Patents by Inventor Ming-Hsien Lu

Ming-Hsien Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Host computer system and heat dissipation apparatus and separation mechanism thereof
    Patent number: 10499539
    Abstract: A heat dissipation apparatus, adaptable to at least one first circuit device and at least one second circuit device, includes a chassis; and at least one separation mechanism disposed in the chassis, the first circuit device and the second circuit device being respectively disposed at two sides of the separation mechanism, the first circuit device being not aligned with the second circuit device, and the separation mechanism including a separation board.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: December 3, 2019
    Assignee: Wiwynn Corporation
    Inventors: Ming-Hsien Lu, Chien-An Chen, Pin-Jen Chen
  • HOST COMPUTER SYSTEM AND HEAT DISSIPATION APPARATUS AND SEPARATION MECHANISM THEREOF
    Publication number: 20190289746
    Abstract: A heat dissipation apparatus, adaptable to at least one first circuit device and at least one second circuit device, includes a chassis; and at least one separation mechanism disposed in the chassis, the first circuit device and the second circuit device being respectively disposed at two sides of the separation mechanism, the first circuit device being not aligned with the second circuit device, and the separation mechanism including a separation board.
    Type: Application
    Filed: August 24, 2018
    Publication date: September 19, 2019
    Inventors: MIng-Hsien Lu, Chien-An Chen, Pin-Jen Chen
  • Method for determining chemical mechanical polishing time
    Patent number: 6743075
    Abstract: The present invention relates to a method for determining rapidly and accurately the polishing time of a chemical mechanical polishing process for polishing target wafers to avoid any problems of under-polishing or over-polishing. An aspect of the present invention is directed to a method for determining a chemical mechanical polishing time for removing a target polishing thickness H from an uneven surface of a target wafer. The method comprises polishing a control wafer by a chemical mechanical polishing to obtain a progressive relationship of polishing thickness and respective polishing time therefor. A first polishing time T1 is determined for removing a first thickness H1 from the target wafer, in which the first thickness H1 with substantially the uneven surface removed is smaller than the target polishing thickness H of the target wafer to be removed.
    Type: Grant
    Filed: January 15, 2003
    Date of Patent: June 1, 2004
    Assignee: Mosel Vitelic, Inc.
    Inventors: Chun-Te Lin, Shan-An Liu, Chung-Ru Wu, Ming-Hsien Lu
  • Method for determining chemical mechanical polishing time
    Publication number: 20030186621
    Abstract: The present invention relates to a method for determining rapidly and accurately the polishing time of a chemical mechanical polishing process for polishing target wafers to avoid any problems of under-polishing or over-polishing. An aspect of the present invention is directed to a method for determining a chemical mechanical polishing time for removing a target polishing thickness H from an uneven surface of a target wafer. The method comprises polishing a control wafer by a chemical mechanical polishing to obtain a progressive relationship of polishing thickness and respective polishing time therefor. A first polishing time T1 is determined for removing a first thickness H1 from the target wafer, in which the first thickness H1 with substantially the uneven surface removed is smaller than the target polishing thickness H of the target wafer to be removed.
    Type: Application
    Filed: January 15, 2003
    Publication date: October 2, 2003
    Applicant: MOSEL VITELIC, INC., A Taiwanese Corporation
    Inventors: Chun-Te Lin, Shan-An Liu, Chung-Ru Wu, Ming-Hsien Lu