Abstract: An optical path folding element includes a main body, a light absorption film layer and a matte structure. The main body has optical surface including an incident surface, a reflective surface and an emitting surface. A light enters into the optical folding element through the incident surface. The reflective surface reflects the light so as to change a traveling direction thereof. The light exits the optical folding element through the emitting surface. The light absorbing film layer is configured to reduce reflectance and provided adjacent to at least part of the optical surface, and the light absorbing film layer is in physical contact with the main body. The matte structure is disposed adjacent to at least part of the optical surface. The matte structure provides an undulating profile on a surface of the optical path folding element, and the matte structure is formed in one-piece with the main body.

Abstract: The present invention relates to a method for preparing a modified stem cell, including the following steps: a cell culture step: culturing stem cells in a first culture medium of a culture dish at a predetermined cell density, and removing the first culture medium after a first culture time to obtain a first cell intermediate; an activity stimulation step: preserving the first cell intermediate in a freezing container having a cell cryopreservation solution, and performing a constant temperature stimulation treatment or a variable temperature stimulation treatment for at least more than 1 day; and a product collection step: after completing the activity stimulation step, placing the freezing container in an environment at a thawing temperature for thawing, and then removing the cell cryopreservation solution to obtain the modified stem cell. The modified stem cell can release at least one or more of IL-4, IL-5, IL-13, G-CSF, Fractalkine, and EGF.

Abstract: A keyboard and a key structure capable of displaying instant image thereof are provided. The key structure includes a display unit, a circuit membrane, an elastic member, a key seat, a first supporting frame, a second supporting frame, and a translucent keycap. The first supporting frame has two first arms and two axle portions. The ends of the first arms are slidably disposed on an accommodation portion of the key seat. The second supporting frame has two second arms and two linking holes. The ends of the second arms are pivotally connected to the accommodation portion. The linking hole is elongated-shaped. When the translucent keycap is not pressed, the axle portion abuts against one hole-end of the linking hole. When the translucent keycap is pressed, the axle portion abuts against another one hole-end of the linking hole.

Abstract: The present invention provides a display panel, including a backplane having flexibility, a first fixing member, a front frame having flexibility, and a display module provided between the backplane and the front frame. The backplane has a base plate with a first side. The first fixing member extends corresponding to the first side and has a first predetermined curvature. The first fixing member at least has a first wall body standing upright relative to the base plate, and the first fixing member is relatively fixed to the backplane, so that the curvature of the backplane can be adjusted corresponding to the first fixing member. The front frame is provided in a manner that extends correspondingly to the periphery of the backplane, and is relatively fixed to the backplane, so that the curvature of the front frame is relatively adapted to that of the backplane.

Abstract: An all-in-one SATA interface storage device comprising: an interface board installed on a motherboard; a first memory card slot which is a CFast slot fixed on the interface board for installation of a CFast card; a second memory card slot fixed on the interface board and available to CF-SATA and CFEX cards for installation of either a CF-SATA card or a CFEX card. As such, the present invention facilitates applications of multiple storage devices via its SATA interfaces linking a host system, providing a user more convenient new storage devices, and creating higher value-added services by lowering costs.

Abstract: An all-in-one SATA interface storage device comprising: an interface board installed on a motherboard; a first memory card slot which is a CFast slot fixed on the interface board for installation of a CFast card; a second memory card slot fixed on the interface board and available to CF-SATA and CFEX cards for installation of either a CF-SATA card or a CFEX card. As such, the present invention facilitates applications of multiple storage devices via its SATA interfaces linking a host system, providing a user more convenient new storage devices, and creating higher value-added services by lowering costs.

Abstract: A computer-on-Module debug card assembly and a control system thereof comprising: a carrier module with a carrier board and electronic components thereon wherein the carrier board is provided with a plurality of I/O connectors and at least a bus; a debug module electrically connected to the carrier board and comprising a debug card and electronic components thereon wherein the debug card is equipped with a detecting component, at least a bus, and a plurality of switch buttons used to check switching; a COM express system electrically connected to the debug card and comprising a COM express board and electronic components thereon wherein the COM express board is provided with modular components and at least a bus. As such, it is able to identify messages for a CPU-bearing COM express board and a carrier board in the COM express system during debugging, streamlining the procedure and saving time.

Abstract: A removable expansion interface device comprising: a motherboard; a system slot which is installed on and electrically connected to the motherboard and develops an accommodation space; a carrier which is a printed circuit board held in the accommodation space and electrically connected to the system slot; an expansion slot installed on and electrically connected to the carrier and develops a plug-in space. As such, the present invention relies on removable design to match an interface device to be used and realize lowered costs and spatial and economic efficiency. Furthermore, the present invention is based on a motherboard without extra cost and has significant advantages such as applications of new storage devices, expansion of other functions, time and cost efficiency, lowered complexity, and industrial applicability.

Abstract: A high-security card slot module which is installed on a motherboard and comprises a CFEX slot and a CFEX card: the CFEX card is provided with a networking chip in which network enabling parameters are saved. As such, a user is able to successfully access a network with the CFEX card inserted in the motherboard for upgraded security protection; moreover, the CFEX card is further provided with a flash memory in which BIOS for booting as secondary backup BIOS is saved for the motherboard with redundant functions.

Abstract: A computer-on-Module debug card assembly and a control system thereof comprising: a carrier module with a carrier board and electronic components thereon wherein the carrier board is provided with a plurality of I/O connectors and at least a bus; a debug module electrically connected to the carrier board and comprising a debug card and electronic components thereon wherein the debug card is equipped with a detecting component, at least a bus, and a plurality of switch buttons used to check switching; a COM express system electrically connected to the debug card and comprising a COM express board and electronic components thereon wherein the COM express board is provided with modular components and at least a bus. As such, it is able to identify messages for a CPU-bearing COM express board and a carrier board in the COM express system during debugging, streamlining the procedure and saving time.

Abstract: A method for integrating low-K materials in semiconductor fabrication. The process begins by providing a semiconductor structure having a dielectric layer thereover, wherein the dielectric layer comprising an organic low-K material. The dielectric layer is patterned to form pillar openings. A pillar layer is deposited over the semiconductor structure; thereby filling the pillar openings with the pillar layer. The pillar layer is planarized to form pillars embedded in said dielectric layer. The pillar layer comprises a material having good thermal stability, good structural strength, and good bondability of spin coating back-end materials, improving the manufacturability of organic, low-K dielectrics in semiconductor fabrication. In one embodiment, the pillars are formed prior to forming dual damascene interlayer contacts. In another embodiment, pillars are formed simultaneously with interlayer contacts.