided, wherein the device under test includes a plurality of pin groups each having a plurality of signal pins. A zero-frequency signal is transmitted from a signal-feeding device to each of the signal pins to simulate an open condition. An open test is performed on each of the signal pins. The signal pins of the device under test are connected to a relay matrix. The relay matrix is controlled to make any two of the signal pins in one of the pin groups electrically connected to simulate a short condition. A short test is performed on any two of the electrically connected signal pins. An electrical connection state simulation test system is disclosed herein as well.
    Type: Application
    Filed: March 3, 2011
    Publication date: July 5, 2012
    Applicant: Test Research, Inc.
    Inventors: Su-Wei Tsai, Ming-Hsien Liu
  • Patent number: D856621
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: August 13, 2019
    Inventor: Ming-Hsien Liu
  • Patent number: D928630
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: August 24, 2021
    Assignee: ERSSON CO. LTD.
    Inventor: Ming-Hsien Liu