Patents by Inventor Ming-Hsing Wu

Ming-Hsing Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250105536
    Abstract: A connector and a manufacturing method thereof. The connector includes at least one circuit substrate, at least one contact and a first elastic body. The at least one circuit substrate has a first surface. The at least one contact includes a fixed part and a first contact part that are connected to each other. The fixed part is disposed on the at least one circuit substrate. The first contact part protrudes out of the first surface and covers a part of the first surface. The first elastic body is disposed on the first surface and is electrically insulated. At least a part of the first elastic body is located between the first contact part and the first surface.
    Type: Application
    Filed: March 14, 2024
    Publication date: March 27, 2025
    Applicant: UNIMICRON TECHNOLOGY CORP.
    Inventors: Ra-Min TAIN, Chunhsien CHIEN, Ching-Ho HSIEH, Ming-Hsing WU
  • Patent number: 12184005
    Abstract: A connector includes a substrate, a coverlay and a spring contact. The substrate has a first surface, a second surface opposite to the first surface and a conductive through hole extending between the first and second surfaces. The coverlay is disposed on the first surface and includes a first opening. The spring contact includes an anchor member, a rising member and a pin. The anchor member is disposed between the substrate and the coverlay. The rising member extends from the anchor member and through the first opening in a direction away from the substrate. A first portion of the rising member is in the first opening, and a second portion of the rising member is out of the first opening. The pin extends from the anchor member to an inside of the conductive through hole, and is electrically connected to the conductive through hole.
    Type: Grant
    Filed: April 28, 2022
    Date of Patent: December 31, 2024
    Assignee: Unimicron Technology Corp.
    Inventors: Ching-Ho Hsieh, Ming-Hsing Wu, Keui-Sheng Wu
  • Patent number: 12101881
    Abstract: A circuit board assembly is provided and includes a first circuit board, a second circuit board and a first connecting module. The first connecting module includes a first connecting wire, a first connector and a second connector. The first circuit board includes a first processor, and the second circuit board includes a second processor. One end of the first connector is connected to one end of the first connecting wire, and the other end of the first connector is connected to the first circuit board. One end of the second connector is connected to the other end of the first connecting wire, and the other end of the second connector is connected to the second circuit board. The first connector is adjacent to the first processor, and the second connector is adjacent to the second processor.
    Type: Grant
    Filed: August 25, 2023
    Date of Patent: September 24, 2024
    Assignee: Unimicron Technology Corporation
    Inventors: Ching-Ho Hsieh, Ming-Hsing Wu, Kuei-Sheng Wu
  • Publication number: 20230413441
    Abstract: A circuit board assembly is provided and includes a first circuit board, a second circuit board and a first connecting module. The first connecting module includes a first connecting wire, a first connector and a second connector. The first circuit board includes a first processor, and the second circuit board includes a second processor. One end of the first connector is connected to one end of the first connecting wire, and the other end of the first connector is connected to the first circuit board. One end of the second connector is connected to the other end of the first connecting wire, and the other end of the second connector is connected to the second circuit board. The first connector is adjacent to the first processor, and the second connector is adjacent to the second processor.
    Type: Application
    Filed: August 25, 2023
    Publication date: December 21, 2023
    Inventors: CHING-HO HSIEH, MING-HSING WU, KUEI-SHENG WU
  • Patent number: 11825604
    Abstract: A circuit board assembly is provided and includes a first circuit board, a second circuit board and a first connecting module. The first connecting module includes a first connecting wire, a first connector and a second connector. The first circuit board includes a first processor, and the second circuit board includes a second processor. One end of the first connector is connected to one end of the first connecting wire, and the other end of the first connector is connected to the first circuit board. One end of the second connector is connected to the other end of the first connecting wire, and the other end of the second connector is connected to the second circuit board. The first connector is adjacent to the first processor, and the second connector is adjacent to the second processor.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: November 21, 2023
    Assignee: Unimicron Technology Corporation
    Inventors: Ching-Ho Hsieh, Ming-Hsing Wu, Kuei-Sheng Wu
  • Publication number: 20230291139
    Abstract: A connector includes a substrate, a coverlay and a spring contact. The substrate has a first surface, a second surface opposite to the first surface and a conductive through hole extending between the first and second surfaces. The coverlay is disposed on the first surface and includes a first opening. The spring contact includes an anchor member, a rising member and a pin. The anchor member is disposed between the substrate and the coverlay. The rising member extends from the anchor member and through the first opening in a direction away from the substrate. A first portion of the rising member is in the first opening, and a second portion of the rising member is out of the first opening. The pin extends from the anchor member to an inside of the conductive through hole, and is electrically connected to the conductive through hole.
    Type: Application
    Filed: April 28, 2022
    Publication date: September 14, 2023
    Inventors: Ching-Ho HSIEH, Ming-Hsing WU, Keui-Sheng WU
  • Publication number: 20230123068
    Abstract: A circuit board assembly is provided and includes a first circuit board, a second circuit board and a first connecting module. The first connecting module includes a first connecting wire, a first connector and a second connector. The first circuit board includes a first processor, and the second circuit board includes a second processor. One end of the first connector is connected to one end of the first connecting wire, and the other end of the first connector is connected to the first circuit board. One end of the second connector is connected to the other end of the first connecting wire, and the other end of the second connector is connected to the second circuit board. The first connector is adjacent to the first processor, and the second connector is adjacent to the second processor.
    Type: Application
    Filed: November 18, 2021
    Publication date: April 20, 2023
    Inventors: Ching-Ho Hsieh, Ming-Hsing Wu, Kuei-Sheng Wu
  • Patent number: 10952325
    Abstract: A printed circuit board (PCB) stack structure and method of forming the same are provided. The printed circuit board stack structure includes a first PCB, a second PCB and a connector. The first PCB includes a first pad. The second PCB includes a second pad. The connector has an annular structure, located between the first PCB and the second PCB and electrically connecting the first PCB to the second PCB. The connector includes a substrate, a first conductive elastic piece and a second conductive elastic piece. The substrate has a first surface and a second surface opposite to each other. The first conductive elastic piece is located on the first surface and in electrical contact with the first pad. The second conductive elastic piece is located on the second surface and in electrical contact with the second pad.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: March 16, 2021
    Assignee: Unimicron Technology Corp.
    Inventors: Ching-Ho Hsieh, Ming-Hsing Wu, Shang-Wei Chen
  • Publication number: 20200329562
    Abstract: A printed circuit board (PCB) stack structure and method of forming the same are provided. The printed circuit board stack structure includes a first PCB, a second PCB and a connector. The first PCB includes a first pad. The second PCB includes a second pad. The connector has an annular structure, located between the first PCB and the second PCB and electrically connecting the first PCB to the second PCB. The connector includes a substrate, a first conductive elastic piece and a second conductive elastic piece. The substrate has a first surface and a second surface opposite to each other. The first conductive elastic piece is located on the first surface and in electrical contact with the first pad. The second conductive elastic piece is located on the second surface and in electrical contact with the second pad.
    Type: Application
    Filed: June 25, 2019
    Publication date: October 15, 2020
    Applicant: Unimicron Technology Corp.
    Inventors: Ching-Ho Hsieh, Ming-Hsing Wu, Shang-Wei Chen
  • Publication number: 20160380372
    Abstract: A novel interconnection structure and method of manufacture is provided which provides an improved means of interconnecting external connector interfaces, such as Universal Serial Bus (USB) connectors, to the internal system boards of electronic devices, such as laptop computers, tablets, and mobile phones. An external connector interface used for interconnecting separate electronic devices is connected to the internal system board of the device in which it resides by being interconnected mechanically and electrically, or alternatively being integral to and of a unitary structure with, a printed circuit substrate, said printed circuit substrate having a plurality of conductive, elastic spring contacts mounted on one surface, with at least one of said electrical spring contacts electrically interconnected to the external electrical connections of the USB connector, and said electrical spring contacts providing an electrical interconnection means to a system board inside the electronic device.
    Type: Application
    Filed: June 24, 2016
    Publication date: December 29, 2016
    Inventors: Ching-Ho Hsieh, Bohdan P. Wozniak, David L. Chen, Chih-Peng Fan, Ming-Hsing Wu
  • Patent number: D969745
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: November 15, 2022
    Assignee: Unimicron Technology Corp.
    Inventors: Ching-Ho Hsieh, Ming-Hsing Wu, Shang-Wei Chen, Kuei-Sheng Wu