Abstract: A display device includes a first substrate, a light-emitting element, a light conversion layer, and a color filter layer. The light-emitting element is disposed on the first substrate. The light conversion layer is disposed on the light-emitting element. In addition, the color filter layer is overlapped the light-emitting element and the light conversion layer.

Abstract: A semiconductor device includes a first region and a second region, and the second region surrounds the first region. The semiconductor device includes at least one electronic unit, a redistribution structure, a plurality of first pads, and a plurality of second pads. The redistribution structure may be electrically connected to at least one electronic unit. A plurality of first pads are arranged on the redistribution structure and correspondingly to the first region. There is a first pitch between two adjacent first pads. A plurality of second pads are arranged on the redistribution structure and correspondingly to the second region. There is a second pitch between two adjacent second pads, so that the first pitch is smaller than the second pitch.

Abstract: A lighting device includes a light board and a light dimmer circuit. The light board includes multiple first light emitting elements and second light emitting elements. The first light emitting elements are disposed in a first area of the light board. The second light emitting elements are disposed in a second area of the light board. The light dimmer circuit is configured to drive the second light emitting elements to generate flickering lights from the second area of the light board, and is configured to drive the first light emitting elements to generate non-flickering lights from the first area of the light board.

Abstract: A gear module includes a rotating cylinder, a first planetary gear set, a second planetary gear set, a concave-convex structure, and a limit bearing set. The first planetary gear set is accommodated in the rotating cylinder and includes a driven gear; the second planetary gear set includes a positioning frame, second planetary gears pivoted to a positioning frame, a driven gear engaged with the second planetary gears, and the positioning frame has a through hole; the concave-convex structure includes a convex column extended from the rotating cylinder and a concave hole formed on the positioning frame, the convex column is plugged into the concave hole; the limit bearing set includes a first ball bearing sheathing the driven gear and mounted between the driven gear and the through hole, and a second ball bearing sheathing the convex column and mounted between the convex column and the concave hole.

Abstract: Some embodiments of the present disclosure relate to an integrated chip including an extended via that spans a combined height of a wire and a via and that has a smaller footprint than the wire. The extended via may replace a wire and an adjoining via at locations where the sizing and the spacing of the wire are reaching lower limits. Because the extended via has a smaller footprint than the wire, replacing the wire and the adjoining via with the extended via relaxes spacing and allows the size of the pixel to be further reduced. The extended via finds application for capacitor arrays used for pixel circuits.

Abstract: A method for dynamically detecting applications is provided, the method including the following steps: opening a smart device, and executing a testing program to enter a program of detecting applications, wherein the testing program is installed to a bottom layer of the operating system; in the program of detecting applications, executing all functions of an application under test; recording execution results of the all functions of the application under test; analyzing, from the execution results recorded, which functions the application under test executes, where and how many times which data is transmitted and execution data of which text files and folders is established; and displaying which functions the application under test executes, where and how many times which data is transmitted and execution data of which text files and folders is established. The present invention further includes a smart device and a computer program product implementing the method.

Abstract: Disclosed is a method for statically detecting applications, the method including: intercepting, by an acquisition device of the detection system, at least one module file header byte code, at least one module program code and a permission file in an application to be detected which have been complied and encrypted; disassembling and deciphering, by a disassembler and decipher of the detection system, the at least one module file header byte code, the at least one module program code and the permission file which have been complied and encrypted; analyzing, by a verifier of the detection system, the permission file, the at least one module program code and the at least one module file header byte code disassembled and deciphered, to judge whether to perform improper operations on the smart device; and generating, by the verifier, a detection report according to a result of judging whether to perform improper operations on the smart device.

Abstract: An electronic device housing internally defines a receiving space for accommodating a circuit board and electronic elements mounted on the circuit board, and has a thermal insulation layer provided on an inner surface thereof at a position corresponding to the circuit board. The thermal insulation layer provided on the inner surface of the electronic device housing not only suppresses and prevents flames produced by, for example, the spontaneous combustion of the electronic elements in the housing from spreading to and endangering the environment surrounding the electronic device, but also enables reduced product weight and manufacturing cost of the electronic device.

Abstract: An integrated circuit socket having a contact pad is disclosed. The integrated circuit socket comprises the following components. (1) A base unit, consisting of a base, contact pins and an elastomer. The contact pins will provide the electrical contact of the other elements, the elastomer provides the compactness of the assembly. (2) An interposer, comprising flexible film, a stiffener and a stop layer wherein the contact pad of the flexible film may contact with the solder ball of IC device to buffer the pressure formed by a tight contact when IC device is moving downward. The pressure will be dispersed with the flexible film such that the testing signals are transmitted. (3) An adapter unit, capable of positioning the integrated circuit device and includes a depressor to suppress or release the integrated circuit.

Abstract: A replaceable and modularized integrated circuit's socket. The modularized socket comprises: (1) a base unit, it further consists of a base, contact pins and an elastomer. The contact pin will provide the electrical connection of the other elements, the elastomer provides the compactness of the assembly. (2) an interposer, there are positioning holes, contact pads and conducting wires in this interposer. (3) an adapter unit, the unit is capable of positioning the integrated circuit device and includes a depressor to suppress or release the integrated circuit. (4) a cover unit, the cover unit is coupled to said adapter and is capable of moving up and down vertically and drive the depressor to press or release the integrated circuit device. The modularized socket can fit the integrated circuit devices with different sizes and pin assignment, also much easier to repair.

Abstract: An integrated circuit socket having a contact pad is disclosed. The integrated circuit socket comprises: (1) a base unit, it further consists of a base, contact pins and an elastomer. The contact pins will provide the electrical contact of the other elements, the elastomer provides the compactness of the assembly. (2) an interposer, there are a flexible film, a stiffener and a stop layer wherein the contact pad of the flexible film may contact with the solder ball of IC device to buffer the pressure formed by a tight contact when IC device is moving downward. The pressure will be dispersed with the flexible film such that the testing signals are transmitted. (3) an adapter unit, the unit is capable of positioning the integrated circuit device and includes a depressor to suppress or release the integrated circuit.