Abstract: The invention provides a method for manufacturing a thin film substrate. The method comprises steps of: providing a substrate having at least one through hole; forming a first metallic layer on a surface of the substrate and the through holes; forming a resist layer and a first opening on the first metallic layer; forming a second metallic layer in the first opening and the through hole; removing the resist layer and a part of the first metallic layer to form a circuit layer and a plurality of grooves; forming a solder mask layer on the circuit layer and in the groove, and forming a second opening on the solder mask layer to expose a part of the circuit layer; and polishing the surface of the exposed circuit layer and the solder mask layer.

Abstract: A pipe connection device has a C-shaped ring, an O-shaped ring, at least a first annular collar to receive the C-shaped ring, and at least a second annular collar to receive the O-shaped ring. The first annular collar has a tapering portion and at least an insertion hole.