Abstract: Provided is a pharmaceutical composition including an active pharmaceutical ingredient, a toll-like receptor (TLR) agonist, a stimulator of interferon genes (STING) agonist, and a pharmaceutically acceptable carrier. Also provided are a method for inducing immune response and a method for treating or preventing cancer or an infectious disease, including administering an effective amount of the pharmaceutical composition to a subject in need thereof.

Abstract: In an embodiment, a structure includes: a first integrated circuit die including first die connectors; a first dielectric layer on the first die connectors; first conductive vias extending through the first dielectric layer, the first conductive vias connected to a first subset of the first die connectors; a second integrated circuit die bonded to a second subset of the first die connectors with first reflowable connectors; a first encapsulant surrounding the second integrated circuit die and the first conductive vias, the first encapsulant and the first integrated circuit die being laterally coterminous; second conductive vias adjacent the first integrated circuit die; a second encapsulant surrounding the second conductive vias, the first encapsulant, and the first integrated circuit die; and a first redistribution structure including first redistribution lines, the first redistribution lines connected to the first conductive vias and the second conductive vias.

Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.

Abstract: A management system is applicable to an electronic apparatus. The management system includes at least one first transceiving module, a comparing module and a processing module. The first transceiving module is configured for receiving first input data inputted from a corresponding first input/output interface, and for outputting second input data according to the first input data. The comparing module is configured for receiving the second input data, for comparing the second input data with a plurality of first mapping data in a database, for converting the second input data to third input data according to a first comparison result, and for outputting the third input data. The processing module is configured for receiving the third input data, and for converting the third input data to fourth input data such that the electronic apparatus performs corresponding operations according to the fourth input data. A management method is disclosed herein as well.

Abstract: A method for discovering a network device is disclosed for executing a discovery procedure of the network device in a Data Link Layer (i.e. Layer 2 of OSI 7 Layers Model) via a Network Management Server (NMS) within a Local Area Network (LAN) system to discover other network devices within the LAN. Firstly, sending a discovery packet from a Network Management Server (NMS), wherein the discovery packet comprises a command for requesting the network device to send back a corresponding Media Access Control (MAC) address. Then, receiving the discovery packet by at least one of the network device, and generating a response packet corresponding to the discovery packet for sending the response packet, wherein the response packet comprises the Media Access Control (MAC) address of the network device.

Abstract: A method for discovering a network device is disclosed for executing a discovery procedure of the network device in a Data Link Layer (i.e. Layer 2 of OSI 7 Layers Model) via a Network Management Server (NMS) within a Local Area Network (LAN) system to discover other network devices within the LAN. Firstly, sending a discovery packet from a Network Management Server (NMS), wherein the discovery packet comprises a command for requesting the network device to send back a corresponding Media Access Control (MAC) address. Then, receiving the discovery packet by at least one of the network device, and generating a response packet corresponding to the discovery packet for sending the response packet, wherein the response packet comprises the Media Access Control (MAC) address of the network device.